At a glance
| Booth | R8224 |
| Country | TW |
| Website | www.jettech.com.tw |
Company profile
JET TECHNOLOGY CO., LTD. was founded in 1988 and states that it was the first manufacturer in Taiwan to develop an In-Circuit Tester for circuit boards, helping the information industry address mass-production quality control. For more than 30 years, the company has focused on 100% quality control for SMT production lines. Its inspection lineup includes high-precision 3D solder-paste inspection machines for solder-paste printing quality, pre-reflow 2D AOI for component Placement correctness, and post-reflow 3D AOI for soldering quality. After DIP insertion and soldering, its dynamic in-circuit tester (ICT/ATE) uses electrical testing to check the assembly quality and correctness of each electronic component for complex precision circuit-board production lines. In 2016, the company designed the JET 7500TBII dual-side visual inspection machine to inspect both sides of PCBA products for DIP soldering defects, reversed polarity, wrong parts, missing parts, damage, and other defects. The JET 7500TBII is a final pre-shipment inspection machine adopted by major global EMS manufacturers and is described as becoming standard equipment on highly automated production lines. To respond to customer demand for high automation and smart manufacturing, the company says it will invest more manpower to build systems for production-data collection, analysis, feedback, and adjustment. The company identifies its ability to provide a complete line of inspection equipment as an advantage and says the production-data system is intended to help customers achieve smart manufacturing and improve competitiveness.
Exhibits
The listed product range includes 3D AOI optical inspection machines, 3D SPI solder-paste inspection machines, dual-side AOI final inspection machines, the JET 3000 in-circuit tester, the 9000V vacuum circuit-board tester, and 3D dual-side AOI inspection machines. The JET 7500TBII dual-side AOI is designed as a final inspection solution for SMT and DIP production lines and uses two optical heads to inspect the top and bottom sides of a PC board in one machine. It is described as detecting component defects including missing parts, damage, collision, reversed polarity, wrong parts, and offset, together with soldering defects including unsoldered joints, shorts, pin-out defects, wrapped solder, and solder holes. The dual-side final inspection process is described as saving test time and space, reducing manpower, supporting standardization and digitalization, enabling trace-back of inspection production histories, reducing inspection-related component collisions, and reducing errors caused by fatigue in manual visual inspection. Manufacturers using the JET 7500BTBII as a final inspection solution are described as reducing final-inspection manpower, significantly improving the yield of shipped products, and achieving higher customer satisfaction. The system retains complete inspection data, including a large image of every product, to provide a trace-back mechanism, and the company states that six leading contract manufacturers have adopted the system and continue to purchase additional units. The JET 7700 Resolute UF addresses a frontal-camera blind spot for adhesive height, is described as improving height-measurement accuracy even when adhesive overflows, and detects IC boundaries even with overflow. Its block-height algorithm measures adhesive climbing height and allows each block to be configured with five height-measurement methods. In response to Industry 4.0 trends and future smart-factory requirements, the company says it is carrying out forward-looking R&D projects in inspection equipment. The company also lists global service locations.
Capabilities and products
- 3D AOI optical inspection machines
- 3D SPI solder-paste inspection machines
- dual-side AOI final inspection machines
- in-circuit testers for circuit boards
- vacuum circuit-board testers
- 3D dual-side AOI inspection machines