At a glance
| Booth | I2904 |
| Country | TW |
| Website | www.fittech.com.tw |
Company profile
Fittech Co., Ltd specializes in LED testing and sorting equipment and in the research and manufacture of compound semiconductor testing equipment and laser micro-processing equipment, with experience in compound semiconductor wafer testing and related equipment fields. Fittech Co., Ltd was established in 2004, became publicly listed on the Taiwan Stock in 2019, spent more than a decade developing LED test equipment, and pioneered the integration of LED prober and tester systems. The company distributes products worldwide under its own brand and describes itself as the world's largest supplier of LED testing and sorting systems. As fiber-optics and 3D-sensing industries grew, the company expanded into laser-diode testing solutions for VCSEL, PD, DFB, and FP devices. In 2019, Fittech Co., Ltd established the Advanced Laser Micromachining Technology R&D Center to develop laser micromachining systems and equipment for semiconductor, optoelectronic-semiconductor, and PCB industries, including laser drilling, cutting, marking, and cleaning. Its engineering capabilities include high-precision mechanical design, software development and independent integration, and rapid manufacturing. Based in Taiwan and active in China, Asia, and worldwide markets, Fittech Co., Ltd serves customers globally through sales agents in China, Japan, Korea, and Malaysia, with local after-sales service in Suzhou and Xiamen, China. Its broader product scope includes wafer and chip testing solutions for LEDs, MiniLEDs, MicroLEDs, VCSELs, EELs, and PDs, semiconductor power-component testing equipment, and laser precision-processing applications.
Exhibits
Fittech Co., Ltd has invested in laser-diode component test equipment for many years, providing a full range of test solutions and supporting customized and integrated test equipment according to customer test requirements. Its laser-diode probing and testing portfolio covers VCSEL, EEL, and PD equipment, basic laser-diode measurement, VCSEL and PD test conditions, DFB/FP/EML testing, wafer scribing and breaking, and burn-in testing. LIV measurement covers current, voltage, and optical-power measurement of LD components, with complete measurement data obtained through data calculation and image processing. Integrated voltage and current pulse measurement for pulsed optical measurement is used to minimize DUT self-heating and obtain test values for investigating DUT performance. Optical-spectrum analysis is supported for VCSEL, DFB, FP, and EML devices, together with TO-CAN monitoring measurement, OSA integration, high and low temperature control, and customized integration; the temperature-control system supports measurement from -40℃ to 95℃. The portfolio includes customized integration of probers and testers, independently developed software interfaces, sales and technical teams, face-to-face service, and service centers in domestic and overseas locations. The VCSEL Prober and Tester combines mechanical integration and testing stability for 4-6 inch wafer-level VCSEL testing and high-power VCSEL testing. VCSEL test items include Near Field Pattern, Far Field Pattern, eye safety, divergence angle, M2, emitter distribution, uniformity and leveling, emitter amount, and beam-waist diameter. For VCSEL testing, self-developed control software supports test-parameter setup and test reports, can judge good and bad die, records testing data, and gives chip manufacturers data for investigating parameters and product efficiency. For PD devices used in optical communications and automotive LiDAR, Fittech Co., Ltd provides equipment that can work with corresponding standard light sources and perform responsivity and CV/IV measurements, including auto coupling, to evaluate important PD performance characteristics. Automated DFB/FP/EML point testing and sorting supports wavelength and FFP measurements for chips and bars, with optional DFB appearance inspection using AOI/VI, OCR for chip ID, and customized loading and unloading jigs. Smart Optical Character Recognition and automatic probing and testing are used to increase processing efficiency, monitor DUT performance, and improve issue traceability. EML testing equipment supports automatic probing and sorting with DFB, EA, and SOA measurements, and can integrate high and low temperature inspection, AOI/VI, OCR, and customized DUT input and output formats. Wafer scribing equipment performs surface scribing before breaking, supports 6"-8" compound semiconductor wafers including GaAs, GaN, and InP, and includes an automatic positioning system. The wafer breaker uses ceramic blades, adjustable breaking angles, and an elastic structure for adjusting breaking force to different wafer thicknesses; its software uses image recognition to align blade processing angles automatically and enhance production yield. Burn-in testing screens potential chip failure risks under different temperatures, voltages, or currents, and the equipment supports LD and PD products in TO-CAN, COS, and COB packaging with corresponding burn-in trays. Burn-in systems provide a constant-temperature environment, stable power supplies, periodic monitoring, ACC or APC aging modes, CW or Pulse power formats, and independent software settings for testing temperature and current. Named systems in the portfolio include the VCSEL Wafer Probing and Testing System, PD probing and testing system, and low-temperature edge-emitting laser probing and sorting system.
Capabilities and products
- LED testing and sorting equipment
- compound-semiconductor testing equipment
- laser micromachining equipment
- laser drilling, marking, cutting and cleaning
- VCSEL/EEL/PD probing and testing
- LD LIV current/voltage/optical-power measurement
- laser-diode optical-spectrum analysis
- -40℃ to 95℃ laser-device temperature-controlled testing
- 4–6-inch VCSEL wafer testing
- PD responsivity/CV-IV measurement
- DFB/FP/EML automated probing and sorting
- 6–8-inch GaAs/GaN/InP wafer scribing
- LD/PD burn-in testing
- custom-integrated optoelectronic test equipment