At a glance
| Booth | X0035 |
| Website | www.dow.com/en-us/market/mkt-electronics/sub-elec-mems-sensors-actuators.html |
Company profile
Dow Chemical Taiwan Ltd is the Taiwan exhibitor entity for Dow, a global materials-science company with electronics and semiconductor-related product lines. Its electronics materials portfolio and technical expertise address the electronics value chain with goals including faster processing, higher purity, higher conductivity and more sustainable solutions. Its electronics markets and solution areas include consumer devices, computing and communications, displays, telecom infrastructure, cloud and data centers, data-center cooling, aerospace and defense electronics, automotive batteries, renewable energy, energy storage, new-energy vehicles and 5G stations. The electronics portfolio includes Additives and Modifiers, Adhesives and Sealants, Amines and Chelates, Conductive Materials, Elastomers and Plastomers, Gels, Encapsulants and Conformal Coatings, Optical Materials, Plastics Additives, Polyurethanes, Resins, Binders and Film Formers, and Solvents and Glycols. Dow's Carbon Footprint Ledger enables it to offer low-carbon products to customers in the form of Product Carbon Footprint certificates. For microelectronics, MEMS and advanced semiconductor packaging, Dow supplies silicone-based materials and related solutions intended to support reliability, integration, performance, thermal stability, low moisture uptake, high purity and protection of sensitive components across broad temperature and frequency ranges.
Exhibits
DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating is presented as an eco-friendly coating suitable for mass production and harsh-condition performance, while DOWSIL™ TC-6015 Thermal Conductive Encapsulant addresses demand for higher thermal conductivity in renewable energy, energy storage, new-energy vehicles and 5G stations. Advanced semiconductor-packaging offerings include Potting Gel, Wire encapsulant, Die attach adhesive, Lid attach adhesive, TIM1, Silicone mold compound, Silicone hybrid underfill, Silicone hotmelt sheet mold, Underfill (clear), Fiber bond adhesives and Optical encapsulant. Potting gels provide soft stress-relieving protection and environmental sealing; wire encapsulants protect wire bonds from moisture, thermal stress and mechanical damage while maintaining insulation; die-attach adhesives bond dies to substrates; and lid-attach adhesives form package seals with mechanical integrity, environmental protection and thermal-stress tolerance. TIM1 gels and adhesives improve heat transfer between die and lid with coverage and low thermal resistance, silicone mold compounds protect against heat, moisture and mechanical stress, silicone hybrid underfill provides stress-buffering elasticity, clear underfill adds mechanical reinforcement with optical transparency, fiber-bond adhesives provide low-stress optical-fiber fixation, and optical encapsulants protect optical components while maintaining transparency and long-term optical performance. For MEMS and sensor modules, silicone-based materials provide low-stress encapsulation, electrical insulation and environmental protection intended to preserve sensor sensitivity through thermal cycling, vibration and harsh operating conditions. For high-performance computing and AI devices, TIM1 materials are described with high thermal conductivity, low bond-line thickness and stable coverage for heat transfer from die to lid; TIM1 gels and adhesives are designed for warpage and thermal stress, lid adhesives bond silicon die and metal lids, and silicone hybrid solutions combine silicone flexibility and thermal stability with organic-resin strength and adhesion. Silicone molding compounds use solid, solvent-free silicone hotmelt cartridges that cure after molding into flexible durable encapsulants, and silicone hotmelt sheet molding materials for panel-level packaging are solid pre-formed layers laminated onto panels and melted during molding for uniform coverage, low component stress, thermal and process stability, and large-area high-throughput PLP. For advanced interconnects and co-packaged optics, the portfolio includes optical encapsulants, adhesives, silicone hybrids and hot-melt films for dielectric performance, thermal stability, mechanical compliance, high-speed signal transmission, low power loss and reliability in AI accelerators, data centers and CPO. PIC/EIC attach adhesives support integration of photonic and electronic integrated circuits, while fiber-bond adhesives provide V-groove filling, low modulus, high optical transmission and UV or low-temperature curing; listed adjustable targets include viscosity of 50~5000cp and CTE of 50~120ppm/C over a @30~150C range, with UV curability and adhesion adjustable by PAG package and prototypes curable at 150C heat-only conditions. Encapsulants for CPO protect optical interfaces while maintaining signal integrity and alignment through thermal cycling, and their UV or low-temperature cure options support temperature-sensitive optical components. DOWSIL™ Silicone Hot-Melt Film technology is presented as a quicker, easier process than liquid silicone with reduced thermal stress.
Capabilities and products
- silicone materials for advanced semiconductor packaging
- silicone materials for microelectronics
- Potting Gel
- Wire encapsulant
- Die attach adhesive
- Lid attach adhesive
- TIM1 thermal interface materials
- Silicone mold compound
- Silicone hybrid underfill
- Silicone hotmelt sheet mold
- clear underfill
- fiber bond adhesives
- optical encapsulant