At a glance
| Booth | L1008 |
| Country | TW |
| Website | www.heraeus-electronics.com |
Company profile
Heraeus Materials Singapore Pte Ltd provides materials for the assembly and packaging of electronic devices as part of the Heraeus Electronics product and solution scope within Heraeus Group. Its materials solutions serve consumer electronics and computing, automotive, LED, power electronics, and communications applications. Core competences include bonding wires, assembly materials, thick-film pastes, substrates, and integration of these materials into matched systems. The company addresses the complexity created by combining substrates, connectors, active and passive components, solders, adhesives, bonding wires, insulation and molding compounds, and housings by providing innovative materials and matched sets or systems. Tailored solutions are supported by prototyping, testing, and qualification together with materials knowledge, systems know-how, testing expertise, and manufacturing-process experience. The matched-material approach is intended to help customers focus on other development work while enabling smaller, more reliable, more eco-friendly, easier-to-manufacture, and more integrated electronic components.
Exhibits
The product and solution portfolio includes conductive and SMT adhesives, bonding wires, Die Top System (DTS®), metal-ceramic substrates, mAgic® sinter materials, solder materials, thick-film materials, and application and testing services with on-site support. Bonding-wire offerings span heavy wires to ribbons, and all wires meet SGS/RoHS requirements, are licensed, and comply with legal requirements including REACH and RoHS. Fine bonding wires include Gold, Silver, Copper, and Aluminium options; Aluminium wires support wedge bonding, copper and coated-copper wires combine reliability and bonding properties with cost savings, Gold wires provide conductivity and corrosion resistance, Gold-Coated Silver wires substitute for gold wires, and Silver wires are offered for sensitive devices. For thick bonding wires, Aluminium Power Bonding Wires support fully automated production in multiple alloys, CuCorAl-Plus combines Aluminium and Copper in one wire, and PowerCU Soft Copper Power Bonding Wires provide long-term reliability and power density. Fine Bonding Ribbons are offered for high-reliability applications with heat dissipation, uniform composition, and customizable designs for ecom, automotive, and optoelectronics; Fine Ribbons with thickness ≤75 µm provide precise power transmission and low inductivity in Gold, Silver, and AlSi materials. Thick ribbons are designed for demanding power-transmission and heat-dissipation applications using a rolling process intended to avoid particles and cut edges, while Aluminium Power Bonding Ribbons emphasize workability and Copper Power Bonding Ribbons provide fine grain structure and softness. mAgic® silver sinter materials provide a lead-free alternative to solder pastes, with up to 10 times higher device lifetime, operation from -55 to 250°C, pure Ag interconnect operation up to 250°C, typical thermal conductivity of 150 W/mK and above, zero-halogen formulation, reduced process steps without flux cleaning or splattering, industrial automation suitability, stencil life over 8 hours, and pressure or non-pressure sintering at variable process temperatures of 200 to 250°C. mAgic® PE338 for pressure die attach can be printed or jetted on Au, Ag, and Cu, supports die sizes up to 15 x 15 mm², processes above 230°C in air or N2 at pressure above 10 MPa or 30 MPa for Cu, and is suitable for SiC, GaN, or IGBT die attach on ceramic substrates. mAgic® PE360 can be printed or dispensed on Au, Ag, and Cu for die sizes larger than 15 x 15 mm², processes above 200°C in air or N2 at pressure above 10 MPa, and is suitable for substrate or power-module attach on baseplates or heatsinks. For non-pressure sintering, mAgic® DA295 and DA295 A are lead-free substitutes for high-melting-point solders and can support semiconductor, lead-frame, and LED package applications; DA295 A is dispensed on Au or Ag above 200°C in air or N2, with needle diameter above 0.2 mm, positive results on die size below 4 mm², and optimization for ENIG PCB surfaces. Die Top System (DTS®) provides more than 50% higher die-current capability and more than 50 times longer lifetime compared with solder die attach and aluminum wire bonding, supports junction temperatures above 200°C, and offers customizable configurations and a fully sintered one-step approach. DTS® combines matched PowerCu Soft bonding materials, a pre-applied Ag-sinter layer compatible with mAgic® pressure-sinter pastes, adaptable outer dimensions, and one-step die and DTS® sintering on standard sinter and die-bonder equipment; applications include wide-bandgap semiconductors, automotive power train H(EV), traction, and power conversion. Condura® metal-ceramic substrates include Aluminium oxide (Al2O3) Direct Copper Bonded substrates Condura®.classic and Condura®.extra, and Silicon nitride (Si3N4) Active Metal Brazed substrates Condura®.prime and Condura®.ultra, including Standard and Ag-free Si3N4 AMB options. Metal-ceramic substrates attach and connect devices such as SiC MOSFETs, Si IGBTs, and Si diodes, using ceramic insulation and copper metallization for electrical and thermal conductivity and heat dissipation under thermal cycling in industrial, automotive, and new-energy applications. Solder materials include solder pastes, wires, and preforms in multiple alloys and packaging formats for high-volume production, supported by vertically integrated solder-powder manufacturing for alloy-purity and particle-size-distribution control; the range includes no-clean and water-soluble pastes, solder wires for components and die attach, and Microbond preforms for module attach. Thick-film materials serve automotive, industrial, military, and consumer-electronics applications across substrates and operating temperatures from below 0°C to 1000°C, with multiple production facilities and application labs around the world and custom thick-film-paste design. PTC4900 Series Self-Regulating Heater Inks provide customizable temperature control for EV battery heaters, ADAS heaters, floor heaters, and cabin-comfort heaters, with a blendable resistor system intended to simplify circuit design, streamline production, reduce lot-to-lot variation, improve yield, and shorten time-to-market. ET2010 Flexible End Termination Ink uses advanced polymer technology, can be shipped, stored, and handled at room temperature, is reworkable, and provides six months of room-temperature stability compared with epoxy-based pastes that require freezing or refrigeration. C5735 is a Pb-, Ni-, and Cd-free gold-conductor paste for Al or Au wire bonding, forms a dense defect-free fired film, supports screen-printed lines and spaces down to 75 µm, and can be etched for features down to 25 µm. The thick-film range also includes conductor, resistor, dielectric, resinate, fuel-cell, and polymer pastes, precious-metal and glass powders, and contract manufacturing from small to large production volumes.
Capabilities and products
- aluminium fine bonding wires
- copper and coated copper fine bonding wires
- gold fine bonding wires
- gold-coated silver fine bonding wires
- silver fine bonding wires
- aluminium thick bonding wires
- copper-core thick bonding wires
- copper thick bonding wires
- fine bonding ribbons with thickness ≤75µm
- aluminium thick bonding ribbons
- copper thick bonding ribbons
- conductive adhesives
- SMT adhesives
- silver pastes for pressure sintering
- sinter pastes for pressureless die attach
- sintered top-side interconnection systems for power dies
- Al2O3 direct copper bonded (DCB) substrates
- Si3N4 active metal brazed (AMB) substrates
- no-clean and water-soluble solder pastes
- solder wires for die attach
- solder preforms for module attach
- solder powder manufacturing
- custom thick-film paste design
- PTC self-regulating heater inks
- reworkable flexible end-termination inks
- thick-film conductor pastes (including gold conductor paste)
- thick-film resistor pastes
- thick-film dielectric pastes
- metal resinate pastes
- fuel-cell pastes
- polymer pastes
- precious-metal powders
- glass powders
- contract manufacturing of thick-film materials
- electronic packaging material-system design
- electronic packaging material prototyping
- electronic packaging material testing
- electronic packaging material qualification