At a glance
| Booth | Q5252 |
| Country | TW |
| Website | www.hta.com.tw |
Company profile
Horng Terng Automation Co., Ltd. was established in 1994 and states the management principles of Top Quality, Steady Growth, and Sustainable Development. The company built its foundation in semiconductor equipment and subsequently expanded into high-end advanced packaging equipment manufacturing focused on chip thermal-management and energy-efficiency challenges. To respond to customer requirements for smart manufacturing, Horng Terng Automation Co., Ltd. develops smart AOI visual-inspection technology and AI-driven intelligent production equipment for process automation, production efficiency, and product quality. The company states that its advanced-technology development has made it an important R&D partner for leading global manufacturers and established a significant position in semiconductor equipment R&D and manufacturing. In 2020, Horng Terng Automation Co., Ltd. received the National Award of Outstanding SMEs, an award the company connects with sustained investment of a high proportion of resources in R&D. Its in-house development scope spans product materials, processes, electrical control, software, mechanisms, vision, and optics, combining software and hardware R&D capabilities. The company states that this internal R&D work has produced multiple patented technologies and highlights more than 100 advanced-semiconductor patents. Horng Terng Automation Co., Ltd. uses modular technology and project-management systems to support product quality and production efficiency while retaining flexibility in project execution. For customer development requirements, the company provides project-based customized engineering solutions supported by its modular technology and project-management approach. The company states that it successfully entered the stock market in 2024, marking a new phase of growth and development. Its awards and recognition include the National Award of Outstanding SMEs, Taiwan Mittelstand Award, and Rising Star Award. The company states that it has been chosen by Top 5 Global IC Test & Assembly Providers and describes itself as a trusted partner of leading global enterprises. Horng Terng Automation Co., Ltd. also describes sustainability activities in Taiwan that include support for vulnerable groups, employee family days, waste reduction, and low-carbon operations.
Exhibits
Horng Terng Automation Co., Ltd. presents advanced packaging solutions aimed at thermal management and energy efficiency for computing chips. The company states that its thermal equipment has the highest usage rate among the top 5 global semiconductor packaging and testing companies and holds more than 80% market share. Its thermal-process offering includes precision dispensing and spraying with micro glue amounts for new process materials, larger products, and more specialized product applications. The company states that these precision dispensing and spraying capabilities can be combined with full process integration for advanced manufacturing applications. Horng Terng Automation Co., Ltd. also presents innovative AOI visual-inspection technology for process automation and for improvement of production efficiency and product quality. Its self-developed 3D vision modules support multi-angle and stereoscopic vision inspection, providing a named visual-inspection capability within the automation portfolio. Solution categories include Main Process Solutions, Visual Solutions, Open & Short Testing Solutions, and customization & automation. Across these categories, the company's stated supply capabilities include high-end advanced packaging equipment manufacturing, smart AOI visual inspection, AI intelligent production equipment, customized equipment development and design, equipment-integration applications, precision micro-dispensing and spraying, and 3D multi-angle stereoscopic vision inspection. The company frames its semiconductor technology work as supporting advanced processes and AI-chip performance enhancement, while its thermal equipment and visual-inspection technologies connect packaging-process control with automation and inspection. This exhibition-oriented supply range therefore combines thermal process equipment for semiconductor packaging, micro-volume dispensing and spraying, full-process integration, AOI inspection, 3D vision, and custom automation for semiconductor manufacturing requirements.
Capabilities and products
- high-end advanced packaging equipment manufacturing
- precision micro-volume dispensing and spraying
- smart AOI visual inspection
- 3D multi-angle stereoscopic vision inspection
- AI intelligent production equipment
- custom equipment development, design and integration
- Open & Short electrical test solutions