At a glance
| Booth | P5400 |
| Country | TW |
| Website | cotec.com.tw/tw |
Company profile
Core Technology Co., Ltd. | Full-temperature-range semiconductor packaging and inspection solutions | Industry 4.0 automation Our mission is to provide the global semiconductor industry with high-performance, full-temperature-range packaging and inspection solutions. We firmly believe that only through continuous technological innovation and system integration can we help customers accelerate product design and drive the diverse application and sustainable development of high-end chips such as those for AI and graphics, becoming an important driving force in the future smart world. Rooted in Taiwan with a global outlook, Core Technology is dedicated to building an internationally competitive semiconductor packaging and inspection technology platform, valuing long-term cooperation and shared value creation with customers, partners, and employees. Through smart manufacturing and Industry 4.0 automation applications, we connect the upstream and downstream of the industry chain, promote industrial upgrading and the standardization of technology, and work together toward a more efficient, intelligent, and sustainable future for the global semiconductor industry. Core Technology is committed to deeply cultivating its core business, driven by innovation and grounded in technology, dedicated to developing forward-looking key technologies for semiconductor packaging and inspection, expanding application markets, and connecting global demand. We actively promote smart manufacturing and Industry 4.0, helping the industry optimize processes, enhance competitiveness, and steadily strengthen brand trust and international influence. We believe that corporate growth is not merely the expansion of operational scale, but also a contribution of value to the industry and society. Core Technology joins hands with customers and partners to co-create innovation in semiconductor inspection technology and seize opportunities in the future AI market. With continuous improvement at its core, we implement standardized operations for design and development, manufacturing, and delivery. Taking customer requirements as the starting point for R&D and design, we rigorously carry out process control, quality assurance, and delivery management to ensure products of high quality, reliability, and stability, helping customers improve production yield and operational efficiency and maximize value for both parties. We effectively reduce costs and improve production efficiency, focus on the core technologies of semiconductor packaging and inspection equipment, deepen automation integration and temperature-control cooling system technologies, introduce smart manufacturing, and continuously provide customers with high-value-added solutions to consolidate our leading technological advantage in the market.
Capabilities and products
- full-temperature-range semiconductor inspection solutions
- full-temperature-range semiconductor packaging solutions
- system integration for semiconductor packaging and inspection
- temperature-control cooling system technology