At a glance
| Booth | N1266 |
| Country | SG |
| Website | www.fkdelvotec.com/en |
Company profile
F&K Delvotec Bondtechnik Singapore Pte Ltd develops connection solutions for sensor technology, semiconductors and automotive applications and emphasizes quality and efficiency in those connection processes. The company specializes in packaging technology and states that it has developed reliable and economical solutions for contacting electronic components with ultrasonic technology since 1978. Its joining portfolio also includes an advanced connection technology for the large wire cross-sections used in power electronics. Since 2014, its laser bonding technology has enabled the contacting of thick aluminium and copper ribbons on DCB substrates and copper terminals, an application area the company links particularly to power electronics. F&K Delvotec Bondtechnik Singapore Pte Ltd offers consulting, services and analysis intended to optimize the processes used in its bonding procedures. It also supports users with training courses covering wire bonding and the operation of its machines. For special requests, the company offers support for the development of new products in addition to its established bonding equipment and process services. F&K Delvotec presents its role as a partner in innovative bonding technology and also describes its field as innovative joining technology.
Exhibits
The machine range includes M17 S, M17 D, M17 L, M17 XL, M17LSB L, M17LSB XL, DELVOLAZ, Megalaz and Gigalaz, covering ultrasonic wire bonding, larger-format wire bonding and laser bonding configurations. M17 S is presented as the smallest machine in the range and as the model with the widest space utilization. M17 D is a compact, fully automatic wire bonder with two bonding heads for two different wire-bonding processes and is adapted to mass production of automotive power semiconductors and power modules. The listed application fields for M17 D include MEMS and sensors, optoelectronics and RF/HF, COB and hybrid assemblies, power devices, power systems and BMS. M17 D can combine thin wire with thick wire or thick wire ribbons in one process on one machine and is described as suitable for all common wire-bonding processes. Its specified wire range is 17 to 600 μm, with a maximum ribbon cross-section of 2,000 x 300 μm, and the machine supports changeover in less than 15 minutes. The stated M17 D working ranges are X = 254 mm, Y = 153 mm with an optional 204 mm, and Z = 40 mm with an optional 60 mm. Bond Process Control provides continuous monitoring and control of the bonding process, while automation can range from manual operation to in-line configurations. M17 D options include a lift system, manual pick-up, conveyor lines for in-line automation and customer-specific indexer systems for components or workpiece carriers. M17 L is identified as the Single Machine², while M17 XL is the XL wire bonder in the portfolio. For laser bonding, M17LSB L is positioned where ultrasonic bonders end, and M17LSB XL extends laser bonding to a larger working area. DELVOLAZ is specified with a working area of 1250x500x100 mm. Megalaz and Gigalaz are listed for Cell-to-Module, Cell-to-Pack and Cell-to-Chassis solutions. The broader equipment classification also includes ball placement systems, component attach systems, direct bonding systems, lead bonding systems, die bonders, flip-chip bonders, pick-and-place equipment and wire bonders. Inspection and process categories associated with the company include wire-bonding inspection, MEMS wafer-level bonders, bumping systems and wafer-level packaging, linking the equipment range to semiconductor assembly and advanced packaging workflows. Across the machine line, F&K Delvotec describes production aims that include efficiency, precision, smooth processes, reliable operation and ease of use in the production line.
Capabilities and products
- ultrasonic bonding of electronic components
- thick-wire bonding for power electronics
- laser bonding of thick aluminium and copper ribbons
- bonding process consulting and analysis
- wire-bonding and machine-operation training
- fully automatic dual-head wire bonder
- thin- and thick-wire bonding in one machine
- continuous bonding-process monitoring and control
- in-line automation for wire bonding
- large-work-area laser bonding