At a glance
| Booth | S7007 |
| Country | TW |
| Website | www.ka-jeng.com.tw |
Company profile
KA-JENG Co., Ltd was established in 2014 with the corporate philosophy of professionalism, integrity, responsibility, and service, and it states that it aims to serve customers while providing employees with a stable environment for growth. The company's core commercial scope is the sale of semiconductor and optoelectronic packaging materials, together with wafers, glass-related substrates, cutting products, adhesives, tapes, optical-communication products, precision electronics, and micromechanical products. Its semiconductor and optoelectronic materials business includes semiconductor production/testing Wafers, Glass wafer, Glass substrates, Epoxy(Glue) for active/passive IC packaging, and Flip Chip high-end packaging products identified as Under fill. The company reports that it obtained ISO 9001 certification in 2021, and its company history records the introduction of ISO9001 international quality certification in the same year. A 2017 milestone records the introduction of electroplating-wastewater and organic-waste-liquid treatment, integrating dedicated equipment and technology to help customers address waste-liquid treatment problems. A 2022 milestone records the introduction of a cleaving blade for passive components, LED, and Sic chips. Its service and product navigation also identifies TMF filtration modules, contract processing services, semiconductor-material sales, heavy-metal and high-organic-waste-liquid filtration, laser drilling contract processing, metal surface activators, PVA cleaning rollers or brushes, and grinding or cutting tapes.
Exhibits
The supply range includes semiconductor production/testing Wafers, Glass wafer, and Glass substrates for semiconductor-related production and testing needs. For IC packaging, KA-JENG Co., Ltd supplies Epoxy(Glue) for active/passive IC packaging and Flip Chip high-end packaging products identified as Under fill. The listed packaging and assembly materials also include Flux and Solder paste, expanding the supply range beyond wafer and substrate products. Cutting-related products include Wafer saw blade, finished saw blades for QFN/BGA/LED/Ceramic/Glass applications, and Dressing boards. Adhesive products include UV adhesives, High-thermal adhesives, and both Conductive and Non-conductive adhesives, while the product lineup additionally names conductive/non-conductive adhesive and UV sealing adhesive. Tape products include wafer saw tape and Package saw tape, and the product lineup also includes grinding and cutting tape. The broader product scope includes optical communication, precision electronic products, and micromechanical products such as VCM. The product lineup identifies finished cutting blades, wafers including 12inch Prime Grade Wafer, TMF tubular filtration membranes, dressing boards, cleaving blades, metal surface activators, and PVA cleaning rollers or brushes. The cleaving-blade activity is specifically linked to passive components, LED, and Sic chips, providing a stated application context for that cutting product. The company also lists heavy-metal and high-organic-waste-liquid filtration and TMF filtration modules, reflecting the waste-liquid treatment capability introduced in its 2017 company history. Laser drilling is listed as a contract-processing service rather than only as a stocked material or component, adding a processing-service category to the company's semiconductor-material sales activity. Across these offerings, KA-JENG Co., Ltd combines supply of semiconductor and optoelectronic packaging materials with production/testing wafers, glass wafers and substrates, packaging adhesives, soldering materials, saw and cleaving tools, tapes, filtration products, and selected contract-processing services.
Capabilities and products
- semiconductor production/testing wafer supply
- Glass wafer and Glass substrate supply
- Epoxy adhesives for IC packaging
- Flip Chip Under fill packaging materials
- Flux and Solder Paste supply
- wafer and package saw blades
- UV/high-thermal/conductive/non-conductive adhesives
- wafer and package saw tapes
- TMF filtration modules
- laser drilling contract processing
- PVA cleaning rollers and brushes