At a glance
| Booth | P5400 |
| Country | TW |
| Website | cotec.com.tw/tw |
Company profile
CORE TECHNOLOGY CO., LTD. focuses on high-performance, full-temperature-range semiconductor packaging and testing solutions for the global semiconductor industry. The company is based in Taiwan and describes its direction as building a globally competitive semiconductor packaging and testing platform that connects with global demand. Its technical direction combines continuous innovation, system integration, smart manufacturing, and Industry 4.0 automation to support advanced-chip applications including artificial intelligence and graphics. CORE TECHNOLOGY CO., LTD. states that smart manufacturing and Industry 4.0 automation connect upstream and downstream supply chains while supporting industrial upgrading and technical standardisation. The company emphasizes long-term cooperation and shared value creation with customers, partners, and employees. Its management principles include developing forward-looking products, implementing Industry 4.0 to optimize processes, focusing on high-value markets, integrating resources, and building brand value and customer loyalty through technology and quality. CORE TECHNOLOGY CO., LTD. describes innovation as a driver and technology as its foundation, with work centered on forward-looking semiconductor testing technologies and broader application markets. Its quality policy places continuous improvement at the center of operations and standardises design, development, manufacturing, and delivery processes. Research and development begins from customer needs, with process control, quality assurance, and delivery management used to support product quality, reliability, and stability. The company states that these practices are intended to improve client yield rates and operational efficiency while reducing costs and raising production efficiency. Its core technical focus includes semiconductor packaging and testing equipment, automation integration, temperature-control systems, and smart-manufacturing processes.
Exhibits
CORE TECHNOLOGY CO., LTD. provides research, design, and manufacturing services for back-end test handlers and automatic temperature control systems, together with full-temperature-range packaging inspection solutions. The company states that its temperature-control performance is more than twice that of industry peers and combines the equipment with intelligent automated loading and unloading and automated logistics functions. Its sorting and test solutions support integration with multiple clamping fixtures to improve test efficiency and quality, while integrated temperature-controlled grippers maintain stable product temperature during high-precision chip testing. The company also provides one-stop back-end testing and packaging-inspection integration from design through manufacturing to strengthen production-line integration efficiency. Its CoWoS Advanced Packaging Test Systems include the CT-2518 FT IC Test Handler with Advance Active Thermal Control (ATC) Ver.8.0. The CT-2518 supports a full temperature range of -70℃ to +185℃, package IC sizes from 3 × 3 mm to 60 × 60 mm or customised sizes, and kit exchange in less than 15 minutes. Equipment functions include an electric lifting platform, employee-ID-card permission control, fisheye monitoring, self-designed AGV and OHT for tray loading and unloading, and four bins with customisation up to 30 bins. The CT-2518 handler body measures 1400 mm wide by 1400 mm deep by 2100 mm high, with a maximum test-area dimension of 980 mm by 980 mm by 360 mm and an approximate weight of 950 kg. Its test-site opening is 195 × 145 mm and its docking type is vertical docking. The power requirement is single-phase AC220V at 30A × 2, 50/60Hz, ±10%, with a maximum of 13.2KVA including ATC. The tester interface is GPIB, with RS232, TTL, and SECS-GEM listed as options. Applicable package types include QFP, TQFP, CSP, PLCC, QFN, BGA, LGA, PGA, TSOP, SOC, and InFO, with device-body dimensions from 3 × 3 mm to 60 × 60 mm or customised sizes. The listed test-site pitch is 2 × 3 with X=60 mm and Y=60 mm, maximum throughput is 200 to 2000 pcs/hr, index time is approximately 1 to 2 seconds, and the specification lists a jam-rate entry of approximately 16,000 units. The handler uses JEDEC trays, with 220 mm stroke for both input and output tray loader and unloader capacity, and a catch-mode tray arm. Operating modes include an on-line automatic mode with tester link and an off-line automatic mode without tester link. The socket height is 150 mm, contact is listed as direct contact or drop, and the binning arrangement has four JEDEC-tray-based bins, four auto tray unloaders, four fixed trays, and an optional bin extension station up to 30 bins. Heating uses the ATC 8.0 System plus a heater, contact force is up to 480 kgf, and ESD provisions include two ionizer bars and four ionizer guns with 1KV reduced to 100V within 2.5 seconds and a ±20V balance specification. Dry-air requirements are 5 kg/cm2 dry and clean air with consumption above 250 L/min. ATC has a setting range of TC -70℃ to 185℃ with ±1℃ accuracy for full-range active thermal control, and a work range of TC -60℃ to 175℃ with ±2℃ stability. For -50℃ applications, the equipment side must provide -60℃ dry air; single-site heat dissipation is listed as -55℃@50W, 25℃@180W, and 100℃@300W. The listed temperature transition time is less than 10 minutes from -55℃ to 175℃ and 30 minutes from 175℃ to -55℃. Facility water specifications are 3/8 inch UNF, 2.5 to 4.5 kg/cm2 pressure, 50 L/min flow, and 13 to 18℃ temperature, with air cooling or water cooling selectable. AGV and OHT support are both identified as self-developed functions in the CT-2518 specification.
Capabilities and products
- back-end test Handler R&D, design and manufacturing
- ATC temperature-control system R&D, design and manufacturing
- -70℃~+185℃ full-range package testing
- intelligent automated loading and unloading
- AGV/OHT automated tray load/unload
- multi-clamping-fixture integration
- integrated temperature-controlled gripper