At a glance
| Booth | X0027 |
| Country | TW |
| Website | www.union-diamond.com |
Company profile
HeNan Union precision Material.co.,ltd was established in 2002, with precision superhard abrasives and diamond micron powders as its main products. An American subsidiary was established in 2004, and the company passed an ISO 9000 quality-system certificate in the same year. In 2005, the company successfully developed Nano-diamond, established an explosion factory at Jiaozuo and then started production. In 2007-2008, it successfully developed singlecrystal, polycrystal, nano-diamond and SiO2 slurry and put these materials into operation for the wafer-polishing industry. In 2010, the company established a Taiwan branch and invested in high-level CMP slurries including CeO2 and Al2O3. Its development path therefore spans superhard abrasive powders, nano-diamond and wafer-polishing slurries through to CMP slurry investment and semiconductor-related polishing materials.
Exhibits
The equipment scope includes backgrinding, slicing, lapping and polishing equipment for material-removal and finishing processes. Flat-panel-display equipment includes alignment-film coating equipment and anodic-oxidation equipment, while general-use equipment includes cutting, drilling, laser-ablation and beveling systems. Materials include adhesives, epoxies, die-attach compounds, conductive and non-conductive underfill materials and other specialty chemicals. The polishing-material range includes CMP, grinding, lapping, polishing and abrasive materials, alongside the company's precision superhard abrasives, diamond micron powders, SiO2 slurry, CeO2 CMP slurry and Al2O3 CMP slurry. Process-chamber component materials include graphite, carbon fiber carbon and pyrolytic boron nitride. Quartz and fixture products include silicon carbide, fused quartz glass, sapphire, ceramic fixtures and oxide-ceramic fixtures. Compound-semiconductor substrate categories include GaAs on silicon, GaN, InP and SiGe. Vision-related products include still, CCD and video cameras and monitors, optics and lens products and autofocus systems. Factory-control offerings include factory monitoring and control systems, equipment interfaces and communication protocols. Software categories include manufacturing software, yield-management software and process-control software. Clean-room supplies, cleaning supplies and products for device, wafer and display-panel handling are also included in the supply scope. The supply taxonomy also separates flat-panel-display equipment as category 201, general-use equipment as category 202, materials, chemicals and solids as category 301, factory monitoring and control systems as category 500, and manufacturing software as category 602. This categorization places physical polishing and handling equipment, process materials, chamber and substrate materials, optical inspection hardware, factory controls and manufacturing software within one stated supply spectrum.
Capabilities and products
- precision superhard abrasives
- diamond micron powder
- singlecrystal, polycrystal and nano-diamond
- SiO2 slurry for wafer polishing
- CeO2 CMP slurry
- Al2O3 CMP slurry