At a glance
| Booth | X0027 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Alignment Film Coating Equipment · Anodic Oxidation Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Packages; Plastic · Other Specialty Chemicals · CMP; Grind; Lap; Polish; Abrasive materials · Plating Materials · Process Chamber Components; Graphite; Carbon Fiber Carbon (CFC); Pyrolytic Boron Nitride (PBN) · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Cameras - Still; CCD; Video & Monitors · Optics; Lens Products; Auto-Focus Systems · Equipment Interface; Communication Protocols · Yield Mgmt; Process Control Software · Clean Room Supplies; Cleaning Supplies · Device; Wafer; Display Panel Handling Products · Tools · Other |
| Website | www.union-diamond.com |
Company profile
The United Abrasive Company was established in 2002. The main productions are precision super hardness abrasive and diamond micron powders. In 2004, the American subsidiary was established, in the same year had passed ISO 9000 quality system certificate. In 2005, successfully developed Nano-diamond and set up the explosion factory at Jiaozuo then started production. In, successfully developed singlecrystal, polycrystal, nano-diamond and SiO2 slurry, and successfully put into operation which applied to the wafer polishing industry. In 2010, established Taiwan branch and invested the CeO2, Al2O3 …etc, high level CMP slurries.
Capabilities and products
- Al2O3 high-level CMP slurries
- CeO2 high-level CMP slurries
- SiO2 slurry for wafer polishing
- diamond micron powders
- nano-diamond abrasive materials
- precision super-hard abrasives
- single-crystal and polycrystal diamond slurry materials