At a glance
| Booth | K2046 |
| Country | JP |
| Website | www.ser.co.jp |
Company profile
Hirose SER Inc. was established in 1984 and was acquired by Hirose Electric in 2025. The company describes itself as a global leading supplier of semiconductor test products and provides a wide range of probe and test-socket applications. Its semiconductor-test solutions address challenging requirements including 224G high-speed devices and 80GHz high-frequency devices. Hirose SER Inc. was established on July 31, 1984 with capital of 50,000,000 yen, and its business includes the import, export, and sales of electronic components as well as engineering development, production, and sales of electronic components. The company operates a Tokyo head office and an Osaka office, and its group company MORIOKA HIROSE SER Inc. has operations in Morioka and at the Kunohe Factory in Iwate. Hirose SER Inc. maintains quality and environmental policies centered on meeting customer requests, improving product quality, meeting delivery commitments, strengthening customer trust, increasing customer satisfaction, and continually improving its quality and environmental management systems. The same policies include environmentally conscious product design and development, reduction of environmental impact, prevention of pollution, compliance with domestic and international regulations and agreements, and meeting the expectations and requirements of society. Hirose SER Inc. establishes quality and environmental goals, reviews the results of its actions, and uses those reviews to continually improve the effectiveness of its quality and environmental management systems. The company lists ISO14001 and ISO9001 certificates as part of its quality and environmental management framework.
Exhibits
The SER mm interposer is designed for low-profile, multi-channel high-speed signal transmission and can replace a general coaxial connector to contribute to equipment miniaturization. Its intended applications include RF signal connections for Massive MIMO technology, array-antenna module connections, and multi-channel millimeter-wave connections between boards. The number of RF signal channels and the interposer shape can be customized, allowing the mm interposer configuration to be adapted to different connection layouts. A 0.9mm probe length keeps the interposer extremely short, supporting superior signal integrity and high-frequency transmission. Two base-material approaches are offered: an engineering-plastic base with a non-coaxial structure and impedance matching, and a metal base intended to reduce crosstalk between channels. The mm Wave Interposer uses a solderless compression mount and lists bandwidth to approximately 70GHz, with measurement data showing DC to 70GHz. Hirose SER Inc. supplies spring probe pins for testing semiconductors, electronic components, and product PCBs, and maintains quality through in-house production at domestic group companies from parts processing through assembly. The spring-probe portfolio combines an extensive standard lineup with custom-made products and includes Standard Probe Pin, Super Short Probe, Kelvin Contact, Fine Pitch Probe, Scrub Contact, Non-Magnetic Probe, Thermocouple Probe, and Stamping Probe types. Semiconductor test solutions use the company's own spring-probe technology and cover test applications and contact technology for wafer test, final test, and system-level test in mass production. For high-frequency semiconductor testing, the listed applications include an LSI high-frequency test coaxial socket, a Multi Impedance Socket, inter-unit high-frequency signal connection, and the mm Wave Interposer. The semiconductor-test lineup also includes burn-in test connections, Crystal and MEMS Device Sockets, probe cards, and probe-card sockets for WLCSP. Socket applications extend to BGA and LGA devices, image sensors, FPGAs, high-speed signal probing, Crystal and MEMS devices, and the YOROI product-board socket. For burn-in and related high-temperature connections, the listed lineup also includes ARDENT Terminate-R, Sullins high-temperature card-edge connectors, and Sullins high-temperature flat-cable connectors. The standard spring probe supports narrow-pitch and multi-pin configurations as a solderless contact for semiconductor, electronic-component, and PCB testing, as well as connector, IC-socket, and board-to-board connector applications. Its standard lineup includes the single-ended movable MS Series and double-ended movable MD Series, with pitches from P=0.15mm, and allows small-lot customization of overall length, outside diameter, tip shape, material, surface treatment, and load according to customer requirements. A low-load probe that maintains contact resistance is also available, and standard probes are built from three or four pieces consisting of plungers, a barrel, and a spring. Custom connectors can use spring probes, round-pin sockets, or leaf springs as contact terminals, with housing shape, terminal count, and terminal pitch customized to customer needs. Connector housings can be selected as molded parts made with dies or custom-machined parts, and product examples include the KTC Series millimeter-wave coaxial cable connector, mm Wave Interposer, Probe Contact, Lens Mount Connector, and round-pin socket. The spring-probe product pages also list ARDENT RC spring contacts, ARDENT ladder contact RC Connect-R, and SCS Socket Cleaning Solution products for IC sockets, extending the offering beyond the company's own standard probe categories.
Capabilities and products
- 224G high-speed and 80GHz high-frequency semiconductor testing
- 70GHz mm-wave interposer
- spring probe pins for semiconductor testing
- wafer, final and system-level mass-production testing
- probe card sockets for WLCSP
- test sockets for BGA/LGA
- custom narrow-pitch spring probes from P=0.15mm
- custom connector design and manufacturing