At a glance
| Booth | N0176 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Ball Placement; Attach Systems · Base Loader Systems · Cleaning; Washing Equipment for Assembly & Packaging · Cut & Down Set; Trim; Form Equipment · Device Handling; Feeding Systems · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Molding; Encapsulation; Decapsulation Equipment · Package Handling; Conveying Equipment · Solder Reflow; Soldering & Brazing Equipment · Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating · Lamination; Sheet Laminating Equipment · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Linear Test Systems · Logic Test Systems · Memory Test Systems · Optical Test Systems · Package Test Systems · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Package Substrates; Laminate; Film based · Alignment Film Materials · Conveying; Material Handling Systems |
| Website | www.jipal.com |
Company profile
Welcome to Jipal, Jipal Corporation was established in 1990. Under the visionary leadership, Jipal distributes various types of cutting-edge Semiconductor Packaging and Testing, PCBA related equipments and materials. With expertise and multiple service locations throughout Asia, Jipal delivers customer satisfaction service excellence through custom-fit recommendations and comprehensive post-sales support. Over 35 years of cultivation and hard work, Jipal continues to expand our localized presence. In addition to location in Taiwan – Hsinchu (HQ), Taichung and Kaohsiung, Jipal also localize in 17 China cities and Hong Kong, as well as Singapore (SEA Head office), Malaysia, Thailand, Vietnam and India. Jipal proudly works with a cohesive team of employees average more than 20 years of service. We are providing customer-centric recommendations and services that capture the hearts of our principals and clients alike. We aim to provide a total solution, integrating comprehensive supplies to customers and ready to face challenges with opportunity. As well as being dedicated as a contributor to the semiconductor industry by creating synergy through collaboration. Our Principals – Aurigin Technology AIMECHATEC Capable Corporation Centrotherm Emage Group Fasford Technology Furukawa Electric Genesem Inc Hitachi High-Tech (TOHKEN) Hover Davis ITW EAE KLA Corporation Kinergy Corporation Kobayashi KINIK Company NIPPON KAYAKU Okamoto Machine Tool Works Orion Systems Integration Process Automation International Limited Teikoku Taping System United BC Team XinSheng Semiconductor Technology Jipal always back you up!! Website： www.jipal.com E-mail： [email protected]
Capabilities and products
- PCBA equipment and materials
- attach systems
- backgrind equipment
- ball placement systems
- base loader systems
- cleaning and washing equipment for assembly and packaging
- lapping and polishing equipment
- semiconductor packaging equipment
- semiconductor testing equipment
- slicing equipment
Related product topics
- SMT Production Equipment
- Base Loader Systems
- Lapping and Polishing Equipment
- Semiconductor Packaging Equipment
- Die Attach Equipment
- Lid and Component Attach Systems
- Solder Ball Placement Systems
- Semiconductor Test Equipment
- Cleaning and Washing Equipment for Assembly and Packaging
- Assembly and Packaging Cleaning Equipment
- Assembly & Packaging Cleaning Equipment
- Wafer Backgrind Equipment
- Wafer Slicing Equipment