At a glance
| Booth | S7007 |
| Country | TW |
| Product categories | Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Molding; Encapsulation; Potting; Resin Materials · Packages; Plastic · Solder; Solder Balls and other Soldering Materials · Ingots, Wafers · Consumables · CMP; Grind; Lap; Polish; Abrasive materials · Ingots · Epitaxial; Epi; Gettered; Internal Gettered Wafers · Prime; Polished; Mirrored Wafers · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · Test; Monitor Wafers; Reclaim or Virgin |
| Website | www.ka-jeng.com.tw |
Company profile
KA-JENG Co., Ltd. was established in 2014 with the corporate philosophy of professionalism, integrity, responsibility, and service. We provide services to our customers and offer our employees a growth and stable working environment; Specializing in the sales of various semiconductor production/testing Wafers, Glass wafer, Glass substrates, Epoxy(Glue) for active/passive IC packaging, Flip Chip high-end packaging products(Under fill), Flux, Solder paste, Wafer saw blade, QFN/BGA/LED/Ceramic/Glass and other finished saw blade and Dressing boards, UV adhesives, High-thermal adhesives, Conductive/Non-conductive adhesives, wafer saw tape & Package saw tape, Optical communication, Precision electronic products and Micro mechanical products (such as VCM); Obtained ISO 9001 certification in 2021; We are your reliable and excellent supplier, looking forward to serving you
Capabilities and products
- UV adhesives and high-thermal adhesives
- conductive and non-conductive adhesives
- epoxy glue for active and passive IC packaging
- flip-chip underfill materials
- flux and solder paste
- glass wafers and glass substrates
- semiconductor production and testing wafers
- wafer saw blades and package saw tape
Related product topics
- Semiconductor Adhesives and Epoxies
- Conductive and Non-Conductive Bonding Adhesives
- Die Attach Compounds
- UV Dicing and Grinding Tape
- Flip-Chip Underfill Materials
- Solder Flux and Paste
- Solder Paste and Powder
- Dummy, Test And Control Wafers
- Test-Grade Silicon Wafers
- Glass Wafers and Substrates
- Diamond Dicing Blades & Saws