At a glance
| Booth | T9404 |
| Country | JP |
| Website | elephantech.com/en/news/semicon-taiwan-2026 |
Company profile
Elephantech Inc. was founded in January 2014 and entered its second decade with a mission of making the world sustainable through new manufacturing technologies. The company originated as a startup from the University of Tokyo and has continued developing scientific innovations and new business initiatives for the electronics industry. Elephantech Inc. has capital of 100 million JPY and had about 150 employees as of December 2025. Its headquarters and R&D functions are in Tokyo, including the Hatchobori office and the Shinkiba R&D center, while AMC Nagoya in Aichi is used for FPC mass production. The company develops, manufactures, and sells proprietary equipment and materials as well as PCB products. Its manufacturing-development history includes laboratory validation of SustainaCircuits technology in 2016 and the launch of its first FPC product in 2017. In 2020, Elephantech Inc. began large-scale production at its first additive PCB manufacturing center, AMC Nagoya. The company expanded the technology in 2024 by developing a general-purpose SustainaCircuits multilayer PCB. In 2025, it started providing a multilayer PCB manufacturing solution, extending its go-to-market model beyond the earlier product milestones. For advanced semiconductor packaging, Elephantech Inc. applies proprietary 15-nm-class Self-Assembling Copper Nanoparticle technology to challenges created by AI accelerators, chiplets, and heterogeneous integration. The company identifies high-aspect-ratio vias, fine-line interconnects, glass-core substrates, process complexity, cost, and scalability as key manufacturing challenges in this area. Elephantech Inc. also seeks collaboration with semiconductor manufacturers, substrate suppliers, and research partners around these packaging and manufacturing solutions.
Exhibits
The semiconductor-packaging offering addresses the move toward AI accelerators, chiplets, and heterogeneous integration with copper-deposition, via-metallization, substrate-wiring, and copper-nanopaste technologies. Nano Copper Deposition is part of the portfolio built around the company’s 15-nm-class Self-Assembling Copper Nanoparticle technology. DeepVia™ is intended for high-aspect-ratio via metallization and achieves sufficient seed-layer coverage in high-aspect-ratio vias. DS-SAP™ is provided for advanced substrate wiring, addressing the fine-line interconnect needs associated with higher-density packaging. SAphire™ is a copper nanopaste used for TGV filling and low-temperature copper sintering. The SAphire™ family also supports low-temperature, pressureless sintering while maintaining high bonding strength across various applications. Across the portfolio, Elephantech Inc. states that the technologies can complement existing manufacturing processes, reduce material use, simplify manufacturing, and improve reliability. The technologies are further positioned to support higher-density semiconductor packaging for AI and HPC while responding to process-complexity, cost, and scalability challenges. The offering brings together innovations from two technology platforms, including high-aspect-ratio via seed-layer coverage and the low-temperature pressureless-sintering behavior of the SAphire™ family. The company presents these solutions for collaboration with semiconductor manufacturers, substrate suppliers, and research partners working on advanced packaging.
Capabilities and products
- 15-nm-class Self-Assembling Copper Nanoparticle technology
- Nano Copper Deposition
- high-aspect-ratio via metallization
- advanced substrate fine-line wiring
- copper nanopaste for TGV filling
- low-temperature pressureless copper sintering
- multilayer PCB manufacturing solutions
- FPC mass production