At a glance
| Booth | J2446 |
| Country | TW |
| Website | www.joenlih.com.tw |
Company profile
Joen Lih Machinery Co., Ltd. was established in 1988 and manufactures surface and grinding machines in Taiwan, including precision flat grinding machines, profile grinders, and semiconductor grinding and polishing equipment. With more than thirty years of refinement in grinding-machine technology, the company states that it has accumulated experience and technology used to help customers identify suitable grinding solutions. Its equipment serves medical, semiconductor, aerospace, automotive-component, and metal-processing-material industries. The company emphasizes stability and precision, offers a broad range of specifications, and supports customization for specific functions and customer applications. The company describes one-stop solutions as a major strength, combining needs evaluation, expert recommendations, equipment introduction, technology development, and trial-sample services to help customers start production and verify that produced workpieces meet their standards. Its primary sales markets are Asia, Europe, and the Americas, and it states plans to strengthen technology, brand recognition, and after-sales service while expanding international markets. The company states a direction toward automation, intelligence, precision, higher product quality, added value, and sustainable business operations. Its business philosophy includes continuous creation and innovation, development of advanced technology and services, quality improvement, stronger international competitiveness, and increased international market share. The company obtained TTQS Talent Development Quality Management System Certification in 2023 and also states that it passed Dun & Bradstreet corporate certification and Talent Quality Management System Certification (Enterprise Version). The Da Ya II Plant commenced operations in 2022, following the Da Ya Plant beginning production in 2010, the Da Feng Plant beginning production in 2000, and the 1995 relocation to the Tanzi Plant for expanded production. Product milestones include introduction of a double-sided grinding and polishing machine in 2021 and launch of the vertical CNC surface grinder JL-100VG in 2020. In 2019 the company introduced both the specialized linear-motor grinding machine JL-52CNC-LM and the Smart CNC Grinder JL-2550CNC. Earlier milestones include technical cooperation in OEM production with an Italian company in 2014 and with a Japanese company in 1996. In 2008 the company introduced a double-column CNC grinder with 7 awarded patents, and in 2007 it introduced an 8-inch Ceramic Processing Machine described as Taiwan's first-ever wafer processing machine. The company introduced a dedicated grinding machine for linear guides and slide blocks in 2004, received TUV ISO-9001 Quality Accreditation in 2001, and developed CNC surface grinding machines in 1998. In 1988 the Shengang Plant began mass production of flat grinding machines in the same year Joen Lih Machinery Co., Ltd. was established. Its Taiwan-language company presentation also emphasizes customized products, diverse optional packages, one-stop solutions, professional after-sales support, CNC profile surface grinders, specialized profile grinders, vertical grinders, and semiconductor wafer grinding and polishing machines. The company provides domestic after-sales service through on-site repairs or return-to-factory maintenance, while international after-sales support is provided by professional overseas distributors. The company states that its tailored metal-processing equipment includes Linear Blocks Grinding Machine, Wafer Grinding Machine, and Precision Surface Grinding Machine categories and that it provides customized solutions for needs ranging from small to large-scale operations.
Exhibits
For semiconductor and solar processing, the company lists high-precision wafer grinding machines JL-200SCG and JL-300SCG together with wafer double-sided polishing and lapping equipment. Its highlighted product categories also include Wafer Surface Grinding Machine, Micro-grooving Machine, High Precision CNC Profile Grinding Machine, and High Precision Surface Grinding Machine. The semiconductor grinding and polishing range is designed around surface flatness and surface precision, with monitoring and control systems used to support product consistency and quality. These semiconductor machines are described as capable of micron-level wafer-surface processing and of handling semiconductors, metals, non-metals, aluminum, stainless steel, ceramics, and other materials. Advanced control systems are used to provide operator usability while supporting consistent processing quality, and partial equipment customization is available according to customer requirements. The semiconductor product family includes the JL-D16 Semiconductor Double-sided Grinding and Polishing Machine, JL-200SCG / JL-300SCGII Vertical Semiconductor Grinding Machine, and JL-S12 Single-Sided Lapping and Polishing Machine. JL-S12 is described as using CMP, chemical mechanical polishing, rather than traditional lapping to reduce the wafer surface in single-sided lapping and polishing applications. For silicon-wafer material processing, a standard wafer-thinning process uses a vertical grinding machine to thin one side to the customer-required thickness and then a double-sided polishing machine with suitable polishing pads and fluid to produce a mirrored finish on both sides. The vertical grinding-machine configuration uses constant-radius grinding to optimize wafer-grinding flatness and speed and can be supplied with PLC or CNC control systems. Automatic cleaning and automatic loading and unloading are listed for the vertical grinding process. The double-sided polishing machine can be driven by four-axis or three-axis servo motors, can use PLC or CNC controls, and controls polishing pressure with load cells. Online thickness detection is listed, and customization options include a customized PLC interface, multi-stage grinding and polishing recipes, customized automatic cleaning and loading or unloading, and customized online monitoring. The JL-D16 double-sided grinding machine is designed for non-metallic and hard materials and is suitable for silicon wafers, quartz, silicon carbide, glass, sapphire, ceramic substrates, aluminum, stainless steel, and mechanical seals. JL-D16 performs double-sided grinding or polishing of flat workpieces and is specified for a minimum processing thickness of 0.4 mm. Its planetary lapping mechanism is designed for lapping performance and surface finish, while five planetary carriers can hold multiple workpieces during processing. JL-D16 uses a PLC controller with optional touchscreen and offers optional automatic thickness control. The machine has a 1127mm lapping-plate diameter, Ø 370mm carrier diameter, 5 SETS of carriers, processing quantities of 15 pieces for 6-inch wafers and 5 pieces each for 8-inch and 12-inch wafers, and a lapping-plate speed of 20 ~ 60 R.P.M. Its listed pressure range is 10 ~ 300 KG, maximum lapping thickness is 40 mm, minimum lapping thickness is 0.4 mm, and power source is 3Ø 220V (3Ø 380V). The JL-52CNC-H is a hydraulically driven CNC precision surface grinding machine with a 200 x 400 mm working surface, intended for flat grinding, automotive templates, precision molds, and smaller workpieces. Its hydraulic operating mode is described as preventing threads on the workpiece surface and achieving strong Ra performance for surface smoothness and precision. The longitudinal worktable uses a dual V-guide design, low-friction wear-resistant Turcite-B sliding surfaces, and precision scraping to reduce vibration and support smooth movement. An intelligent electrical control system follows preset contouring and dressing parameters, uses a user-friendly interface, records key data, and supports subsequent process optimization. JL-52CNC-H includes an advanced on-machine measurement system for automated operation, uses two-axis contouring and dressing with servo motors, and is presented as a compact design for limited workspace. Key JL-52CNC-H specifications include 230 x 560 mm maximum table travel, 250 kgs maximum table load including chuck, spindle speeds of 3600 rpm at 60Hz and 2900 rpm at 50Hz, and a grinding wheel size of Ø180 x 13 x Ø31.75 mm. Its longitudinal table speed is 3 ~ 20 m/min, vertical stroke is 285 mm, cross stroke is 230 mm, and the least input increment is 0.001 mm for both vertical and cross movement. The JL-100VG CNC Double Column High Precision Vertical Rotary Grinder is designed specifically for internal grinding and uses high-grade cast iron for structural stability during prolonged use. JL-100VG uses digital control for automated operation through panel graphics and offers an optional automatic tool-changing system. Its X-axis uses precision linear guide rails while the Z-axis uses steel rails, combining precise motion control with a structure intended to withstand larger machining forces and pressures. The hydrostatic rotary table includes oil-temperature and pressure control and is designed so the worktable does not contact bearings, avoiding noise and temperature-rise or deformation issues. A double-column high-grade cast-iron structure supports stability under prolonged high-load operation, and a fully enclosed splash guard addresses dust, chips, coolant, and other machining hazards. Standard JL-100VG accessories include a built-in wheel spindle, ring gauge, wheel dresser, and hydrostatic rotary table, while optional accessories include an online measuring device and automatic tool changer. Its internal-grinding applications include elongated cylindrical workpieces with internal holes, internal circles, and internal tapers, and demonstrations also cover external-diameter grinding, internal-diameter grinding, auto dressing, gauge calibration, and auto measurement. The JL-100VG rotary table diameter is Ø 1050 mm, the listed inner workpiece diameter range is Ø 50 ~ Ø 950 mm, outer workpiece diameter is up to Ø 1250 mm, and maximum table load is 1200 KG. Its X-axis stroke is 1800 mm with 24 m/min movement speed and 0.0001 least input increment, while the Z-axis stroke is 700 mm with 12 m/min movement speed and 0.0001 mm least input increment. The listed head inclination is 22.5°, the built-in spindle motor is 20 KW, the X-axis servo motor is 4.5 KW, the Z-axis servo motor is 5.5 KW, and the rotary-table servo motor is 11 KW. The optional ATC is specified for 6 tools of HSKA100 type, and the machine is listed at 17640 KG net weight with dimensions of 4400 x 5700 x 4000 mm. Across these product families, the company combines wafer thinning, double-sided grinding and polishing, single-sided CMP, profile grinding, precision surface grinding, linear-block grinding, and vertical rotary grinding with customized options and after-sales service.
Capabilities and products
- CNC surface and profile grinding machines
- dedicated grinding machines for linear guides and slide blocks
- vertical wafer thinning grinders
- semiconductor double-sided grinding and polishing machines
- single-sided CMP lapping and polishing machines
- micro-grooving machines
- CNC double-column vertical rotary grinders
- internal and external diameter grinding with vertical grinders
- grinding-machine trial machining and prototyping
- on-site grinding-machine repair and factory-return maintenance
- customized recipe control for grinding and polishing equipment
- customized automatic cleaning and loading/unloading for grinding and polishing equipment
- customized online monitoring for grinding and polishing
- in-line thickness detection for polishing equipment
- automatic tool changing and on-machine measurement for grinders