At a glance
| Booth | Q5658 |
| Country | KR |
| Website | www.fstc.co.kr/eng |
Company profile
FST (Fine Semitech Corp.) was established in 1987 and succeeded in domesticating the pellicle, a protective cover for photomasks used in semiconductor manufacturing. Since 1988, FST has supplied products to semiconductor businesses in domestic and overseas markets, and it later completed development of a 6th generation LCD pellicle and established a mass-production system. Through continued R&D investment in semiconductor-equipment technology, the company developed chillers intended to improve process efficiency by adjusting semiconductor temperature. FST also launched an optimized EUV Source called EUVO for EUV infrastructure; EUVO is generated by HHG and has been used as a light source in the EUV metrology field. Its stated corporate responsibilities include customer-oriented operation, open and aboveboard operation, and environment-conscious operation. The company also introduces AUROS Technology for wafer inspection and overlay metrology; its Overlay Metrology System uses optical image-based technology to measure overlay between patterns on stacked layers of semiconductor devices.
Exhibits
FST's Pellicle Division develops and manufactures pellicles for IC and FPD manufacturing, where the pellicle protects a photomask during exposure by preventing direct contact with contaminants or particles and thereby supports lower mask contamination, higher yield, and process reliability. The pellicle lineup is designed for multiple exposure wavelengths and is backed by materials engineering, thin-film coating, frame bonding, and contamination-control capabilities used to tailor solutions to customer process requirements. Stated pellicle purposes include preventing photomask contamination and physical damage, improving semiconductor-device yield, extending photomask cleaning cycles and service life, and isolating the mask from contaminants generated during repeated use. The pellicle structure includes a wavelength-optimized membrane with high transmittance, mechanical strength, and thermal stability; a frame designed for thermal-expansion behavior and mechanical rigidity; a membrane adhesive that maintains bonding at high temperature and in vacuum; and, in certain models, mask adhesive for easier attachment and detachment. For semiconductor photomasks, FST lists IC pellicles for ArF Immersion at 193nm, ArF at 193nm, KrF at 248nm, and G&I at 365 & 436nm, while EUV Pellicle is identified as under development. The ArF Immersion material is Perfluoropolymer with 0.28㎛ thickness, transmittance of at least 99.0% at 193nm, 248nm, and 365nm, and transmittance uniformity of at most 0.1%. The ArF pellicle uses Perfluoropolymer at 0.84㎛ with at least 99.0% transmittance at 193nm and uniformity of at most 0.3%, while the KrF version uses Perfluoropolymer at 0.82㎛ with at least 99.0% transmittance at 248nm and 365nm and uniformity of at most 0.4%. The G&I pellicle uses Cellulose & Perfluoropolymer at 1.44㎛ with at least 99.0% transmittance at 365nm and 436nm and transmittance uniformity of at most 0.5%. FST's Temperature Control Unit scope covers thermoelectric, compressor-type, and cryogenic chillers, heat exchangers, and THC temperature-and-humidity controllers across a stated -100℃ ~ +200℃ range. Temperature-control functions include fast response, accurate control from ±0.01 ~ ±0.1℃, load-and-output variable systems, 3Way Valve Control, high-efficiency 'Hiper' TEM & Block, eco-friendly and seismic design, and momentary-power-outage resistance called Power Vaccine. The same TCU business area includes scrubbers for harmful and toxic gases, with chemical adsorption, chemically stable resin, emissions management, energy-saving modes, Low NOx burners, a NOx-free chamber, and powder and byproduct management. The chiller lineup separates Compressor-type Chiller, Heat Exchanger, Thermoelectric Chiller, Cryogenic Chiller, and CO₂ Type products, each with its own reliability, power, temperature-control, and vibration-resistance features. The compressor-type chiller lists Power Vaccine, high-reliability refrigeration components and cycle, an energy-saving refrigeration system stated as 60% less power, and a low-noise low-power circulation system stated as a 50% reduction, together with seismic and vibration-resistance design. The heat exchanger lists Power Vaccine, high-reliability components and sensors, a precision-control 3-Way Valve at ±0.01℃, a low-noise low-power circulation system with 50% reduction, and seismic and vibration resistance. The thermoelectric chiller combines Power Vaccine with ±0.01℃ high-accuracy fast-response temperature control, High Efficiency(Hiper) TEM & Block, an IGBT circuit and non-defective SMPS, and a compact user-friendly structure. The cryogenic chiller is designed for reliability under dew-condensation and freezing conditions, lists 7kW@-70℃ extra-low-temperature capability and a 20 ▶ -80℃, 10min. rapid-cooling and maintaining specification, and includes seismic and vibration-resistance design. The CO₂ chiller uses a low-power circulation system with variable Frequency driver, eco-friendly natural refrigerant with GWP : 1, safety-valve system protection, and a refrigeration cycle containing high-pressure parts of 10 MPa or more up to 14MPa. FST's APS Division develops and commercializes equipment for EUV lithography and states that it has delivered EUV infrastructure tools and inspection systems for next-generation semiconductor manufacturing since 2010. APS R&D covers process control of quantity, temperature, and pressure; EUV pellicle rupture prevention and monitoring; automation; EUV generation by HHG and LPP; table-top-scale footprint; Through Pellicle Inspection; Die to Die Algorithm; and Auto Defect Review & Classification. Its EUV lineup includes EPMD EUV Pellicle Mounter / Demounter, EPIS EUV Pellicle Inspection System, EPODIS EUV Pod Inspection System, and an EUV Source Generation System. EPMD is a fully automated EUV pellicle mounting and demounting system with high-throughput and small-footprint automation, precise control of glue quantity, heat temperature, and pressure, and multiple modules intended to prevent EUV pellicle rupture. EPIS is an incoming and outgoing quality-control inspection system for EUV pellicles and pelliclized masks, with automated pellicle stocking and case handling, inspection of membrane, frame, and mask areas, and Auto Defect Review & Classification. EPODIS measures and inspects complex structured EUV inner Pods, targeting particles, non-plating areas, and plating defects on base and cover plates, and it supports inner-pod parallelism measurement and an N2 Blowing Module for particle removal. The EUV Source is intended for EUV inspection and metrology tools, offers HHG and LPP generation modes, lists excellent coherence and low divergence for HHG, and is applied to Mask Defect Review, EUV Transmittance/Reflectance Measurement, and Mask Pattern Inspection systems. For DUV inspection, FST lists MERCURY Optical Pellicle & Mask Inspection System and the PRIME Series ArF,KrF Pellicle Inspection System. MERCURY is described with minimized consumable parts for low cost of ownership, pellicle and mask inspection including mask chamfer and side, user-friendly recipe creation, A.D.R Automatic Defect Review, and automatic determination of whether a particle is on the front or back side of the membrane. The PRIME Series provides ArF and KrF pellicle particle inspection with a patented detection algorithm, full-area membrane inspection, A.D.R Automatic Defect Review, and front-versus-back particle-location discrimination.
Capabilities and products
- IC Pellicle development and manufacturing
- FPD Pellicle development and manufacturing
- customized Pellicle solutions
- ArF Immersion 193nm IC Pellicle
- ArF 193nm IC Pellicle
- KrF 248nm IC Pellicle
- G&I 365/436nm IC Pellicle
- compressor-type Chiller
- heat exchanger
- thermoelectric Chiller
- cryogenic Chiller
- CO₂ Chiller
- temperature and humidity controller (THC)
- scrubber for harmful and toxic gases
- automated EUV Pellicle mounting and demounting system
- EUV Pellicle inspection system
- EUV Pod inspection and metrology system
- EUV source generation system
- optical Pellicle and Mask inspection system
- ArF/KrF Pellicle particle inspection system