At a glance
| Booth | Q5839 |
| Country | TW |
| Website | honwaygroup.com/en |
Company profile
HonWay Materials Co., Ltd. specializes in advanced grinding and polishing technologies for the semiconductor industry and supplies high-performance consumables for wafer-surface processing. Beyond material supply, the company describes itself as a Total Solution Provider that combines material expertise with technical support for semiconductor surface-processing requirements. Its technical-support scope includes optimization of surface planarization and wafer thinning processes, connecting consumable selection with process performance. HonWay Materials Co., Ltd. states that its solutions serve advanced logic ICs and compound semiconductors including SiC and GaN. The company associates these grinding, polishing, planarization, and thinning solutions with nanometer-scale precision, yield improvement, and reduction of Total Cost of Ownership (TCO) in modern wafer fabrication. Its Total Solution Provider approach combines grinding and polishing expertise with material knowledge and technical support for both silicon-based and compound-semiconductor manufacturing.
Exhibits
The semiconductor offering includes high-performance Diamond Slurries for demanding semiconductor applications and precision polishing work. Diamond Substrates are engineered for advanced thermal management in high-power semiconductor devices, while Diamond Wafer Grinding Wheels are engineered for high-precision wafer thinning and back-grinding. HonWay Materials Co., Ltd. also supplies critical elemental materials for compound semiconductors, including Gallium (Ga), Arsenic (As), Cadmium (Cd), Antimony (Sb), and various Rare Earth Elements. Semiconductor products include Boron-Doped Diamond, Chamfering and Grinding Wheels for Silicon Wafers, Diamond Substrate/Diamond Wafer, and Grinding Wheels for Wafer Surface Grinding. The semiconductor range also includes HWD25 Wafer Eletroplated Dicing Blade, HWES25 Wafer Packaging Dicing Blade - Soft Blade, and HWS25 Wafer Packaging Dicing Blade - Hard Blade. The diamond polishing liquid is produced by dispersing abrasive particles in a medium to provide chemical-mechanical properties and is used for grinding and precision polishing of silicon wafers, compound crystals, optical devices, LCD panels, gemstones, and metal workpieces. The Polishing and Grinding Solution Series includes Monocrystalline Diamond Solution (MDS), Polycrystalline Diamond Solution (PDS), and Nanodiamond Solution (NDS). Monocrystalline Diamond Solution is described as providing good cutting effects and being suitable for grinding and polishing hard materials. Polycrystalline Diamond Solution is described as combining toughness and self-sharpening characteristics to achieve high grinding force without easily scratching surfaces, with suitability for precision metal materials. Nanodiamond Solution is described as having excellent dispersion stability for ultra-precision polishing applications. Monocrystalline Diamond Micropowder is made from high-quality synthetic monocrystalline diamonds through crushing, shaping, purification, grading, and post-treatment and is described as a superhard abrasive and polishing material with high hardness, strength, toughness, thermal conductivity, thermal stability, and impact resistance. Its general monocrystalline micropowder specifications span 0-0.5 (0.25um), 0-1 (0.5um), 0-2 (1um), 1-3 (2um), 2-4 (3um), 4-6 (5um), 6-12 (8um), 8-16 (10um), 10-20 (15um), 15-25 (20um), 20-30 (25um), 20-40 (30um), 35-45 (40um), 55-65 (50um), and 50-60 (55um), with customization available to customer requirements. Polycrystalline Diamond Micropowder is described as a new abrasive material produced from high-quality diamonds through a unique process. Polycrystalline Diamond Powder general specifications are 0-2 (1um), 1-3 (2um), 2-4 (3um), 3-5 (4um), 4-6 (5um), 4-8 (6um), 6-8 (7um), 7-9 (8um), 8-10 (9um), 9-11 (10um), and 10-12 (11um), and the specifications can be customized. Nanodiamonds are produced by converting free carbon generated during detonation of oxygen-balanced explosives under controlled pressure and temperature conditions into 5-20 nanometer crystalline diamond particles. The nanodiamond particles are described as near-spherical with surfaces rich in functional groups, with specific surface area an order of magnitude higher than regular diamond products while retaining synthetic-diamond hardness and grinding characteristics together with nanomaterial properties. Listed nanodiamond specifications are 50nm, 80nm, 100nm, 120nm, 150nm, 200nm, 300nm, 500nm, 800nm, and 1000nm, with customization available to customer requirements. Cerium Oxide Polishing Liquid is described as having good particle suspension and low scratching tendency and is used for optical glass, mobile-phone glass, hard-disk substrates, LCD displays, optical lenses, fiber-optic connectors, microcrystalline-glass substrates, crystal surfaces, and related precision-polishing applications. The cerium-oxide line is available as high-purity cerium oxide in a white milky liquid and as cerium-lanthanum-praseodymium in a brown-red liquid, with multiple series and specifications and customizable grit size. Silica Polishing Liquid is composed of high-purity silica particles and is described as preventing scratches on workpiece surfaces. Silica Polishing Liquid is suitable for silicon wafers, sapphire wafers, compound-semiconductor wafers, precision optical components, ceramics, and stone, with particle size, solid content, distribution, and custom formulas varied for specific polishing requirements. Alumina Polishing Liquid is described as having good suspension, high purity, and fine particle size to help prevent scratching on object surfaces. Its listed alumina-polishing applications include optical crystals, electronic glass, LCD glass, magnetic heads, sapphire, crystals, semiconductor polishing, and precision polishing of hard materials such as metal, ceramics, and glass. Custom alumina-polishing formulas based on particle size, solid content, and other factors are available for specific customer polishing requirements. Across the polishing-liquid and diamond-material families, the company supports semiconductor wafer grinding, precision polishing, wafer thinning, back-grinding, dicing, compound-semiconductor material supply, and high-power-device thermal-management applications.
Capabilities and products
- semiconductor CMP slurry supply
- wafer grinding wheel supply
- diamond substrate supply for high-power semiconductors
- diamond wafer grinding wheels for thinning and back-grinding
- Ga/As/Cd/Sb elemental material supply for compound semiconductors
- wafer and packaging dicing blade supply
- monocrystalline diamond polishing solution
- polycrystalline diamond polishing solution
- nanodiamond polishing material supply
- cerium oxide polishing liquid supply
- silica polishing liquid supply
- alumina polishing liquid supply