At a glance
| Booth | N0362 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Line Width; Critical Dimension (CD) Measurement · Overlay Measurement · Resistivity Measurement; 4 point probe; Sheet resistance · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Inspection and Metrology · Sales; Manufacturers Representation or Distributors |
| Website | www.chunson.com |
Company profile
JC’s Chunson Limited was established at Taipei in 1997. We are specialized in the semiconductor and photovoltaics machines and measurement instrument. We represent in China and Taiwan for G&N - Solar Brick Grinder, Wafer Grinder; E+H - PV and SEMI Wafer Thickness, Warp Gauge, Non-Contact Resistivity Gauge; Hologenix - Magic Mirror, Wafer Edge Defect Detection System. Our goal is to provide the best-quality service and support to our customers. Please feel free to contact us at website: www.chunson.com
Exhibits
Waferstudio delivers at-a-glance solutions to the biggest challenges facing all participants in the semiconductor industry today (wafer and chip manufacturers, the solar industry, and reclaimers): customizable, visualization and data analysis of the entire production process, convenient merging of measurement results from multiple applications. Waferstudio develops the overview, insight and opens up new perspectives from this. For your production chain, efficiency and yield and quality. Especially in one of the most demanding segments of modern industry, Waferstudio delivers some crucial competitive advantages: 。7 different interpolation methods: The interpolation method decides how realistically the visualization depicts the previous process step. And thus allows to optimize the process. Therefore, Waferstudio offers seven different interpolation methods (most software solutions offer a maximum of 2). The pykophylatic interpolation developed by E+H is specially adapted to the requirements of wafer production. The normalized and customizable full rainbow color scale allows intuitive estimation of height. 。Silhouette: Strong contrasts allow deformations to be recognized at first glance and give a realistic image of the substrate. 。Shading technology: Through shading, the human eye is accustomed to detecting topographical differences in a minimum of time. Our shading technology has therefore been developed to make even the smallest defects visible. You want software that not only processes data, but also enables solutions for complex challenges? We developed Waferstudio specifically for optimizing your processes, and so the analysis functions can be used for a variety of individual tasks. Among many others, these are for example: 。Site TIR (Total Indicator Reading): The Site TIR value can be more relevant than the Global TIR value for submicron geometry measurement. Waferstudio maps individual Site TIR measurements according to your needs. 。2D cut function: If, for example, dimples and defects need to be determined more precisely, Waferstudio’s 2D cross-section function is suitable for this purpose. 。Measure Local Standard Deviation: This function makes it possible to quickly and easily determine standard deviations.
Capabilities and products
- E+H PV and SEMI wafer thickness gauges
- E+H non-contact resistivity gauges
- E+H wafer warp gauges
- G&N solar brick grinders
- G&N wafer grinders
- Hologenix Magic Mirror wafer inspection
- Hologenix wafer edge defect detection system
- Waferstudio merging of measurement results from multiple applications
- Waferstudio production-process visualization and data analysis
- Waferstudio pykophylatic interpolation for wafer production