At a glance
| Booth | R7324, S7852 |
| Country | MY |
| Website | www.inventec.dehon.com |
Company profile
INVENTEC Performance Chemicals is a global provider of soldering, cleaning, coating and cooling materials for electronic, semiconductor and industrial applications. For more than 60 years, the company states that health impact, sustainability and reliability have been placed at the core of product development. Its ISO 9001 and ISO 14001 production sites are located in France, Switzerland, USA, Mexico, Malaysia and China, forming the manufacturing base used to support a smooth and cost-effective supply chain. Although it supplies many industries, INVENTEC Performance Chemicals highlights automotive, aerospace, semiconductor, energy and medical applications where high reliability is required.
Exhibits
INVENTEC Performance Chemicals develops semiconductor soldering solutions for Die Attach, Ball Attach for CSP and BGA, Flip Chip, Wafer Bumping, PoP and SiP processes, with reliable soldering positioned as essential to robust interconnections between dies, substrates and PCBs and to device reliability, thermal management and overall performance. For Ball Attach, the company provides materials for attaching solder balls to substrates, wafers or PCBs in integrated-circuit and microelectronics manufacturing, including ECOFREC TF48 no-clean tacky flux for Flip Chip, spheres soldering and component rework, ECOFREC TF49 halogen-free tacky flux for Flip Chip and rework, and ECOFREC POP 50 no-clean tacky flux for the PoP process. Die Attach solutions include ECOREL HT 301T Pb93,5Sn5Ag1,5 leaded solder paste for a no-clean printing process with low voids and high reliability, ECOREL FREE 305-31A SAC305 solder paste for no-clean SMT printing with excellent low voiding for DCB, and ECOREL FREE 300-31A Sn96.5Ag3.5 lead-free solder paste with the same no-clean SMT and low-voiding DCB positioning. For Flip Chip and CSP applications, the offering includes ECOFREC POP WS30 water-soluble tacky flux for PoP and Flip Chip with excellent wetting properties, ECOFREC TF49 with low-residue properties, and ECOFREC TF48 with excellent printing and high viscosity for Flip Chip, sphere soldering and component rework. PoP Assembly solutions use products including ECOFREC POP WS30, ECOFREC TF48 and ECOFREC POP 50 to support precise alignment and reliable soldering of stacked components, while the process is described as enabling space-efficient integration and stable electrical performance in compact electronic devices. For System-in-Package, or SiP, INVENTEC Performance Chemicals provides soldering solutions for integrating multiple components or integrated circuits into a compact package, with reliability, durability, performance and miniaturization identified as key requirements of the assembly. Package Assembly is supported by silver sintering materials including ECOREL SINTEC AP90 AG Sintering Paste for Low Pressure Sintering by Printing, ECOREL SINTEC AP90D AG Sintering Paste for Low Pressure Sintering by Flat Bed Dispensing, and ECOREL SINTEC XP95 AG Sintering Paste for Pressureless Sintering by Printing. The package-assembly offering also includes ECOFREC TF49, a halogen-free tacky flux for Flip Chip and rework soldering with low-residue properties and suitability for lead-free and leaded applications. The company states that its semiconductor soldering solutions are suitable for both lead-free and traditional SnPb processes and are designed around high precision, thermal stability and reliability requirements, including RoHS compliance where applicable. For Flip Chip and Wafer Bumping, the solutions are described as providing low voiding, precise deposition and consistent reflow for mechanical and electrical reliability, while Die Attach development considers adhesion, thermal conductivity, electrical conductivity and compatibility with semiconductor materials. Flux formulation is treated as a key factor for oxide removal, wetting, void reduction and minimal residue, while semiconductor solder pastes use controlled alloy composition, flux formulation and particle size to optimize wettability, void reduction and thermal performance for sensitive components. The semiconductor solutions cover applications in automotive electronics, aerospace and defense, and medical devices, including electric and hybrid vehicle power electronics, battery-management systems and vehicle-control units; avionics, radar and satellite components; and imaging sensors, diagnostic systems and patient-monitoring devices. INVENTEC Performance Chemicals provides a worldwide dedicated Technical Support team with online or onsite support for selecting products, assisting product qualification, guiding initial process setup at worldwide manufacturing facilities and responding to technical issues that can occur during mass production. It also provides technical support, process development and customized soldering formulations for Die Attach, Ball Attach, Flip Chip, Wafer Bumping, PoP and SiP process optimization with reliability and yield objectives. For cleaning or coating after soldering, the company offers free-of-charge cleaning and coating trials in its Technical Centers and provides a comprehensive technical report with test results and recommendations for the process and process parameters. Storage and handling guidance calls for a cool, dry and controlled environment to maintain viscosity, flux activity and particle stability, linking material handling conditions to consistent semiconductor-assembly performance.
Capabilities and products
- semiconductor Die Attach soldering materials
- CSP/BGA Ball Attach soldering materials
- Flip Chip soldering materials
- Wafer Bumping soldering materials
- PoP soldering materials
- SiP soldering materials
- AG sintering paste
- cleaning materials for electronics and semiconductors
- coating materials for electronics and semiconductors
- cooling materials for electronics and semiconductors