At a glance
| Booth | N0041 |
| Country | TW |
| Product categories | Package Handling; Conveying Equipment · Wafers · Environmental Enclosures; Minienvironments · Stockers; Storage, AMHS · Wafer Handling · Device; Wafer; Display Panel Handling Products · Other |
| Website | www.epak.com |
Company profile
ePAK is a full-service designer, manufacturer and supplier of precision engineered products and solutions for the automated transport and handling of semiconductor and electronic devices. Our product areas include front-end wafer handling, back-end IC transport, and end-system sub-assembly handling. Our products are sold globally to top tier global customers including semiconductor companies, system OEMs, and IC assembly and test operations.
Exhibits
ePAK strives to meet 100% of your component handling requirements. We are the one supplier that can do it all. Whether you require Matrix Trays, Carrier Tape, or Shipping Tubes our experienced design team and advanced production methods will provide precision products to meet your needs. ePAK manufactures precision-molded matrix trays for the safe handling, shipping, and storage of semiconductor components. Our tray solutions cover JEDEC, EIAJ, and fully custom outlines, all produced with ESD-safe materials to protect sensitive devices throughout the supply chain. Wide range of materials available to meet your ESD and process requirements Embossed carrier tape is a precision-formed packaging medium used to transport integrated circuits (ICs), bare die, and electronic components through the semiconductor supply chain. The tape contains thermoformed pockets that hold individual components securely during automated pick-and-place assembly, testing, and shipping. Combined with a sealed cover tape and wound onto reels, embossed carrier tape enables high-speed, high-reliability component handling from back-end packaging through final SMT assembly. ePAK offers a broad set of application-specific carrier tape materials, each engineered for specific handling requirements. Tri-laminate materials combine multiple polymer layers to deliver superior tape strength and consistent pocket formation. This construction resists deformation during high-speed feed operations, making tri-laminate tapes the preferred choice for standard IC packaging where mechanical reliability is critical. Homogeneous materials are single-layer conductive or dissipative polymers that provide enhanced ESD protection throughout the tape body. Because there are no lamination boundaries, homogeneous materials also allow for deeper pocket embossing, accommodating taller components and stacked die packages. eVISION designs are optimized for automated optical inspection systems. The material selection and pocket geometry are engineered to minimize false rejects from vision-based pick-and-place machines, reducing machine stoppages and improving throughput on the assembly line. Bare die handling requires the highest level of precision and contamination control. ePAK’s carrier tapes for bare die feature tight-tolerance pockets formed to match the exact die dimensions, combined with polycarbonate materials that minimize particle generation and ionic contamination during transport and storage.
Capabilities and products
- ESD-safe materials for semiconductor trays
- Matrix Trays for semiconductor component handling
- Shipping Tubes for semiconductor component handling
- back-end IC transport products
- bare die carrier tapes
- eVISION automated optical inspection
- embossed carrier tape for ICs, bare die and electronic components
- end-system sub-assembly handling products
- front-end wafer handling products
- precision-molded JEDEC, EIAJ and custom matrix trays