At a glance
| Booth | J3252 |
| Country | TW |
| Website | www.deright.com.tw |
Company profile
DERIGHT PRECISION MACHINERY CO., LTD. is a Taiwan supplier of process machinery and powder-processing machinery for materials manufacturing, with semiconductor relevance centered on the preparation and processing of ceramic-substrate materials and related advanced-packaging material workflows. DERIGHT PRECISION MACHINERY CO., LTD. states that its products are applied to advanced-packaging ceramic-substrate processes. Within that application, the company provides process solutions for mixing, dispersion, grinding, spray granulation, and kneading. Its powder-processing equipment is continually developed toward high performance, high reliability, lower labor requirements, and lower maintenance rates. DERIGHT PRECISION MACHINERY CO., LTD. represents equipment lines that include Ohkawara spray dryers and spray granulators. Its represented DYNO-MILL line covers grinding and dispersion systems for materials manufacturing. For semiconductor material preparation, the company links machinery for mixing, dispersion, grinding, spray granulation, and kneading into the ceramic-substrate and related advanced-packaging material-preparation workflow described for its product range.
Exhibits
The named exhibition model is DYNO®-MILL UNI LAB, part of the company's grinding and dispersion offering for material-processing applications. Other equipment identified in the same semiconductor and advanced-packaging context includes 3D shaker mixers for mixing operations and DYNO-MILL nano grinding and dispersing machines for fine grinding and dispersion. The equipment range also includes open and closed spray dryers intended for organic-solvent applications, connecting drying operations with powder and material preparation. KRC kneaders are included for kneading processes, completing the stated process sequence of mixing, dispersion, grinding, spray granulation, and kneading used in advanced-packaging ceramic-substrate preparation. Ohkawara spray dryers and spray granulators are among the represented equipment lines, while DYNO-MILL systems cover grinding and dispersion functions in the materials-manufacturing workflow. These machines are positioned for ceramic-substrate and related advanced-packaging material workflows rather than semiconductor wafer-processing steps, with emphasis on the preparation and processing of materials before they enter downstream package structures. Across the stated equipment portfolio, DERIGHT PRECISION MACHINERY CO., LTD. supplies separate machines for mixing, dispersing, grinding, drying or spray granulation, and kneading so a customer can assemble the process functions required by the material system.
Capabilities and products
- Powder mixing process solutions for advanced-packaging ceramic substrates
- Powder dispersion process solutions for advanced-packaging ceramic substrates
- Supply of powder milling equipment for advanced-packaging ceramic substrates
- Spray granulation process solutions for advanced-packaging ceramic substrates
- Kneading process solutions for advanced-packaging ceramic substrates