At a glance
| Booth | N0762 |
| Country | TW |
| Product categories | Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Printing Equipment; Screen-printing; Alignment ; Film Printing · Lamination; Sheet Laminating Equipment · Vision; ID; Bar Code Systems · Package Inspection; Lead Scanners · Wire Bonding Inspection; Test · X-ray; XRF; 3-D X-Ray; LEXES Systems · Functional Test Systems · Handlers; Positioner Systems · Linear Test Systems · Logic Test Systems · Optical Test Systems · Package Test Systems · System on a Chip (SOC); Mixed Signal Test Systems · Test Head Manipulators and Docking Stations · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Molding; Encapsulation; Potting; Resin Materials · Thermal Interface Materials; Heat Sinks · Cleaning Chemicals; Solvents; Strippers · Surface protection material; coatings · CMP; Grind; Lap; Polish; Abrasive materials · Plasma; Ion Sources · Test Sockets; Contactors and Contact accessories |
| Website | www.hpc.com.tw |
Company profile
Leading Integrated Solutions for Advanced Packaging and Semiconductor Testing Founded in 1987, Hypersonic Inc. is a leading semiconductor solutions provider specializing in semiconductor packaging, testing, MEMS, photonics, and automation technologies. The company delivers comprehensive equipment, materials, and process integration solutions to support customers throughout the semiconductor manufacturing value chain. With nearly four decades of industry experience, Hypersonic has established extensive sales and technical support networks across Taiwan and China, serving more than 200 active customers in semiconductor manufacturing, IC design, packaging and testing, photonics, and electronics industries. Driven by the rapid growth of AI, HPC, HBM, CoWoS, and CPO technologies, Hypersonic continues to expand its portfolio of advanced packaging and testing solutions, including process equipment, specialty materials, inspection systems, and customized automation platforms. In addition to representing world-class technology partners, Hypersonic actively develops proprietary equipment such as IC sorting systems, dispensing and printing solutions, lid attach systems, heat spreader attach equipment, automated handling systems, and intelligent inspection platforms. Guided by its mission, “Your Trusted Gateway to the Best Semiconductor Solutions,” Hypersonic remains committed to advancing packaging and testing technologies while creating long-term value for customers and industry partners worldwide.
Capabilities and products
- IC sorting systems
- advanced packaging solutions for AI, HPC, HBM, CoWoS and CPO
- automated handling systems
- dispensing and printing solutions
- heat spreader attach equipment
- intelligent inspection platforms
- lid attach systems
- semiconductor packaging solutions
- semiconductor testing solutions
Related product topics
- Semiconductor Automation Equipment
- Device Handling & Feeding Systems
- Semiconductor Packaging Equipment
- Precision Fluid Dispensing Systems
- Thermocompression and Flip-Chip Bonders
- Lid and Component Attach Systems
- SMT Screen Printers and Stencils
- Semiconductor Packaging Inspection Systems
- AI-Powered Inspection
- Semiconductor Test Equipment
- IC Sorting Systems