At a glance
| Booth | Q5839 |
| Country | TW |
| Product categories | Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment · Materials, Nanotechnology · CMP; Grind; Lap; Polish; Abrasive materials · Deposition Supplies · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates |
| Website | honwaygroup.com/en |
Company profile
Honway Materials Co., Ltd. is a premier specialist in advanced grinding and polishing technologies for the semiconductor industry. We provide a comprehensive portfolio of high-performance consumables, including precision CMP Slurries, Wafer Grinding Wheels, and Diamond Substrates. Beyond material supply, Honway is a dedicated Total Solution Provider. We integrate material expertise with technical support to optimize surface planarization and thinning processes. Our solutions are critical for advanced logic ICs and compound semiconductors (SiC/GaN), helping clients achieve nanometer-scale precision, enhance yield, and reduce the Total Cost of Ownership (TCO) in modern wafer fabrication.
Capabilities and products
- SiC/GaN compound semiconductor polishing solutions
- diamond substrates
- precision CMP slurries
- surface planarization process optimization
- wafer grinding wheels