At a glance
| Booth | I2020 |
| Country | DE |
| Website | www.delo-adhesives.com/cn |
Company profile
DELO Industrial Adhesives manufactures high-tech adhesives and multifunctional materials and also provides dispensing and curing technologies for industrial production. Its products are used in automotive, consumer-electronics, and semiconductor industries and are described as being present in almost every mobile phone and most cars worldwide, including applications in cameras, speakers, electric motors, and sensors. For semiconductor components including bare die, packages, and SMD, DELO Industrial Adhesives has developed specialized bonding and packaging products intended to improve overall application performance. Its semiconductor packaging range includes reinforcement adhesives, die-attach adhesives, other packaging adhesives, and adhesives for hermetic packaging, with reliability improvement identified as an application objective. The company supports customers through locations and a service network distributed globally, connecting its adhesive, dispensing, and curing technologies with applications in multiple industries.
Exhibits
DELO Industrial Adhesives offers multiple curing routes, including rapid ultraviolet and visible-light curing through the DELOLUX series and controlled heat-curing processes through MONOPOX products. Its curing portfolio includes light curing, heat curing, dual curing, moisture curing, anaerobic curing, two-component adhesives, Flow-through Activation, and pre-activation, allowing the curing approach to be selected according to the material, production process, and bonding requirements. Light-curing products include KATIOBOND and PHOTOBOND for rapid curing, with cited applications such as protecting smart-card chips in Dam & Fill processes, fixing parts in pre-activation processes, and bonding mobile-phone speaker components including voice coils, magnetic systems, and diaphragms within seconds. DELO DUALBOND combines light fixation or light curing with a second curing mechanism so bonding can continue reliably in shadowed areas, and examples include rapid camera-module positioning followed by thermal curing, sensor-cavity sealing under ambient humidity, and magnet fixation followed by curing in narrow gaps. Heat-curing adhesives are offered for requirements involving mechanical protection, chemical resistance, and temperature resistance, with stated curing temperatures from 60 °C to 150 °C and product options ranging from stress balancing to high strength, including DELO MONOPOX single-component or two-component heat-curing adhesives. For moisture curing under ambient conditions, DELO Industrial Adhesives provides silicone systems such as DELO-GUM, MS polymer systems such as DELO-PUR, light-preactivated moisture-curing DELO PHOTOBOND LA, and light-precurable, moisture-curing DELO DUALBOND for sealing, coating, potting, and flexible bonding applications. Anaerobic DELO-ML products are intended for reliable bonding without oxygen, especially for metal assembly and thread locking, with uses including closely fitted metal surfaces, threaded connections, bearings, cylindrical components, sealing, and fixation. Two-component adhesives and potting materials are offered where simple room-temperature handling and storage and reliable curing without additional energy input are required; DELO-DUOPOX is an epoxy-based two-component adhesive and DELO-PUR includes polyurethane- or MS-polymer-based two-component systems. With Flow-through Activation, the pre-activation step can be integrated into dispensing, after which the adhesive cures under ambient conditions; selectable chemistries include epoxy resin DELO KATIOBOND and modified polyurethane DELO PHOTOBOND activated with light in DELO ACTIVIS. In the pre-activation process, the adhesive remains liquid for a defined period after exposure called the open time, the components must be bonded within that open time, and curing then proceeds at room temperature without additional energy input. Pre-activation can also be used to bond large components at room temperature, avoiding stress caused by differences in coefficients of thermal expansion. DELO Industrial Adhesives supplies equipment matched to its adhesives, including dispensing systems for precise adhesive application, conveying systems for uniform adhesive distribution, ultraviolet curing lamps for rapid curing processes, and system solutions integrating dispensing and curing. Its functional materials and customized adhesive solutions are applied across semiconductor packaging, medical electronics, automotive, smart cards and labels, consumer electronics, industrial solutions, optoelectronics, aircraft interiors, and other fields, with the stated purpose of matching specific technical and production requirements. DELO Industrial Adhesives develops curing methods to improve adhesive performance, including strength, flexibility, and durability, while supporting efficient and reliable bonding for applications such as sensitive electronics, automotive components, and medical devices. The company also presents adhesives as an alternative to mechanical joining and identifies durability under demanding conditions, efficient production processes, broad application coverage, continued production through innovation, and flexibility through customized solutions among the advantages of its adhesive portfolio.
Capabilities and products
- Semiconductor die-attach adhesives
- Semiconductor reinforcement adhesives
- Adhesives and encapsulants for SMD components
- Adhesives for hermetic packaging
- Dam & Fill chip encapsulants
- Cationic light-curing epoxy adhesives
- Light-activated modified polyurethane adhesives
- Heat-curing adhesives
- Dual-curing adhesives with shadow-area curing capability
- One-component silicone elastic adhesives
- Silicone-free MS polymer flexible sealants
- Anaerobic adhesives for metal assembly and threadlocking
- Two-component epoxy adhesives
- Two-component polyurethane or MS polymer adhesives
- Room-temperature-curing two-component potting materials
- Preactivated bonding of opaque components
- Integrated flow-through activation for dispensing
- Adhesive dispensing systems
- Adhesive delivery systems
- UV curing lamps
- Rapid UV and visible-light curing technology
- Dispensing and curing system integration
- Customized functional materials