At a glance
| Booth | N0362 |
| Country | TW |
| Website | www.chunson.com |
Company profile
JC's Chunson Limited specializes in semiconductor and photovoltaics machines and measurement instruments, and its Chinese company description also covers equipment and instruments serving IC, LED, semiconductor, and solar-industry manufacturing and inspection needs. In China and Taiwan, JC's Chunson Limited represents G&N for Solar Brick Grinder and Wafer Grinder products. The company represents E+H for PV and SEMI Wafer Thickness, Warp Gauge, and Non-Contact Resistivity Gauge products, covering wafer thickness, warpage, and non-contact resistivity measurement. For Hologenix, JC's Chunson Limited represents Magic Mirror and Wafer Edge Defect Detection System products, adding surface and edge-defect inspection to its represented equipment range. JC's Chunson Limited describes its role as introducing overseas manufacturing equipment and inspection instruments and handling local sales, installation, and technical support. It states that it represents equipment manufacturers from Europe and the United States in order to support the IC, LED, semiconductor, and solar industries in improving manufacturing-equipment capability and inspection accuracy. JC's Chunson Limited states that its goal is to provide service and support to customers.
Exhibits
The product range presented by JC's Chunson Limited includes AST-CDO CD & Overlay Metrology System, AST-IR Workstation NIR/SWIR Metrology & Inspection Workstation, AST-MWIR Workstation Mid-Wave Infrared Inspection & Analysis System, AST-Zentura Zentura Wafer-Level Metrology System, and AST-WDI Wafer & Die Inspection System. The same range lists AST-IR Automated Automated NIR/SWIR Metrology & Inspection System, AST-MEMS Workstation MEMS Inspection Workstation, AST-MEMS Automated Automated MEMS Inspection System, AST-MWIR Benchtop Mid-Wave Infrared Inspection & Analysis Benchtop S, and AST-VCSEL VCSEL Optical Aperture Metrology System. Inspection and defect-detection offerings also include Crystal Slip Defect Detection (SlipFinder), Global Nanoscope, and Hologenix Defect Detection on Ultra-Flat Wafers (Magic Mirror™). The listed E+H portfolio additionally includes MX 301-AC, MX 604-ST, MX 3012-AC, MX 203-6-41-q, MX 152/153, MX 1012, MX 1018, MX 204-8-49-q, Waferstudio, Belt Sorters, Robot Sorters, and related D-Surface View and DipView offerings. Additional named catalog items include VISION 200/300-M, while the same product listing repeatedly identifies AST inspection and metrology systems for wafer, die, MEMS, infrared, overlay, and VCSEL applications. The listed G&N equipment includes RCplus, MPS 2 R300 CV, ECO 500, T501 evo, MPS R400 CV, MPS R400 CV TWIN, and E200 Eco, alongside other represented grinding and handling equipment in the product catalog. Waferstudio is software for wafer and chip manufacturers, the solar industry, and reclaimers that provides customizable visualization and data analysis across the production process and convenient merging of measurement results from multiple applications. It is designed to create production-chain overview and insight for efficiency, yield, and quality, with analysis functions intended for process optimization and individual measurement-analysis tasks. Waferstudio provides seven interpolation methods, compared with a maximum of two in most software solutions described by the company, and E+H's pykophylatic interpolation is specifically adapted to wafer-production requirements. Its normalized and customizable full-rainbow color scale supports intuitive height estimation, while the Silhouette function uses strong contrast so deformation can be recognized at a glance and the substrate can be viewed realistically. Waferstudio's shading technology is intended to make even small defects visible by using the human eye's sensitivity to topographical differences, and its light effects support intuitive perception of surface texture. For submicron geometry measurement, Waferstudio can map individual Site TIR measurements according to user needs, and Site TIR can be more relevant than Global TIR for this type of measurement. Its 2D cross-section function is intended for cases where dimples and defects need to be determined more precisely, and its local-standard-deviation function supports quick and easy determination of standard deviations. Waferstudio also includes a measurement-comparison feature for process control, providing a comparison overview even when the measurement results come from different tools and different measurement methods. The G&N RCplus precision surface grinding machine is intended especially for hard, brittle, and difficult-to-process materials such as SiC, GaN, SiN, and Al2O3, including silicon and compound-semiconductor and wafer-reclaim applications. RCplus handles pucks and wafers up to 450mm in diameter and is described for small to medium volumes, with automatic compensation of grinding-wheel wear, high-precision automatic fine feed, and a small footprint.
Capabilities and products
- Solar Brick Grinder and Wafer Grinder representation (G&N)
- wafer thickness/warp/non-contact resistivity gauge representation (E+H)
- wafer surface and edge defect inspection system representation (Hologenix)
- semiconductor process data visualization and analysis software supply (Waferstudio)