At a glance
| Booth | N0662 |
| Country | TW |
| Website | www.contrel.com.tw |
Company profile
Contrel Technology Co., Ltd., a reinvestment business of the Tongtai Group, was founded in 1998 and began by designing and manufacturing testing equipment for the semiconductor industry. In 1999, the company expanded its R&D and manufacturing into panel equipment as the optoelectronics industry grew, and in 2004 it focused on TFT-LCD processing equipment, testing and repairing equipment, and automated equipment. As its market changed, Contrel Technology Co., Ltd. expanded beyond panel-related equipment into the laser industry, established a Laser R&D Center, and extended laser applications into PCB, semiconductor, and packaging industries. Through Taiwan's Laser Valley initiative, the company developed laser-related technology and broadened the use of laser processes in these manufacturing sectors. In 2014, Contrel Technology Co., Ltd. formed Cyber Laser Taiwan at the Southern Taiwan Science Park with the Tongtai Group and Cyber Laser Japan to bring picosecond-laser and femtosecond-laser technologies to market. Its customers are located across Taiwan and Mainland China, and the company maintains its headquarters at the Southern Taiwan Science Park together with offices at the Central Taiwan Science Park, Hsinchu Science Park, Ningbo, Foshan, Shenzhen, Nanjing, Shanghai, Wuhan, Hefei, and Chengdu. Contrel Technology Co., Ltd. uses this regional service network to provide faster, higher-quality support while integrating advanced technology into equipment for customers from diverse industries.
Exhibits
For precision machining of glass core substrates (GCS), Contrel Technology Co., Ltd. provides Laser Grooving × Laser Cutting with No SeWaRe, No Delamination, minimal roughness, and Chipping characteristics for volume-production requirements. For bright-spot or bright-line defects in the LCD Cell process, its repair equipment finds the defect and performs repair using Air Flow Table or Al Bar Table configurations, real-time Auto Focus, and front-side or back-side repair designs. For LCD-layout shorting bars, laser processing cuts the shorting ring for downstream processes, supports both aluminum-metal and copper processes, and combines a pulsed fiber laser with CCD imaging for immediate inspection of cutting quality. That shorting-bar cutting function specifies real-time cut-quality inspection, a cutting speed of 400mm/s, a detection success rate of ≧99%, and support for warped products of ≦3mm. For TFT-LCD Metal open/short and PR open/short defects, a high-precision ink-jet and laser system repairs functionality through Printing→Curing→Patterning, operates in atmosphere without special gas, and adjusts coating width without changing the nozzle. For glass processing, high-power laser systems perform cutting, modification, and thermal cleaving using Pico IR focused-lens processing on the PI surface, Pico IR long-beam processing on the glass surface, and CO2 laser thermal cleaving, with an applicable size of 550mm*550mm. For bright-spot defects on assembled glass, a Femtosecond laser carbonizes Color Resist into a dark spot and supports repair of glass substrates before or after polarizer attachment for TN and IPS products. Semiconductor Laser TRM supports synchronized operation on both sides of a carrier board, precise removal of adhesive spillage from edges, and glass-carrier recycling. Its TRM process capability specifies a trimming-size adjustable range of 50mm, re-notch width of 3.5±0.2mm, marking depth ≦50um, SEMI Font, product size Ø300mm(12inch), product thickness 1~2mm, and an adsorbable rotating stage. The same TRM equipment specifies a 30x30mm laser-scanning area with 60um spot size, laser-processing accuracy of ±30um, dust collection, and processing of compound and polymer materials. Semiconductor Laser Debond supports 12-inch wafers, 300PNL, and 600 PNL products with Glass or Silicon carriers and UV, IR, or NIR laser sources, while using selected wavelengths intended to avoid wafer damage and a stable, low-maintenance structure. For FAN OUT PLP, the plasma-etching equipment supports seed-layer etching, Descum, Desmear, and carbon-layer removal after laser debond, with fully automatic Cassette In and Cassette Out handling and panel sizes up to 650*650mm. Its microwave-plus-bias-source plasma design is intended to shorten etching time and reduce gas emissions, different functional chambers can be configured according to application needs, and the equipment conforms to SECS GEM and SEMI S2 equipment certification. Across these semiconductor applications, Contrel Technology Co., Ltd. combines laser grooving and cutting, defect repair, laser debond, trimming, glass processing, and plasma etching with process-specific handling, inspection, and automation functions.
Capabilities and products
- design and manufacturing of semiconductor testing equipment
- panel-equipment R&D and manufacturing
- TFT-LCD processing equipment
- TFT-LCD testing and repairing equipment
- TFT-LCD automated equipment
- laser-application development for PCB, semiconductor and packaging
- picosecond and femtosecond laser application equipment
- glass-substrate Laser Grooving × Laser Cutting
- LCD Cell bright-spot/bright-line defect repair
- LCD shorting-ring laser cutting
- TFT-LCD Metal/PR open-short repair
- glass laser cutting, modification and thermal cleaving
- femtosecond-laser darkening repair for glass bright spots
- semiconductor laser trimming equipment (TRM)
- semiconductor Laser Debond
- semiconductor glass cutting equipment
- semiconductor laser circuit-repair equipment
- parts laser cleaning
- FAN OUT PLP plasma etching equipment
- seed-layer etching / Descum / Desmear / carbon removal after laser debond
- PLP RDL OM automated optical measurement
- vacuum single-wafer magnetron sputtering system