At a glance
| Booth | N0368 |
| Country | TW |
| Website | www.ebara.co.jp |
Company profile
Ebara Corporation engages with the semiconductor industry as a solution provider. Within the Ebara group, the precision machinery business uses chemical mechanical polishing and vacuum technologies to support semiconductor and panel customers in Taiwan with production equipment, technical support, and maintenance service sites.
Exhibits
Its semiconductor offering includes leading-edge CMP systems for advanced technology nodes and bevel polishing systems for wafer bevel and backside treatment. The wider product scope also includes compact energy-saving dry vacuum pumps, abatement systems for global-warming and flammable gases, and plating systems for packaging. Ebara Corporation offers lightweight air-cooled dry vacuum pumps EV-PA and EV-SA as semiconductor manufacturing equipment and component products. Its gas-treatment range includes combustion-type exhaust-gas treatment equipment, high-performance wet traps, wet exhaust-gas treatment equipment, and dry exhaust-gas treatment equipment. Ozone-related products for semiconductor manufacturing include the OZW ozone-water supply system, the OZC ozone-gas generator, and the EBANET3 centralized monitoring system. Ebara Corporation describes semiconductor manufacturing as requiring dedicated processing equipment with micrometer and nanometer-level precision together with highly integrated combinations of multiple technologies. Its CMP equipment uses a distinctive structure to achieve high operating rates and high throughput, while its bevel polishing equipment is described as flexible and capable of high-performance polishing and removal, and its plating equipment supports high throughput with flexible equipment configurations. Named CMP products include the F-REX300XA, described as Ebara's highest-production-efficiency and high-reliability CMP equipment, and the F-REX, designed for high utilization, high throughput, and high productivity. The EAC bevel polishing system uses fixed abrasive grains and combines high polishing and removal performance with an edge-control function, while the UFP600AS plating system combines high throughput, high-speed plating, and strong in-plane uniformity. Across semiconductor processes, dry vacuum pumps are used in vacuum process equipment for front-end and back-end operations such as CVD, etching, and ion implantation, exhaust-gas treatment equipment handles hazardous gases generated in semiconductor manufacturing, ozone-water equipment supports wafer cleaning and resist removal, and CMP equipment is used for planarization. The EV-M dry vacuum pump is identified for energy-saving and high-load processes, the TND combustion-type abatement system combines low NOx operation with measures for reaction by-products to reduce maintenance costs, and the OZW ozone-water system uses stable concentration and flow to support efficient and stable process treatment. Together, these product families cover vacuum generation, harmful-gas treatment, ozone-based cleaning support, CMP planarization, bevel and backside polishing, and plating within semiconductor manufacturing environments.
Capabilities and products
- CMP systems for advanced technology nodes
- wafer bevel and backside polishing systems
- semiconductor plating equipment
- semiconductor dry vacuum pumps
- combustion-type semiconductor exhaust-gas treatment
- wet semiconductor exhaust-gas treatment
- dry semiconductor exhaust-gas treatment equipment
- high-performance wet traps
- semiconductor ozone-water supply systems
- semiconductor ozone-gas generators
- semiconductor equipment centralized monitoring systems