At a glance
| Booth | T9409 |
| Country | KR |
| Website | www.dshm.co.kr |
Company profile
Duksan Hi-Metal was founded in May 1999 and built its growth around solder balls used in semiconductor packaging. The company specializes in IT materials and states that it differentiates its products through development of new products and technologies while strengthening its position through the initial localization of IT materials. Its materials focus includes various soldering materials for semiconductor packages, with the company linking its development work to performance and efficiency in IT materials. Duksan Hi-Metal also states that it will continue investing in R&D and use continuing challenge and innovation to develop electronic materials and components. Its manufacturing presentation highlights constant-temperature and humidity control together with automated systems, support for various alloy compositions, manufacturing technology, and products designed for reliability and usability. The company identifies solder balls as key parts of semiconductor packaging technologies such as BGA and CSP and presents the Institute of Electronic Materials Research as an R&D organization acting on strategic thinking. Its group vision is described in terms of addressing the future materials and components market with an innovative and creative attitude, while the company also states that it values autonomy, creativity, and mutual trust.
Exhibits
Duksan Hi-Metal manufactures bonding materials for semiconductor packaging across a range that extends from micro solder balls to Cu core balls. Micro solder balls and Cu core balls are both part of the company's semiconductor-packaging bonding-material portfolio. The company describes itself as specializing in solder-based materials used in semiconductor packaging and electronic assembly processes. Its solder paste is intended for SMT processes that connect semiconductor components to PCBs. The stated solder-paste composition combines solder powder with flux, defining the paste as a joining material formulated for printing and reflow during electronic assembly. The solder paste is identified as suitable for fine-pitch applications including CSP and BGA. Key performance characteristics listed for the solder paste are high printability, wettability, and reflow performance, which are the process properties emphasized for SMT use. The broader solder-ball manufacturing environment is presented with constant-temperature and humidity control and automated systems, allowing production to support various alloy compositions. The same manufacturing presentation emphasizes manufacturing technology together with product reliability and usability as characteristics of the solder-ball business. Because solder balls are identified as key parts of BGA and CSP semiconductor packaging, the company's solder-ball and solder-paste offerings both connect directly to semiconductor packaging and assembly requirements.
Capabilities and products
- Manufacturing of semiconductor packaging solder balls, including micro solder balls
- Copper-core solder ball manufacturing
- Solder paste for fine-pitch SMT