At a glance
| Booth | L1208 |
| Country | TW |
| Website | www.ezbond.com.tw |
Company profile
EZBOND CHEMICAL CO., LTD. was established in 1996 A.D. with the initial aim of acting as a Silicone-product distributor for domestic and international chemistry, high-tech electronics, and electrical-appliance companies, while concentrating on the electrical and electronic industries and expanding overseas markets. The company established its first branch in Dongguan of Guangdong province at the end of 1999 and its second branch in Kunshan of Jiangsu province at the beginning of 2001. After some Chinese customers relocated to South East Asia, EZBOND CHEMICAL CO., LTD. set up another branch office in Hanoi, Vietnam at the end of 2023 as part of its overseas-market expansion and customer support. Its customer base is described as more than 2,500 clients in the Taiwan and China region. The company serves fields including photon-electronics, thermal management, power, home electronics, vehicle-use electronics, solar energy, and the LED industry. EZBOND CHEMICAL CO., LTD. also records a 2014 milestone in which it formally established Acqua Gems International Co., Ltd. for research, development, production, and sales related to medical, biotechnical, and cosmetic products, including skin-trauma repair, plant-factory construction and nutrition supply, and health-care and pressure-relief applications. Its stated service approach emphasizes introducing new high-technology-oriented product lines while responding to changing customer expectations in electronics and continuing research and development for newer technologies.
Exhibits
EZBOND CHEMICAL CO., LTD. distributes DOW Adhesive/Sealant, Encapsulants, Conformal Coating, and Thermal Management products, directly covering adhesive and sealant materials, encapsulants, and conformal coatings in its supply portfolio. The portfolio also includes UV Gel and UV Equipments from Panacol-Elosol GmbH & Dr. Hnle AG., together with Hoenle-UV photo-source equipment such as Fiber Optical Bluepoint Source, UV Surface-Photo, Bluepoint LED, UV Surface Irradiation, UVACUBE, LED UV-Pen / LED Power Pen, and UV Meter. For area-array components, EZBOND CHEMICAL CO., LTD. distributes Zymet adhesives and encapsulants including Underfills, NCP's, and ACP's, and its product navigation separately lists Underfill and Edgebond. The supply range further includes UL94 V-0 certificated non-Silicone Adhesive/Sealant and Encapsulants products, various non-UL products for electronic and electrical-industry adhesive applications, Grirem Advanced Materials, Customized Cooling Module offerings, and Industrial Coolant. A newer generation of DOW thermal-interface materials is presented for increasingly demanding heat-dissipation needs in high-performance electronic equipment, with improved heat-dissipation performance, reliability, and processability and with stable, long-lasting performance across operating environments. The thermal-management range includes a curable silicone hot-melt film for bonding processes with bond-line-thickness control, and DOWSILTM ME-1603 Thermally Conductive Adhesive is specified with thermal conductivity of 2.0W/m·K and a low-volatility design intended to address bubble problems. For LED packaging, Dow Corning silicone solutions are described as compatible with standard LED substrates and processing techniques, with a product line of gels, elastomers, and resins. The LED-packaging materials are specified for high optical transparency, UV resistance, thermal stability, low moisture uptake, and low ionic content, and their listed applications include SMD LED, Hi-Power LED, Optical Lens, LED by molding process, and Die Attach materials. These LED materials are also described for IR, visible, or UV optical applications, lead-free solder reflow temperatures, manufacturing flexibility, and adhesion to various lead frames. The HRI encapsulant lineup names OE-6450 gel; OE-6520 and OE-6550 elastomers; OE-6635, OE-6636, OE-6630, OE-6631, and OE-6665 resins; and SR-7010 lens resin. Its HRI data table includes mix ratios from 1：1 through 1：20, curing conditions from 100℃/1hr to entries at 150℃ and an entry of < 1 min@170°C, refractive-index values from 1.53 to 1.54, transmittance entries of 99 to 100% at 450 nm and 1 mm, and storage-condition entries at 25℃ from 6M to 16M. The NRI lineup names JCR-6110, Q1-4939, and OE-6250 gels; JCR-6126, JCR-6101UP, JCR- 6122, OE- 6336, and EG-6301 elastomers; and OE-8001 Die Attach Adhesive. The NRI table presents one-part and multi-part formulations, curing entries from 70℃/1hr + 150℃/2hr through 170℃/1hr alternatives, refractive-index values around 1.398 to 1.42, transmittance values and translucent entries, and storage conditions including 25℃, -5℃, and -15℃/product label entries. Within the UL 94 V-0 industrial-adhesive range, Yellow Rubber 1603 HFR-HS is used for electronic parts such as electrical-appliance, sound, and computer assemblies and is described as flowable and easy to operate. UL 94 V-0 Crepe Rubber 508 and D-108 are listed for electronic parts such as monitoring devices, power supplies, and automobile assemblies, with thermal stability, adhesion, hardness, and fixity among the stated properties. EA 9189 Silicone Adhesive is a one-part, non-solvent product stated to conform to the environmental-protection SGS standard, with electronic-part adhesion and thermal conductivity, approximately 5-7 min tack-free time, thermal conductivity surpassing 0.8 W/mk, non-corrosion to plastics and metal copper, and siloxane quantity smaller than 300ppm. PAS-6700 UL Denature Silicone Adhesive is likewise listed as one-part and non-solvent with SGS environmental conformity, thermal conductivity surpassing 0.8 W/mk, adhesion to hard plastics, water and weathering resistance, short-time temperature resistance of approximately 160℃, and non-corrosion to plastics and metal copper. 8868 UL Hot Melting Gel is used for monitoring devices, power supplies, automobile applications, and manufactured-product component assembly, and is described as fast tack-free, easy to operate, non-solvent, and non-stink. The epoxy-resin encapsulant and conformal-coating range includes E 532A / H 532B, specified with about 60min operating time at 100g and 25°C, room or higher-temperature curing, low viscosity, and low shrinkage. E 536A / H 536B is listed with about 24hrs operating time at 100g and 25°C, low viscosity, medium or higher-temperature curing, low shrinkage, and adhesion. E 759A / H 759B is listed with about 60min operating time at 100g and 25°C, high viscosity, medium or higher-temperature curing, elasticity, and thermal-shock resistance. Screw fixing gel SNL-1500 is intended for electrical appliances, aviation, and vehicle-industry electronics to prevent screws from crowding and rusting, and it uses an alcohol-type solvent with low-stink and environmental-protection characteristics. AB Part Adhesive N-505X, N-530X, and N-560X uses a two-part syringe with a 1:1 proportion, is designed to simplify operation and mixing, and is described with fast tack-free behavior, customer-adjustable rubber, high toughness, oil resistance, drug resistance, and electrical properties. Solder Mask Rubber and Resist Mask Rubber CHV8 is a one-part, high-viscosity material with temperature stability at 268°C, fast tack time, easy peel-off, and compatibility with rosin, water-soluble solder-mask solvent, and clean resolver. The Fiber Optical Bluepoint Source lineup names Hoenle Bluepoint 2 Easycure, Bluepoint 4 Ecocure, and Bluepoint 4 as optical-fiber UV point sources for precise localized curing of UV-active adhesives and conformal-coating materials. The UV point source has adjustable UVA intensity between 2000 and 14.000 mW/cm2* and an extended lamp life stated at approximately 3000 hours through a tube design intended to reduce energy-intensity consumption. Its control features include external remote control through PLC, easy lamp replacement, a user-friendly interface, and entry of complete program sequences. Used with the Hoenle UV meter, the system can perform automatic correction and power regulation, and it includes RS 232 and programmable-controller connections with an optional auxiliary-relay electronic-contact function. The electronic ballast is described as automatically matching existing alternating current, interchangeable light filters support different spectra, parameter settings can be saved on 6 storage plates, and software can be renewed through the Internet. A built-in control meter can control the Hoenle micro measurement valve PV1000, and measurement can be carried out with the Hoenle UV meter using an 8mm photoconductor and UVA photoconductor sensor. The UV Meter high-end module measures intensity and dose and supports measurement in different wavelength areas through at most 8 exchangeable sensors with automatic sensor recognition. It provides two-channel measurement for different wavelength spectra, data storage for recorded measurements, auto-start when minimal values are exceeded, and automatic switching between measurement ranges. Measurement values can be displayed in mW/cm² or W/cm², the high-end module includes an integrated real-time clock, and its docking station has an accumulator-charging connection and RS232 interface for transmission and PC evaluation of measured values. The Standard Module is specified for one-channel measurement without data storage, without a docking station and accumulator-charging connection, without an RS232 interface, and as non-power. For a planer sensor, the listed ranges are UVA 330 nm - 400 nm up to 5 W/cm², UVB 290 nm - 330 nm up to 2 W/cm², UVC 230 nm - 285 nm up to 2 W/cm², and VIS 420 nm - 520 nm up to 5 W/cm². For the Light Guide Sensor and Quartz Good Sensor, the listed limits are UVA 330 nm - 400 nm up to 20 W/cm² and UVC 230 nm - 285 nm up to 1 W/cm².
Capabilities and products
- distribution of thermal interface materials (DOW)
- supply of curable silicone hot-melt films
- supply of 2.0W/m·K thermally conductive adhesives (DOWSIL)
- distribution of UV-curable adhesives (Panacol-Elosol)
- distribution of non-silicone adhesives and sealants
- distribution of non-silicone encapsulants
- distribution of customized cooling modules
- distribution of industrial coolants
- supply of LED packaging silicones (Dow Corning)
- supply of LED optical lens resins
- supply of LED die-attach adhesives
- supply of hot-melt adhesives for electronic assembly
- supply of epoxy resin encapsulants
- supply of epoxy resin conformal coatings
- supply of screw-locking adhesives
- supply of two-part syringe adhesives
- supply of peelable solder masking compounds
- supply of fiber-optic UV spot-curing light sources (Hoenle)
- supply of UV intensity and dose meters
- distribution of electronic silicone adhesives and sealants (DOW)
- distribution of silicone encapsulants (DOW)
- distribution of silicone conformal coatings (DOW)
- distribution of underfills (Zymet)
- distribution of non-conductive pastes (NCP) (Zymet)
- distribution of anisotropic conductive pastes (ACP) (Zymet)