At a glance
| Booth | I3228 |
| Country | US |
| Website | hellerindustries.com/semiconductor-advance-packaging |
Company profile
HELLER INDUSTRIES, INC. is a United States-based thermal-processing equipment company serving SMT, electronics assembly, power-device assembly, and semiconductor advanced packaging. Founded in 1960, HELLER INDUSTRIES, INC. pioneered convection reflow soldering in the 1980s and introduced its first full-convection reflow ovens in 1987. The company supplies reflow, fluxless-reflow, and curing-oven technologies to electronics manufacturers and semiconductor advanced packagers worldwide, with standard and special ovens produced through advanced manufacturing and production systems. Customer-responsive development combines an interdisciplinary review of field feedback and custom requests with engineering resources that create solutions for specific process requirements. Quality-assurance processes track field experience worldwide and feed results back to engineering, while factory-floor improvements are documented, communicated, and implemented to support on-time delivery, long-term reliability, and high-yield production. HELLER INDUSTRIES, INC. produces reflow and curing oven systems for six-sigma production environments and trains staff in engineering principles and oven manufacturing across assembly, design, service, and quality assurance. Its oven-development work includes reducing nitrogen consumption and oxygen PPM in inert-atmosphere reflow, filterless removal of flux condensate, field-retrofit nitrogen capability, dual-rail ovens, in-line vertical curing, pressure curing for void-free epoxy and underfill, flux-free formic reflow, and void-free vacuum reflow. The company positions lower operating costs, greater flexibility, reduced maintenance, and higher throughput as process-efficiency benefits of its oven systems. Global support for the installed base includes service depots in the United States, Europe, and Asia, factory-based service engineers, and RMATS remote technical service with worldwide video-link capability and remote access to oven electronics. HELLER INDUSTRIES, INC. also operates a regional-manufacturing and Centers for Excellence model with localized engineering, service, spares, process support, and training.
Exhibits
HELLER INDUSTRIES, INC. offers batch-type and in-line curing ovens in multiple form factors and footprints, with nitrogen, cleanroom, and automation options for stable processing. Its curing range includes horizontal in-line ovens with pallet-size flexibility at high UPH, vertical in-line ovens for reduced footprint and high UPH, pressure-curing ovens or autoclaves for void-free curing, and magazine-curing ovens for magazine-loading applications. For PCB soldering, HELLER INDUSTRIES, INC. offers convection reflow ovens including MK7 and MK5 systems, automation and software, and custom curing or reflow ovens for special heating requirements. Its waterless and filterless flux-separation system won the Vision Award for Innovation in Reflow Soldering and extended convection-reflow maintenance intervals from weeks to months, while low-nitrogen and low-KVA designs target lower ownership cost; the MK7 reflow oven provides lower delta T values, higher energy efficiency, and flux management. Semiconductor advanced-packaging equipment supports bumping, die attach, underfill curing, lid attach, and ball attach, with cleanroom-class and automation options for wafers, wafers on frame, glass panels, and other substrates. For ball attach, convection reflow equipment provides a stable process compatible with cleanrooms, with an installed base covering North America, Korea, Taiwan, and Southeast Asia. For bumping and die attach, standard reflow ovens can serve larger bump pitches, while fine-pitch processes can use formic-acid reflow without applied flux. Vacuum formic acid reflow (VFAR) combines formic-acid reflow with vacuum and is described for fine-pitch bumping with improved bump coplanarity, decreased solder wicking, and reduced solder voiding. Underfill solutions include device-level and board-level curing ovens, pressure-curing ovens with cleanroom and full-automation options for high-volume manufacturing, and vertical curing ovens with a small floor-space requirement for cleanrooms. Pressure-curing ovens apply pressure through the cure cycle to shrink and eliminate underfill voids. For TIM and lid attach, HELLER INDUSTRIES, INC. offers pressure-curing ovens (PCO), pressure-reflow ovens (PRO), and formic-reflow ovens, all presented with void-removal capability. The company handles glass substrates including glass wafers and panels up to 600 mm, and large-panel handling can be integrated into horizontal and vertical oven formats. The broader equipment scope includes SMT reflow ovens, semiconductor advanced-packaging equipment, power-device packaging equipment, consumer-electronics assembly equipment, convection reflow ovens, curing ovens, and fluxless formic-acid reflow ovens. Pressure-curing ovens are specifically offered for semiconductor advanced packaging, and pressure-reflow equipment is part of the TIM and lid-attach solution set. HELLER INDUSTRIES, INC. also lists vacuum formic acid reflow (VFAR) as a semiconductor-packaging process option.
Capabilities and products
- pressure curing ovens for semiconductor advanced packaging
- convection reflow ovens for PCB soldering
- in-line horizontal curing ovens
- in-line vertical curing ovens
- vacuum formic acid reflow (VFAR)
- underfill curing ovens
- pressure and formic reflow for TIM/lid attach
- cleanroom convection reflow for ball attach
- thermal-process handling for glass wafers and panels up to 600mm