At a glance
| Booth | N0368 |
| Country | TW |
| Product categories | Bumping Systems · Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment · CMP; Grind; Lap; Polish; Abrasive materials · Pumps, Vacuum |
| Website | www.ebara.co.jp |
Company profile
Ebara Corporation is a semiconductor-industry solution provider. EBARA supplies compact energy-saving dry vacuum pumps, abatement systems for global-warming and flammable gases, leading-edge CMP systems, plating systems for packaging, and bevel polishing systems for wafer bevel and backside treatment to improve yield in advanced-node production. Its precision machinery business supports Taiwan semiconductor and panel customers with high-quality production equipment, technical support and maintenance service sites, using leading technologies in chemical mechanical polishing and vacuum. Its semiconductor equipment includes high-throughput CMP equipment, bevel polishing equipment and electroplating equipment, essential for precise, highly integrated semiconductor production. Ebara is a semiconductor manufacturing equipment and service supplier spanning CMP, vacuum, gas abatement, plating and wafer edge or backside treatment.
Capabilities and products
- abatement systems for global-warming and flammable gases
- bevel polishing systems for wafer bevel and backside treatment
- compact energy-saving dry vacuum pumps
- electroplating equipment for semiconductor production
- high-throughput CMP equipment
- leading-edge CMP systems
- plating systems for packaging