At a glance
| Booth | X0003 |
| Country | GB |
| Website | www.idtechex.com |
Company profile
IDTechEx provides trusted independent research on emerging technologies and their markets to companies across the value chain, helping them make essential strategic business decisions. Its business and technology experts bring a global perspective to technology innovation, with research based on interviews, event attendance and proprietary analysis. Since 1999, IDTechEx has helped clients understand new technologies, their supply chains, market requirements, opportunities and forecasts. IDTechEx was established in 1999 and is headquartered in Cambridge, UK; it operates globally, has served customers in over 80 countries, and has subsidiary companies in the USA, Germany and Japan. The company has served over 35,000 customers globally, ranging from large corporations and ambitious start-ups to Governments and research centers, with customers using its work to make informed decisions and save time and resources. IDTechEx research is produced by in-house technical analysts who each hold a PhD or master's degree in their specialist field and are employees of the company. Its analysts directly interview and profile companies across the supply chain, engaging with senior management and technology development executives to obtain insights that may otherwise be inaccessible. As a global team, the analysts travel extensively to industry events and companies for in-depth face-to-face interviews, engage with industry associations, follow public company filings, conduct patent analysis, and track regulatory changes and incentives. IDTechEx assesses emerging technologies against existing solutions, evaluates market demand and creates data-driven forecasts from its models to provide an outlook on the future of the technologies and industries it covers. Forecasting can draw on historic data from its own product databases, company sales data, associations and company reports, as well as current and announced manufacturing capacities, company production targets and direct input from interviewed companies about growth expectations. Other forecast inputs can include planned or active government incentives and regulations, technology capability and price benchmarks versus competing solutions, teardown data, the total addressable market and an s-curve methodology where appropriate, with key assumptions and factors that can affect a forecast discussed in the report. The in-house analysts build expertise by immersing themselves in industries over many years and engaging directly with key industry players, then appraise technologies against competitive solutions and assess market demand using voice-of-the-customer feedback from an impartial point of view. Each report provides an independent, expert-led technical and market appraisal designed to give customers actionable information without requiring them to conduct the same market research themselves. A report purchase includes up to 30 minutes with an expert analyst to help connect report findings to the purchaser's business issues, to be used within three months of purchase. An IDTechEx subscription can include additional reports, access to an online information platform with continuously updated information from analysts, and direct analyst access. Customer feedback presented by IDTechEx includes organizations such as Freudenberg Technology Innovation and Marquardt, and the company states that its research business has grown year-on-year.
Exhibits
IDTechEx offers research covering Sustainable Electronics and Semiconductor Manufacturing, Materials and Processing for Advanced Semiconductor Packaging, and Thermal Management for Advanced Semiconductor Packaging. Its listed research topics also include Low-Loss Materials for 5G/6G, Radar, and High-Speed Digital; Materials for Electric Vehicle Battery Cells and Packs; Battery Storage for Data Centers, Commercial & Industrial Applications; Silicon Anode Battery Technologies and Markets; Semiconductors for Autonomous and Electric Vehicles; and Green Hydrogen Production & Electrolyzer Market. Additional listed titles cover Antiviral and Antimicrobial Technology Market, Chemical Recycling and Dissolution of Plastics, and Bioplastics 2026-2036: Technology, Market, Players, and Forecasts. The bioplastics research includes biobased PLA, PET, PEF, polyesters, polyolefins, polyamides, polyurethanes, PHAs and polysaccharides for packaging, automotive, textiles, agriculture, consumer goods, 3D printing, bio-composites and other circular-economy applications. Its advanced semiconductor packaging research covers heterogeneous integration, AI, HPC, data centers, semiconductor packaging market forecasts, antenna in package, 2.5D and 3D packaging, Fan-Out, FOWLP, FOPLP, Through-Si-Via, glass packaging, co-packaged optics, RDL and hybrid bonding. The advanced-packaging report traces the evolution from traditional 1D PCB designs to wafer-level 3D hybrid bonding, describing interconnect pitches in the single-digit micrometer range and bandwidths up to 1000 GB/s while maintaining high energy efficiency. It explains 2.5D packaging as positioning components side by side on an interposer and 3D packaging as vertically stacking active dies, with both technologies addressed as important for future HPC systems. For 2.5D packaging, the research compares silicon, organic and glass interposers: silicon supports the finest routing features but has material, manufacturing-cost and packaging-area constraints, while localized silicon bridges use silicon where fine features are needed and can address area limitations. Organic interposers using fan-out molding compound are presented as a more cost-effective alternative with a lower dielectric constant that reduces RC delay, although their interconnect features are harder to reduce to the level achieved by silicon-based packages. Glass interposers are analyzed for tunable coefficient of thermal expansion, high dimensional stability, smooth and flat surfaces and compatibility with panel manufacturing, together with challenges from an immature ecosystem, limited large-scale production capability and technical issues. For 3D packaging, the report examines Cu-Cu bumpless hybrid bonding, in which dielectric material such as SiO2 is combined with embedded Cu to form permanent interconnections; it describes pitches below 10 micrometers, typically in the single-digit micrometer range, compared with conventional microbump pitches of around 40-50 micrometers. The stated hybrid-bonding benefits include increased I/O, higher bandwidth, improved 3D vertical stacking, better power efficiency, and reduced parasitics and thermal resistance due to the absence of underfill, while the process is also described as complex and higher cost to manufacture. The research also covers panel-level packaging as a way to enable larger interposers and reduce cost by producing more packages simultaneously, while identifying warpage management as a remaining challenge. Hybrid bonding is discussed in high-end server products including AMD EPYC for stacking SRAM and CPUs and the MI300 series for stacking CPU/GPU tiles on I/O tiles, as well as for future HBM development beyond 16-Hi or 20-Hi DRAM stacks. Co-packaged optics is covered as an approach to increase I/O bandwidth and reduce energy consumption, with optical communication offering lower signal degradation over distance, less susceptibility to crosstalk and higher bandwidth than traditional electrical transmission for data-intensive HPC systems. The report addresses HPC as a primary market for 2.5D and 3D packaging and also examines 5G and 6G antenna-in-package and RAN architectures, autonomous vehicles that integrate sensor suites and computing units, and consumer electronics including smartphones, smartwatches, AR/VR devices, PCs and workstations. Its scope includes interposer-material roadmaps and benchmarks, applications, players and manufacturing barriers, along with company analysis of solutions, clientele, applications and technology roadmaps, case studies, supply-chain dynamics and business models. For this advanced-packaging study, historic data starts in 2022, the forecast period is 2024-2035, forecast units are millions and the covered region is worldwide; the page also lists 530 slides, forecasts to 2035 and a 25% CAGR forecast for advanced semiconductor packaging growth in HPC sectors. A separate materials-and-processing study analyzes 2.5D interposer materials including silicon, organic and glass, and notes that Fan-Out Panel Level Packaging can improve area utilization and lower costs by up to 60% for organic-interposer approaches. For next-generation 2.5D interposer materials, the study identifies dielectric constant, elongation to failure, coefficient of thermal expansion, Young's modulus and moisture absorption as five key criteria, and discusses the trade-off between lower modulus for stress reduction in designs with sub-5 µm vias and higher modulus for package stability. The same study compares Wafer-to-Wafer and Die-to-Wafer hybrid bonding: W2W bonds full wafers in a uniform step and can be optimized for high throughput, while D2W bonds individual dies to a target wafer and supports integration of different die sizes and functions for chiplet packaging. Its D2W analysis covers requirements for ultra-clean particle-free surfaces and precise alignment, along with challenges from die aspect ratios, flexible organic carriers or adhesives used during dicing, and sensitivity to queue times that can degrade the surface before bonding. The materials-and-processing report examines 2.5D process flows and dielectrics for RDL and microvia structures, including inorganic materials such as Si and glass and organic materials, as well as RDL fabrication techniques and material choices for Epoxy Molded Compounds and Mold Under Fill. It also covers Cu-Cu hybrid-bonding manufacturing and bonding equipment for 3D die stacking, provides material-selection guidance, and presents case studies using both organic and inorganic dielectrics. The study includes a 10-year forecast for the Organic Dielectric Advanced Semiconductor Packaging Module with projections in units and area; its metrics list historic data for 2022-2023, a forecast period of 2024-2035, units of volume and mm2, and worldwide coverage.
Capabilities and products
- independent emerging-technology and market research
- technology supply-chain and market forecasting research
- advanced semiconductor packaging market research
- 2.5D/3D packaging research
- Cu-Cu hybrid bonding research
- Si/organic/glass interposer research
- panel-level packaging research
- Co-Packaged Optics research
- advanced semiconductor packaging materials and processing research
- bioplastics market research
- chemical recycling and dissolution of plastics research