At a glance
| Booth | L1208 |
| Country | TW |
| Product categories | PV: Modules · Solar Thermal · Wafers · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Marking ink · Molding; Encapsulation; Potting; Resin Materials · Package Substrates; Laminate; Film based · Packages; Ceramic and Other High Temp Compounds · Packages; Plastic · Scribe Tools; Saw or Dicing Blades and Accessories · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Cleaning Chemicals; Solvents; Strippers · DI; UP Water · Other Specialty Chemicals · Spin on glass material · Surface protection material; coatings · Color Filter Materials · Materials, Nanotechnology · Gases & Liquid Chemicals · Ingots, Wafers · Gaskets; Seals; O rings; Elastomers; Resins · HVAC; Temperature; Humidity Systems and Control · Research and Development · Other |
| Website | www.ezbond.com.tw |
Company profile
Ezbond Chemical Co., Ltd. was established in 1996 A.D., the beginning established aim to act as a Silicone product's distributor especially for the domestic and international chemistry high-tech electronics, electrical appliance co.. Concentrate on developing the electrical and electronic industry, and actively expand an oversea market. Formally established 1st branch in Dongguan of Guangdong province at the end of 1999, moreover, at 2001 beginning of years, established the second branch in Kunshan of Jiangsu province. Because some Chinese customers relocate to South East Asia, we set up another branch office in Hanoi, Vietnam at end of 2023. Actively expand to overseas market in order to fully satisfy the customer needs in most effective and efficient way. Currently, the distributing products as below: A. Adhesive/Sealant, Encapsulants, Conformal Coating, Thermal Management of DOW Products B. UV Gel, UV Equipments of Panacol-Elosol GmbH & Dr. Hnle AG. C. Adhesives, Encapsulants(Underfills, NCP's, ACP's) for Area Array Components of Zymet. D. UL94 V-0 Certificated non-Silicone Adhesive/Sealant & Encapsulants Products. E. Various non-UL Products for Electronic and Electrical Industry Adhesive Application. F. Grirem Advanced Materials G. Customized Cooling Module H. Industrial Coolant
Capabilities and products
- DOW adhesive and sealant distribution
- DOW conformal coating products
- DOW encapsulants
- Panacol-Elosol UV gel
- UL94 V-0 non-silicone adhesive sealant and encapsulants
- UV curing equipment from Dr. Hönle
- Zymet NCP and ACP encapsulants
- Zymet underfills for area-array components