At a glance
| Booth | L0916 |
| Country | TW |
| Website | www.fineceramicplus.com |
Company profile
F Plus Ceramic Applied Materials Limited relocated to a new facility in Xiangshan, Hsinchu in 2024 and upgraded to atmospheric sintering and automated processing equipment, strengthening its ability to deliver highly dense, stable and production-ready ceramic solutions. The company is an active member of TEEIA and SEMICON Taiwan and states that it continues to promote material independence and deepen collaboration with global technology partners. Its products include conductive ceramics, microporous ceramics and their applications, transparent ceramics, high-temperature bonding processes, metal electrode bonding processes and electrostatic chuck components. F Plus Ceramic Applied Materials Limited provides integrated functional-ceramic solutions spanning material design through module-level manufacturing to support performance, reliability and process control.
Exhibits
F Plus Ceramic Applied Materials Limited provides one-stop new-material R&D from powder design to module verification for semiconductor front-end processes, vacuum and precision machinery, measurement and inspection, and optical applications. Its R&D scope includes conductive and ESD-control composite ceramics with tunable electrical properties, microporous ceramics with designed pore distributions for adsorption and fluid control, and toughening and grain control for ZTA, SiC, AlN and YAG ceramics. The company also develops high-thermal-conductivity and thermal-management materials for heat spreading and temperature uniformity, and high-transparency, wear-resistant and contamination-resistant structures for optical windows and protective parts. Its capability map covers powder engineering, CIP and mold forming, multi-stage sintering, grinding, lapping, polishing, etching, functional coatings, surface modification, high-temperature bonding, co-firing and integration of electrode and functional layers. Measurement and verification capabilities include geometry, surface roughness Ra/Sa, resistance and dielectric properties, thermal conductivity and thermal cycling, vacuum sealing and particle release, forming a closed loop across design, process and measurement. The development flow runs from requirements and NDA through target specifications and use conditions, material and structural hypotheses with DOE, prototype fabrication including co-firing, bonding and electrodes, functional verification and failure analysis, DFM and process-path optimization, pilot production and reliability testing, and transfer to mass production with CP/CTQ control plans. Quality management includes incoming, in-process and outgoing inspection with sample retention, FAI and documented engineering-change management, while technical deliverables can include material data sheets, process routes, key-material and electrode-layer designs, measurement reports, reliability records, production control plans and inspection specifications. The company describes DOE-based learning acceleration, measurement and statistical methods for batch consistency and traceability, integrated structure, interface and thermal-path design for durability and maintainability, and local supply and refurbishment strategies for lower life-cycle cost; designs, formulations and test data are managed under NDA, and customer-specified data-governance, inspection and certification requirements can be supported.
Capabilities and products
- one-stop new-material R&D
- conductive/ESD-control composite ceramics
- microporous-ceramic fluid control
- ZTA/SiC/AlN/YAG ceramic toughening
- high-thermal-conductivity thermal-management materials
- ceramics for optical windows and protective parts
- ceramic powder engineering
- CIP forming and multi-stage sintering
- precision ceramic machining and surface engineering
- high-temperature bonding and co-firing
- ceramic electrode/functional-layer integration
- material metrology and reliability verification
- thermal-conductivity, thermal-cycling and vacuum-seal verification
- functional verification and failure analysis (FA)
- pilot production and reliability testing
- electrostatic chuck components