At a glance
| Booth | M0257 |
| Country | DE |
| Product categories | Molding; Encapsulation; Decapsulation Equipment · Parametric Test Systems |
| Website | www.ers-gmbh.com |
Company profile
ERS electronic GmbH is a German semiconductor thermal-management company headquartered in Germering near Munich. It has provided innovative thermal-management solutions to the semiconductor industry for more than 50 years. ERS is known for fast and precise air-cooled thermal chuck systems, covering test temperatures from -65 °C to +550 °C for analysis, parameter correlation and process probing. It expanded into advanced packaging in 2008 and now supplies fully automated and semi-automated debonding and warpage-adjustment systems used by semiconductor manufacturers and OSATs, especially for fan-out wafer-level packaging challenges. ERS pioneered thermal wafer testing, invented AirCool technology for cooling without liquid, and has sold more than 10,000 chucks worldwide since 1972. Its key offerings are wafer-probing thermal chucks, air-cooling technology, debonding tools and warpage-adjustment systems for advanced packaging.
Capabilities and products
- AirCool technology for liquid-free cooling
- air-cooled thermal chuck systems for wafer probing
- fully automated debonding systems for advanced packaging
- semi-automated debonding systems for OSATs
- thermal chuck test temperature range from -65 °C to +550 °C
- warpage-adjustment systems for fan-out wafer-level packaging