At a glance
| Booth | M0257 |
| Country | DE |
| Website | www.ers-gmbh.com |
Company profile
ERS Electronic GmbH is a German semiconductor thermal-management company based in Germering near Munich and has provided thermal-management solutions to the semiconductor industry for more than 50 years. The company is known for fast and precise air-cooled thermal chuck systems used for semiconductor testing and probing. Its stated thermal-chuck test range extends from -65 °C to +550 °C for analysis, parameter correlation, and process probing. ERS states that it pioneered thermal wafer testing and invented AirCool® technology for cooling without liquid. Since 1972, the company has sold more than 10,000 chucks worldwide and states that almost 85 % are still in use. ERS also states that almost every IC used lately in the automotive and safety industry has been tested on ERS chucks. In 2008, ERS expanded its expertise into advanced packaging, including debonding and warpage-adjustment systems. The company describes its fully automated and semi-automated debonding and warpage-adjustment systems as being used on production lines at semiconductor manufacturers and OSATs worldwide. Those advanced-packaging systems are specifically associated with solving complex warpage challenges in fan-out wafer-level packaging processes. ERS further states that more than 2 billion ICs have been debonded on its solutions.
Exhibits
ERS Electronic GmbH supplies thermal chucks for wafer probing together with AirCool® technology that cools without liquid. The company's thermal-chuck systems include AirCool® Prime, AC3 Fusion, and AirCool®. These air-cooled chuck systems are positioned for semiconductor test work across the stated -65 °C to +550 °C temperature range. The supported test activities named by ERS include analysis, parameter correlation, and process probing. The AirCool® approach is based on air cooling rather than liquid cooling and is part of the thermal-wafer-testing technology the company says it pioneered. ERS also supplies debonding solutions for advanced packaging, including the ADM330 flagship machine identified in its third generation. Its advanced-packaging portfolio includes fully automated and semi-automated debonding systems used by semiconductor manufacturers and OSATs. The same portfolio includes fully automated and semi-automated warpage-adjustment systems for advanced packaging production lines. ERS links these debonding and warpage-adjustment capabilities to fan-out wafer-level packaging, where the systems address complex wafer-warpage problems. The company identifies thermal chucks, air-cooling technology, debonding tools, and warpage-adjustment systems as its principal offerings for wafer probing and advanced packaging. Its installed-base statements include more than 10,000 chucks sold worldwide since 1972 and more than 2 billion ICs debonded on ERS solutions. Together, these offerings cover temperature-controlled wafer testing and advanced-packaging handling steps that require debonding or correction of wafer warpage.
Capabilities and products
- air-cooled thermal chucks from -65 °C to +550 °C
- AirCool® liquid-free thermal wafer testing
- fully and semi-automated advanced-packaging debonding systems
- fully and semi-automated warpage-correction systems for FOWLP