At a glance
| Booth | N0041 |
| Country | TW |
| Website | www.epak.com |
Company profile
ePAK International, Inc. is a full-service designer, manufacturer, and supplier of precision-engineered products and solutions for the automated transport and handling of semiconductor and electronic devices, with product areas spanning front-end wafer handling, back-end IC transport, and end-system sub-assembly handling. Founded in 1999, ePAK provides shipping and handling solutions across semiconductor manufacturing stages from the front end through final packaging. The company states that it has 5000 products and a diversified client base of more than 500 customers, including wafer fabs, assembly and test vendors, semiconductor companies, system OEMs, and IC assembly and test operations. Its manufacturing network includes facilities in Shenzhen and Anhui, China, and Penang, Malaysia, while a manufacturing and design center is identified in Shenzhen, China. ePAK also states that it maintains nine sales and applications-engineering offices worldwide and positions its executive team in key locations around the globe to support customers locally. The company lists Green Partner certification together with centralized design and manufacturing, local applications engineering and support, a spectrum of material options, interchangeable designs, and a full product line of open tooling among its stated advantages. Front-end products are intended to support automated wafer manufacture, transport, processing, and protection, including transport and handling carriers, process cassettes, and storage environments for finished and work-in-progress wafers. Back-end products support handling and transfer of finished wafers, manufacture of packaged ICs, and transport of finished ICs and electronic components toward system sub-assembly and final assembly, with interfaces for high-speed automated assembly and SMT equipment. End-system products support automated assembly of electronics end systems such as magnetic disk drives and imaging products, where ionic, chemical, and particulate contamination sensitivity is high, and include disk-substrate and media carriers and automation trays. Its major customer groups are manufacturers of semiconductor wafers, ICs, and electronic components as well as electronic-system producers, and the company states that its core management team consists of semiconductor-industry veterans who have worked together for more than 15 years.
Exhibits
ePAK's IC shipping and handling range includes Matrix Trays, Embossed Carrier Tape, IC Shipping Tubes, cover tapes, and reels, supported by design and production methods intended to meet varied component-handling requirements. Its precision-molded Matrix Trays are used for safe handling, shipping, and storage of semiconductor components and are offered in JEDEC, EIAJ, and fully custom outlines using ESD-safe materials. The matrix-tray program supports standard JEDEC and EIAJ outlines as well as custom configurations, including QFP, BGA, and SOP pocket formats and custom cavity layouts matched to device specifications with tight dimensional tolerances. Published JEDEC and EIAJ tray formats cover TQFP/LQFP, QFP/PQFP, PGA, TSOP/SOIC, QFN/QLP, CSP, BGA, and LGA components, with tray identification based on device or package body size, device height, row-by-column matrix, cell type, profile, and material code. For ESD and anti-static requirements, the company lists dissipative material options with surface-resistivity ranges of 105–1011 and conductive MPPE options at 104–107, with maximum temperature depending on the selected grade. For separate chip-tray applications, ePAK lists 2-, 3-, and 4-inch tray formats, with pocket dimensions and tray matrix selected according to component and process requirements. The patented eBIN™ identification system uses color-coded JEDEC tabs, riders, and detachable studs for sorting and binning while retaining the JEDEC tray outline, while the patented V-Cut™ feature allows clean separation of tray sections without additional tooling. A modular insert-tray system uses interchangeable inserts within a standard outer frame so inserts can be changed for different device outlines, reducing the number of unique tray SKUs and shortening changeover in automated pick-and-place and test-handler environments. ePAK manufactures EIA-481 embossed carrier tape for ICs, bare die, and electronic components, with custom pocket geometry, tri-laminate, ESD-safe homogeneous and eVISION materials, matched cover tape, 7-inch and 13-inch reels, and in-house tooling. Embossed carrier tape uses precision-formed pockets to hold components during automated pick-and-place assembly, testing, and shipping, and when sealed with cover tape and wound onto reels it supports handling from back-end packaging through final SMT assembly. Tri-laminate carrier-tape materials combine multiple polymer layers for tape strength and consistent pocket formation and are described as resisting deformation during high-speed feed operations. Homogeneous materials are single-layer conductive or dissipative polymers that provide ESD protection throughout the tape body and permit deeper pocket embossing for taller components and stacked die packages. eVISION carrier-tape designs are optimized for automated optical inspection, with material selection and pocket geometry intended to minimize false rejects from vision-based pick-and-place equipment, reduce machine stoppages, and improve assembly-line throughput. For bare die, ePAK describes tight-tolerance pockets matched to exact die dimensions and polycarbonate materials selected to minimize particle generation and ionic contamination during transport and storage. For packaged ICs and other components, the carrier-tape range covers QFN and BGA packages as well as passive components and connectors, with clear PET and polycarbonate options for visual-inspection compatibility and deep-pocket or odd-form capability for non-standard geometries. Carrier-tape reels are available in standard 7-inch and 13-inch diameters, including antistatic and conductive versions, multi-piece designs intended to reduce shipping volume, and nesting designs for compact storage and return logistics. The EIA-481 carrier-tape specifications list standard tape widths of 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, and 56mm and standard pitch options of 4mm, 8mm, 12mm, and 16mm, while pocket dimensions, depth, and pitch can be configured for the component. Custom carrier-tape design begins with the device type and dimensions and then defines material and tape thickness, tape width, pocket pitch, style, and tape length, after which pocket geometry can be matched to an IC, bare die, or other component. A complete tape-and-reel setup can add matched cover tape and reel, with heat-sealed and pressure-sensitive cover-tape families for standard carrier widths plus 7-inch and 13-inch reel formats. In-house tooling is described as supporting custom pocket designs, rapid prototyping, and production-ready tooling for non-standard component geometries. IC Shipping Tubes are produced for transport and storage of semiconductor components, ranging from small-profile to large-format designs with standard or custom cross-sections matched to device dimensions and handling needs. Tube options include custom profiles for unique component outlines, environmentally enhanced and ESD-safe materials, and custom printing and identification. Across these products, ePAK's stated objective is to cover component handling from front-end wafer handling through back-end packaging and final assembly with packaging formats designed for automated manufacturing, transport, testing, shipping, and storage.
Capabilities and products
- front-end wafer handling carriers and process cassettes
- JEDEC/EIAJ/custom matrix trays
- ESD-safe matrix trays
- eBIN™ JEDEC tray identification system
- V-Cut™ tool-free tray separation design
- modular interchangeable insert trays
- EIA-481 embossed carrier tape
- custom carrier-tape pocket geometry
- precision carrier tape for bare die
- antistatic and conductive carrier-tape reels
- IC shipping tubes
- disk-substrate/media carriers and automation trays