At a glance
| Booth | M0948 |
| Country | CH |
| Website | www.evatecnet.com |
Company profile
Evatec AG delivers thin-film production solutions for Advanced Packaging, Semiconductor, Optoelectronics, and Photonics. The company offers batch, cluster, and inline deposition systems selected according to customer throughput, process requirements, and fab-integration requirements. Evatec source designs combine with Advanced Control, APC, technologies to provide in-situ control of film properties during the deposition cycle. The new generation of HEXAGON is positioned for fan-out wafer-level packaging, FOWLP, and Wafer Level Chip Scale, WLCSP, with increased process capability, flexibility, and throughput. Its thin-film solutions also address SiC and GaN wide-bandgap power applications and precision optical layers for Augmented Reality, Edge Emitting Lasers, EELs, and MicroLED. For Through Glass Via, TGV, in advanced IC substrates, Evatec AG provides seed-layer deposition with adhesion at both wafer and panel level.
Exhibits
Evatec AG provides advanced evaporation and sputter technologies, with high-performance PVD sources supporting applications in Advanced Packaging, Semiconductor, Optoelectronics, and Photonics. Evaporation technology and process know-how extend across the BAK Family and selected cluster tools, drawing on more than 50 years of experience that began with the original Balzers BAK electron-beam evaporation platforms. Modern BAK platforms add digital electron-beam gun technology and specialist thermal sources such as barrel sources and effusion cells, with manual or fully automated loading and standard or extended throw configurations. Thin-film properties can be produced through ion-beam densification or combined plasma-polymerization processes, while quartz or optical monitoring supports high precision and reliability. The magnetron-sputter range includes DC for metal sputtering, DC Pulsed for reactive and energy-controlled sputtering, DC High Current Pulsed for ionized sputtering, RF for dielectric sputtering, and DC+RF for energy-controlled sputtering. Linear planar magnetrons are used in batch rotating-drum machines such as LLS EVO, offering long target life, access to a wide range of target materials, atomic-scale material mixing, and deposition of anisotropic films for applications such as magnetic devices. Round planar magnetrons are used with rotating-table platforms such as CLUSTERLINE® 200, rotating-substrate platforms such as SOLARIS®, substrate-indexing tools such as HEXAGON, and cluster tools including CLUSTERLINE® 200 and 300. Facing Target Cathode, FTC, technology on CLUSTERLINE® platforms supports damage-free TCO deposition on sensitive materials such as GaN and quasi-epitaxial growth of BTO and LNO when combined with Evatec hot-chuck technology. Multisource sputter technology integrates up to 4 smaller sputter sources on one process flange for co-sputtering alloys and compounds, supporting both development of new material compositions and mass production on CLUSTERLINE® platforms. The PVD platform range spans batch, cluster, and fully automated inline systems so that platform selection can be matched to process, throughput, and factory-integration requirements. The BAK FAMILY covers evaporators from 0.5 to 1.4 meters with electron-beam evaporation and thermal-source technologies, while Multi BAK can cluster up to 4 BAK process chambers around an atmospheric front-end module with a robot for fully automated cassette-to-cassette operation. CLUSTERLINE® 200 is a fully automated 200mm cassette-to-cassette cluster platform with single or batch modules for sputter, etch, PECVD, and PEALD, and CLUSTERLINE® 300 is a fully automated 300mm cluster platform for sputter and etch. CLUSTERLINE® 600 is an Advanced Packaging tool for FOPLP and next-generation IC-substrate formats up to 650x650mm, integrating large-area degas, etch, and sputter technologies. HEXAGON is a dedicated 300mm advanced-packaging platform for applications such as FOWLP, with custom degas, etch, and sputter technologies. LLS EVO II is a vertical batch sputter platform designed for exchange between different substrate sizes and medium-volume production, with manual or robot loading. The SOLARIS® FAMILY provides high-speed inline sputter platforms prepared for fully automated fab integration, in two sizes for substrate formats up to 8 or 15 inches diagonal. CLUSTERLINE® 200 is also paired with Evatec PEALD, for which the company highlights conformality, precise thickness control, and repeatability. A BAK 941 configuration is described with up to 4 tools in a cluster arrangement and complete front-end automation for wireless-communication applications. The PVD development range also includes reactive-sputtered thin films for low-loss CMOS-compatible silicon-nitride photonics and processes for high-concentration Al(1-x)Sc(x)N films. For FBAR-related deposition, the page also lists controlled-stress molybdenum and ruthenium electrode deposition together with AlScN deposition processes on CLUSTERLINE® 200 II.
Capabilities and products
- batch/cluster/inline thin-film deposition systems
- PVD evaporation and sputtering technologies
- electron-beam evaporation
- magnetron sputtering
- facing-target low-damage sputtering
- multisource co-sputtering with up to 4 sources
- 200 mm sputter/etch/PECVD/PEALD cluster platform
- fully automated 300 mm cluster platform
- 650×650 mm panel degas/etch/sputter
- 300 mm FOWLP degas/etch/sputter
- TGV seed-layer deposition at wafer and panel level
- in-situ film-property control during deposition
- SiC/GaN thin-film deposition solutions
- precision optical thin-film deposition