At a glance
| Booth | T9409 |
| Country | KR |
| Website | www.dshm.co.kr |
Company profile
Since founded in May 1999, DUKSAN Hi-Metal Co., Ltd. has achieved remarkable growth through solder ball used in semiconductor packaging. We keep differentiating our products from the competitors’ by developing new products and technology and also, we try to strengthen a position by initially localizing IT materials. DUKSAN Hi-Metal Co., Ltd specialized in IT materials offers trust and great value to our customers by maximizing performance and efficiency of IT materials like various soldering materials for semiconductor packages and etc. DUKSAN Hi-Metal Co., Ltd. will prepare the future by investing boldly on R&D. We will constantly challenge and innovate to create infinite value and become the 1st INNO-Creator in electronic materials and components industry.
Capabilities and products
- solder balls for BGA packages
- solder balls for CSP packages
- solder powder for solder paste
- ultra-fine solder powder
- solder paste for SMT
- solder paste for flip chip bump formation
- DFR/WLP solder paste
- cored solder balls (CSB)