At a glance
| Booth | N0762 |
| Country | TW |
| Website | www.hpc.com.tw |
Company profile
Hypersonic, Inc. was founded in 1987 and provides semiconductor solutions specializing in semiconductor packaging, testing, MEMS, photonics, and automation technologies. The company supplies equipment, materials, and process-integration solutions intended to support customers throughout the semiconductor manufacturing value chain. With nearly four decades of industry experience, Hypersonic states that it has established sales and technical-support networks across Taiwan and China. It serves more than 200 active customers across semiconductor manufacturing, IC design, packaging and testing, photonics, and electronics industries. Its advanced packaging and testing portfolio is expanding in response to the growth of AI, HPC, HBM, CoWoS, and CPO technologies. The portfolio includes process equipment, specialty materials, inspection systems, and customized automation platforms. In addition to representing technology partners, Hypersonic develops proprietary IC sorting systems, dispensing and printing solutions, lid attach systems, heat spreader attach equipment, automated handling systems, and intelligent inspection platforms. These proprietary-development activities explicitly cover IC sorting, dispensing and printing, lid attach, heat-spreader attach, automated handling, and intelligent inspection. The company states a mission of Your Trusted Gateway to the Best Semiconductor Solutions and describes continued work to advance packaging and testing technologies while creating long-term value for customers and industry partners worldwide.
Exhibits
SPEA flying probe testers provide high throughput and fault coverage without fixtures. Automated CAD-based programming is used for fast setup, and 30 µm probes are specified for safely contacting small test points. The listed SPEA flying-probe models support production, NPI, prototypes, and diverse electronics. The SPEA DOT800T Power Semiconductor Test System combines ISO, AC, and DC power testing in one modular system. DOT800T supports Silicon, GaN, and SiC devices from wafer through final test. It provides dynamic, static, and isolation tests in a high-throughput platform intended for mass production. Another described semiconductor-process solution enables precise surface inspection for wafers and advanced packaging with automated contact-angle measurement. For advanced DRAM packaging, the described system features 4-strip printing at up to 300 strips/hr, ±25μm alignment, and fully automated dispensing. Together, the exhibited testing, surface-inspection, printing, alignment, and dispensing capabilities connect to Hypersonic’s broader advanced-packaging and semiconductor-testing process-integration work.
Capabilities and products
- IC sorting system development
- dispensing and printing solution development
- lid attach system development
- heat spreader attach equipment development
- automated handling system development
- intelligent inspection platform development
- flying probe tester supply (SPEA)
- power semiconductor test system supply (SPEA)
- wafer and advanced packaging surface inspection equipment supply
- 4-strip printing equipment supply for advanced DRAM packaging