At a glance
| Booth | Q6246 |
| Country | CN |
| Website | e-satisfy.com |
Company profile
E-satisfy semiconductor ( jiangSu) Co.,Ltd. focuses on the research, development, and production of power-semiconductor equipment and CIS equipment. Its power-semiconductor equipment includes high-end die-attach equipment with independent intellectual property and advanced process technology, with particular emphasis on power-module packaging. The company also provides high-end wire bonders and precision ovens as part of customized automatic packaging lines. Customized lines draw on system-integration experience and packaging-process knowledge for third-generation wide-bandgap materials including GaN and SiC. The technical team includes many master’s-degree holders from well-known universities in mainland China and Taiwan, with accumulated project R&D experience. Team members include engineering managers, engineering supervisors, and equipment engineers with experience at semiconductor or equipment companies including ASE, UTAC, STATS ChipPAC, BESI, and ASM. Most field-service engineers come from original equipment manufacturers, and 80% of personnel have more than 5 years of work experience. Field service includes equipment-fault handling, investigation and analysis of equipment downtime, and process-specific equipment-parameter optimization to improve UPH and OEE. The company identifies third-generation semiconductor materials as suitable for power electronics and new-energy applications because of high-voltage and high-temperature resistance. Its customer-service information lists cooperation with Fujitsu, Silan Micro, Infineon, China Resources, Huatian Technology, and Zhongtian Technology. The business scope also includes spare parts, equipment trading, on-site equipment service, equipment customization service, packaging-equipment life-cycle management service, and turnkey solutions.
Exhibits
Customized fully automatic packaging lines are built from the team’s system-integration experience and GaN and SiC packaging-process knowledge. High-end power-semiconductor die-attach equipment uses independent intellectual property and advanced process technology for power-semiconductor packaging, especially power-module packaging. The company develops and produces CIS equipment in addition to power-semiconductor equipment. High-end wire bonders and precision ovens are applied to CIS, with security cameras and mobile phones identified as application markets. Named R&D equipment includes ES CIS 5000, SCO CIS300, and BLC CIS300. The equipment portfolio also lists an Oven precision curing furnace. Agency equipment includes Shinkawa products such as UTC5000 smart card, UTC5000-series wire bonders, and the UTC5100 wire bonder. Other listed agency or equipment brands include Yamada, PFA, Nordson, SSP, Nep Tech, ATV, and additional equipment suppliers shown in the product lineup. On-site services are delivered by engineers with extensive equipment-fault-handling experience, including downtime analysis and parameter customization based on customer processes. About 80% of engineers are described as coming from equipment manufacturers, and the service information separately notes work experience of more than 5 years. The combined offering covers equipment R&D, customized automatic packaging products, power-module die attach, CIS wire bonding and curing, equipment trading, field service, customization, life-cycle management, and turnkey implementation. GaN and SiC packaging-process integration connects the automated packaging-line work with third-generation wide-bandgap semiconductor manufacturing requirements.
Capabilities and products
- Manufacturing of die-attach equipment for power semiconductors and power modules
- Manufacturing and distribution of semiconductor wire bonders
- Manufacturing of precision ovens and distribution of curing ovens
- Customized fully automated GaN/SiC packaging lines
- CIS equipment research, development and manufacturing
- Distribution of CIS production-line equipment
- Distribution of automated production-line equipment
- On-site maintenance and downtime analysis of semiconductor packaging equipment
- Process-parameter optimization for semiconductor packaging equipment
- Packaging equipment service-life management
- Supply of semiconductor packaging equipment and spare parts
- Semiconductor packaging equipment customization services