At a glance
| Booth | N1266 |
| Country | SG |
| Website | www.fkdelvotec.com |
Company profile
F&K Delvotec Bondtechnik Singapore Pte Ltd is listed by SEMICON Taiwan 2026 under booth N1266, with the website fkdelvotec.com and the positioning line “Your Partner In Innovative Bonding Technology.” The SEMICON eBooth categorizes the company under assembly equipment, including ball placement systems, component attach systems, direct bonding systems, lead bonding systems, die bonders, flip-chip bonders, pick-and-place equipment and wire bonders. It also lists inspection and test categories such as wire-bonding inspection and MEMS wafer-level bonders, plus process categories including bumping systems and wafer-level packaging. Based on the available exhibitor data, the company is a Singapore-linked bonding, assembly and packaging-equipment supplier for semiconductor assembly and advanced packaging workflows.
Capabilities and products
- MEMS wafer-level bonders
- ball placement systems
- component attach systems
- die bonders
- direct bonding systems
- flip-chip bonders
- wire-bonding inspection