At a glance
| Booth | T9024 |
| Country | CN |
| Website | www.image-x.com.cn |
Company profile
Hefei ImagEx Electronics Technology Co., Ltd. was established in April 2009. Hefei ImagEx Electronics Technology Co., Ltd. is a China-based vision-inspection and AOI technology company serving semiconductor, electronics, solar and related manufacturing fields. The company provides inspection products, services and solutions for automated visual quality control in semiconductor packaging and electronic-component production. Its machine-vision portfolio addresses surface inspection, package and component positioning, dimensional verification and three-dimensional lead information across final-test and packaging workflows. The product scope covers both individual inspection functions and automated handling formats such as reel-to-reel, tray-to-tray and strip-product inspection. Its inspection portfolio is organized around semiconductor-package and electronic-component quality control, combining machine vision with automated handling formats so inspection can be applied during final test and packaging rather than as a separate manual step.
Exhibits
The inspection portfolio includes CMOS chip six-side surface inspection for visual checking of chip-package surfaces. Lead-frame AOI is included for automated optical inspection, including surface-defect inspection in lead-frame and related packaging processes. TO package six-side inspection extends visual inspection across all six package surfaces for packaged semiconductor components. Wirebond vision inspection is also part of the machine-vision range for semiconductor packaging operations. Reel-to-reel inspection supports continuous-format component inspection, while tray-to-tray systems support tray-based automated inspection flows. GPP wafer AOI and strip-product AOI add wafer and strip-format automated optical inspection to the product range. Product functions cover final testing and packaging, including cover-tape inspection and checks of package offset and position. Those offset and position functions support chip-package dimensional measurement by checking relative package geometry and placement information. Three-dimensional lead information is part of the inspection function set, supporting 3D measurement of package leads and lead geometry. A 2D Mark/Lead vision system is part of the company's inspection-product range. A Track 3D Lead vision system is also part of the range, adding three-dimensional lead inspection to track-based handling. Together, these systems combine chip-package surface inspection, dimensional and position measurement, 3D lead measurement and AOI surface-defect inspection for semiconductor packaging and electronic-component manufacturing. Cover-tape inspection, offset checking, position checking and 3D lead information complement the surface-inspection systems by adding packaging-condition and geometric information to visual defect detection.
Capabilities and products
- 2D Mark/Lead vision systems
- Track 3D Lead vision systems