At a glance
| Booth | M0957 |
| Country | TW |
| Product categories | Assembly · Technical Intelligence; Reverse Engineering |
| Website | www.icometrue.com |
Company profile
iCometrue develops Logic Drive and Field Programmable MultiChip Package (FPMCP) concepts for advanced multi-chip packaging. Its work includes FPGA chiplets fabricated by sub-10 nm process technologies, NVM for FPGA configuration and re-configuration data storage, non-volatile Logic Drive, Through-Glass-Via (TGV) connectors, and Ultra-Thin Vapor Chamber (UTVC) thermal solutions.
Capabilities and products
- Application Specific Multi-Chip Package (ASMCP) conversion through FPGA configuration
- FPGA chiplets fabricated by sub-10 nm advanced process technologies
- Field Programmable MultiChip Package (FPMCP)
- Logic Drive multi-chip package for FPGA chiplets and NVM
- NVM chip for FPGA configuration and re-configuration data storage
- TGV connectors in glass-substrate multi-chip packages
- miniaturized micro heat pipe