At a glance
| Booth | I2013 |
| Country | TW |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Packages; Ceramic and Other High Temp Compounds · Thermal Interface Materials; Heat Sinks · Cleaning Chemicals; Solvents; Strippers · Plasma; Ion Sources · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Sealants; Adhesives; Finishes |
| Website | www.doit-technical.com |
Company profile
DOIT TECHNICAL CO., LIMITED was established in 2019, focuses on serving as an authorized agent in Asia for professional electronic adhesive applications, specifically for key product lines from the DuPont™ & Duroptix™ and Molykote®, under Rohm & Haas (the largest fine chemical group in the United States). DOIT Technical authorized distribution various Adhesives, Sealants, Conformal coating, Lubricants, and Specific materials (specialty and electrical products) for various electronics industry manufacturers. We are providing Optoelectronic Component Packaging & Semiconductor Application materials, and Green Energy, AE. Including Conformal Coating, Encapsulants/Potting, Conductive adhesive, Die Adhesive/Chip Protection, Thermal Interface material and other related adhesive material products; and non-silicone thermal paste, heat dissipation gaskets and thermal conductive coatings. Contact Us: | Website: https://www.doit-technical.com/ | [email protected]
Capabilities and products
- conductive adhesive materials
- conformal coating materials
- die adhesive and chip protection materials
- encapsulants and potting materials
- heat dissipation gaskets
- non-silicone thermal paste
- optoelectronic component packaging and semiconductor application materials
- thermal conductive coatings
- thermal interface materials
Related product topics
- Thermal Interface Materials
- Optoelectronic Semiconductor Materials
- Thermal Paste
- Industrial Coating and Laminating Machines
- Semiconductor Packaging Materials
- Semiconductor Adhesives and Epoxies
- Conductive and Non-Conductive Bonding Adhesives
- Die Attach Compounds
- Molding, Encapsulation And Potting Resins
- Encapsulants and Potting Materials
- Conformal Coating and Adhesives