At a glance
| Booth | N0562 |
| Country | TW |
| Website | www.coherent.com |
Company profile
Coherent Corp. develops technologies from materials to systems for industrial, communications, electronics, and instrumentation applications, and it operates as a photonics company that uses materials, optics, lasers, thermoelectrics, and compound-semiconductor platforms across these markets. Founded in 1971, Coherent Corp. operates in more than 20 countries and describes its technology stack, supply-chain resilience, and global scale as resources for customers facing demanding technology challenges. Coherent Corp. is headquartered in Saxonburg, Pennsylvania, and maintains research and development, manufacturing, sales, service, and distribution facilities worldwide. For more than 50 years, Coherent technology has supported advances in industrial laser technology used to improve manufacturing efficiency and to make products ranging from automobiles to medical devices. Coherent Labs provides laser expertise that customers use to expand materials-processing capabilities and support Industry 4.0 manufacturing. In communications, Coherent Corp. supplies optical-communications products for the network infrastructure that supports internet and cloud services. In electronics, Coherent Corp. applies compound-semiconductor technology to consumer-electronics and automotive uses, including semiconductor lasers used at the front of smartphones for facial biometric measurements and at the back for scanning surroundings in augmented-reality applications. For instrumentation, Coherent Corp. combines expertise in materials, optics, lasers, and thermoelectrics in products that are integrated into high-performance subsystems and manufactured at scale for customers. Across its industrial, communications, electronics, and instrumentation activities, Coherent Corp. supports customers through a global organization spanning technology development, manufacturing, sales, service, and distribution.
Exhibits
Coherent Corp. provides advanced optical solutions for next-generation AI networks, hyperscale datacenters, global communications, and high-speed optical transmission systems, networks, and datacenter solutions. Its engineered materials and high-precision laser technologies support manufacturing and research applications ranging from smartphones and EVs to semiconductor wafers and medical diagnostics. Coherent Service supports laser systems to safeguard productivity, maximize uptime, and protect the customer's investment in the equipment. Its InP portfolio includes lasers, modulators, photodiodes, and subsystems for next-generation datacenter architectures and high-performance optical engines. Specific InP products include a 400mW high-power CW laser for co-packaged optics (CPO) and silicon-photonics pluggables, plus 200G EML solutions for 1.6T transceivers. The same portfolio includes differential EMLs (D-EML) enabling 400G/lane performance for emerging pluggables at 3.2T and beyond, together with high-speed 200G and 400G photodiodes. Scale-across transmission products include nano-Integrated Tunable Laser Assemblies (nITLA), 800G and 1.6T IQ modulators, and other optical subassemblies, while the overall InP set spans scale-out, scale-up, and scale-across applications using CPO, pluggable transceivers, and optical transport solutions. For semiconductor manufacturing equipment, Coherent Corp. supplies optics, lasers, and composite materials for advanced-chip and next-generation-packaging tools, including wafer-manufacturing equipment intended to maximize throughput and yield and advanced-packaging equipment intended to improve dicing, packaging, and testing accuracy and throughput. Its semiconductor-packaging materials are also used to improve thermal management for thinner microelectronic components. For advanced packaging and interconnects, metal-matrix composites provide mechanical parts with improved flatness, stiffness, and thermal conductivity at lower weight, while lasers perform drilling, cutting, and non-contact marking operations. Advanced-packaging applications include wafer dicing with high-power ultrashort-pulse lasers for low-κ dielectric scribing and full ablative dicing, optical debonding of delicate electronic components, and laser-assisted bonding for high-speed packaging of smaller and thinner dies. Other advanced-packaging applications include PCB and IC-substrate via drilling, IC-package trimming with AVIA NX lasers, high-speed probing on metal-matrix-composite wafer stages, precision ceramic processing, low-stress PCB depaneling, and laser marking across semiconductors, polymers, ceramics, and metals. Thermal-compression-bonding nozzles support high-volume chip attach with high alignment accuracy and yield, while high-speed laser solutions support Through Glass Via (TGV) drilling and glass cutting for panel-based advanced packaging. Advanced-packaging product families include DIAMOND J-Series compact CO₂ lasers, PowerLine AVIA NX high-power UV laser cutters, AVIA LX lasers with UV and Green output, HyperRapid NXT high-power picosecond lasers, Monaco high-power femtosecond lasers, Rapid LX UV micromachining lasers, COMPex UV lasers, and HighLight DL Series fiber-coupled multi-kW diode lasers. The advanced-packaging range also includes processing heads that combine precision focusing optics with galvanometer scanning, PowerLine Series lasers for 3D marking, on-the-fly marking, engraving, and serialization, plus ceramics and optics capabilities for component and system integration. For wafer manufacturing, Coherent Corp. supports tools from 3 nm processes through 100 nm+ nodes with lasers, optics, hybrid ceramics, silicon carbides, advanced composites, CO₂ laser optics, and diamond windows. Wafer-manufacturing applications include EUV laser optics for shaping and delivering high-power CO₂ beams, reaction-bonded silicon carbide for structural components in EUV lithography tools, and wafer inspection using high-power ultraviolet laser sources and high-flatness advanced ceramics. Additional wafer applications include nanosecond and ultrashort-pulse wafer marking, precision dopant activation by laser annealing, etch and deposition equipment using lightweight high-stiffness etch-resistant ceramics, and pulsed-laser deposition for uniform thin-film coatings. Mask-related applications use excimer and optically pumped semiconductor lasers for mask writing and use fab-certified 193 nm excimer lasers, 266 nm DPSS lasers, and ion lasers for mask inspection. Coherent Corp. also provides ion-implantation foundry services and disk-refurbishment services spanning production and R&D requirements, with the ion-implantation service positioned to support varying volumes, applications, and demand spikes. Named wafer-manufacturing laser families include INNOVA Series ion lasers, Azure NX continuous-wave 266 nm deep-UV lasers, Paladin Series green and UV quasi-CW USP lasers, IndyStar high-duty-cycle UV excimer lasers, and Genesis lasers spanning 355 to 1154 nm and 100 mW to 10 W. The wafer-manufacturing range further includes DC Series multi-kW CO₂ slab lasers, Revolution high-energy kHz green lasers, COMPex UV lasers, Sapphire CW lasers with up to 1000 mW output, and OBIS LS/LX compact smart lasers with more than 30 wavelengths from UV to near-IR and optional fiber delivery. Materials and component offerings for wafer equipment include ceramics, CVD diamond substrates with broad transmission, hardness, and resistance to thermal shock and thermal lensing, acousto-optic and electro-optic devices and subassemblies, and 850 nm single-mode polarization-locked VCSELs for sensing applications. Across both advanced packaging and wafer manufacturing, Coherent Corp. combines laser sources, optical components, engineered materials, processing heads, and service capabilities for equipment builders and semiconductor process applications.
Capabilities and products
- InP lasers, modulators, photodiodes and subsystems
- 400mW CW laser for CPO and silicon photonics
- 200G EML for 1.6T transceivers
- 400G/lane D-EML for 3.2T and beyond
- 200G/400G high-speed photodiodes
- ultrashort-pulse lasers for wafer dicing
- laser solutions for optical debonding
- lasers for laser-assisted bonding
- high-speed lasers for TGV drilling and glass cutting
- lasers for precision dopant activation
- mask-writing lasers
- 193nm/266nm lasers for mask inspection
- ion implantation foundry services
- ion-implantation disk refurbishment