At a glance
| Booth | N0050 |
| Country | CN |
| Website | en.cfmee.cn/product/11.html |
Company profile
CIRCUIT FABOLOGY MICROELECTRONICS EQUIPMENT CO., LTD. (CFMEE) was founded in June 2015 in Hefei, China and focuses on semiconductor and PCB equipment built around micro-nano direct-write lithography technology. The company was listed on the Shanghai Stock Exchange STAR Market in 2021 under stock code 688630.SH and on the Main Board of the Hong Kong Stock Exchange in 2026 under stock code 09630.HK. Its headquarters are in the IC Industry Base of Hefei High-tech Zone in Hefei, Anhui Province, and it operates an intelligent R&D and manufacturing base of more than 70,000 square meters integrating R&D, production and office functions. CFMEE specializes in the research, development and production of direct imaging equipment and direct writing lithography equipment, while its broader portfolio includes automation systems for the pan-semiconductor industry, direct imaging and solder-mask imaging equipment for PCB production and laser direct-imaging equipment for other applications. Its customer coverage extends across South China, Central China, East China, Chinese Taiwan, Japan, South Korea, Vietnam, Thailand and other markets. Service centers include the Shenzhen Branch, Suzhou Branch, Thailand Branch, Chinese Taiwan and the Jiangxi Office, and the company states that each service center is equipped with a spare-parts warehouse. The company states that it provides full-lifecycle product solutions in addition to R&D, manufacturing and sales of semiconductor and PCB equipment. CFMEE states its mission as "Litho is changing the world." and its vision as "IC Equipment, World Brand." Its stated core values are customer-centricity, honesty, openness and introspection, ownership and accountability, and its stated spirit combines innovation, craftsmanship, striving and cooperation. CFMEE also states that, as the first drafting unit of a group standard and the only human-resources outsourcing service organization in the industry, it led re-evaluation of the Shanghai Certification Association standard "Human Resources Outsourcing Service Certification Requirements T/SCA120001-2018", officially released in July 2021. In 2015-2016, CFMEE lists micro-nano direct-writing lithography innovation and entry into semiconductor and PCB lithography markets, followed in 2017 by entry into IC-substrate and AMOLED lithography and the first equipment export to Chinese Taiwan. In 2018 CFMEE entered the PCB solder-mask market; CFMEE Park entered use in 2019-2020, and the company listed on the SSE STAR Market on April 1, 2021. Subsequent milestones include entry into a middle-end head customer in 2022, entry into the FPD mass-production lithography market and cumulative shipments of more than 1,000 units in 2023, capping of the park's second phase in 2024 and putting that second phase into operation in 2025. In 2026, CFMEE listed on the HKEX Main Board.
Exhibits
CFMEE's IC-equipment portfolio covers middle-end, bonding, MEMS, power-device, IC-substrate, lead-frame and flat-panel applications, with direct-writing lithography, direct imaging and automation systems across those process areas. WLP 2000 is a Wafer Level Package Direct Writing Lithography System that uses digital lithography to transfer an image directly, without a mask, onto a substrate coated with photosensitive material for 8-inch and 12-inch middle-end applications. WLP 2000 uses multiple optical engines for parallel scanning and includes automatic alignment, back alignment, intelligent shift correction and WEE/WEP functions for processes including RDL, Bumping, TSV and System on Wafer (SoW). Its feature set also includes Die-shift smart compensation, RDL intelligent pattern distribution, real-time autofocus, edge-exposure WEE/WEP and backside alignment. CFMEE positions WLP 2000 within a one-stop solution spanning metrology, exposure and inspection. The system supports 12-inch and 8-inch wafers, with listed minimum lines and spaces of 2μm and overlay accuracy of ±0.6μm. CFMEE notes that those WLP 2000 performance data are derived from its laboratory tests and may vary with the actual use environment. PLP 3000 is a Panel Level Package Direct Writing Lithography System that also transfers images directly without a mask onto photosensitive substrates and is intended primarily for middle-end applications. PLP 3000 supports copper-clad laminates, composite materials and glass substrates, and includes Die-shift smart compensation, RDL intelligent pattern distribution and real-time autofocus designs intended to address warped panels. Its listed panel size is 600 x 600mm, with minimum lines and spaces of 3μm and overlay accuracy of ±2μm, and it also supports the company's metrology, exposure and inspection one-stop solution. WB 8 Wafer to Wafer Bonder handles wafers up to 8 inch for middle-end, MEMS and other semiconductor fields and combines a symmetric rapid heating-and-cooling system with a high-force system for bonding processes including anodic and thermo-compression bonding. WB 8 is listed with force up to 100kN at temperatures up to 550°C, automated operation, temperature and force uniformity, a high-vacuum bonding chamber, rapid vacuum pumping, heating and cooling, multi-user management software and oil-free systems. WA 8 Wafer to Wafer Aligner aligns two wafers and maintains alignment until bonding, supports 4-inch, 6-inch and 8-inch wafers and is intended for middle-end, MEMS and other applications requiring submicron-range alignment and high repeatability. WA 8 supports transparent and non-transparent materials, uses an alignment platform with a submicron-range axis and a specially designed WEC, and provides fast switching between wafer sizes. The aligner also lists an optional maintenance-free independent AVT and multi-user management covering user permissions, system languages, menus and process control. LDW 350/500 Direct Writing Lithography System uses DLP digital lithography with a high-precision motion platform, optical system and microenvironment control system, together with real-time autofocus and automatic centering. MLC 600 Direct Writing Lithography System Series transfers designed patterns without a mask onto photosensitive substrates in a compact system designed for universities, laboratories and research institutions. MLC 600 applications include fabrication of MEMS microphones, pressure sensors, accelerometers, gyroscopes, ultrasonic sensors and piezoelectric sensors, as well as photomask making, with listed functions including auto alignment, backside alignment, user-defined alignment marks and automatic real-time autofocus. MLF Direct Writing Lithography System Series applies maskless digital lithography to photosensitive substrates for third-generation semiconductor silicon-carbide processes and applications including IGBT and ceramic packages. The MLF series is described with compact structure, large depth of focus, high throughput and process compatibility with dry film and photoresist for mass-production use. MLF is also listed for patterning and traceability of power modules, advanced packaging and ceramic substrates, with minimum lines and spaces of 6μm, maximum panel size of 12 x 12 inches, auto alignment, backside alignment and user-defined alignment marks. NEX Solder Mask DI Series is suitable for multiple solder-mask ink colors and is specified for IC Substrate and SLP applications with high yield, high accuracy, small SRO and small side-wall performance. MAS Pattern DI Series targets IC substrates such as FC-BGA and FC-CSP, supports commonly used dry films and uses DMD technology and high-resolution data analysis to control fine-line width uniformity and edge roughness while supporting high throughput. LDW-RTR 25DE Double-sided Direct Writing Lithography System uses DMD technology and high-precision data resolution for a listed minimum 25μm fine line, with line-width uniformity and edge-roughness control. CFMEE's automation offering is designed to automate circuit, solder-mask and substrate processes and provide overall intelligent exposure-process solutions for customers in different fields. For IC substrates, its online direct-imaging automatic line can be customized and combines high-precision visual imaging with a servo closed-loop positioning system to support automated production, higher cleanliness and higher intelligence. Solder Mask DI Automation is intended for MLB and HDI solder-mask processes and is described with stable, accurate transfer, non-stick ink protection and compatibility with automated board-storage solutions. Automation for Pattern LDI serves MLB and HDI pattern processes with accurate transfer, higher production capacity and operational convenience, and compatibility with multiple automatic board loading and unloading solutions. Core features of Automation for Pattern LDI include accurate and effective transfer action, higher production capacity and operational convenience, and compatibility with various automatic board loading and unloading solutions for Pattern process. An Automation with Internal Flipper for Single Machine is also listed for MLB and HDI pattern processes with the same transfer, capacity, convenience and automated loading and unloading capabilities.
Capabilities and products
- wafer-level packaging direct-write lithography systems
- panel-level packaging direct-write lithography systems
- wafer-to-wafer bonding equipment
- wafer-to-wafer alignment equipment
- DLP digital direct-write lithography systems
- direct-write lithography for MEMS device fabrication
- direct-write lithography for photomask making
- direct-write lithography for silicon-carbide processes
- direct-write lithography for IGBT and ceramic packaging
- direct-write lithography for power-module and advanced-packaging patterning and traceability
- direct imaging for multiple solder-mask ink colors
- direct imaging for FC-BGA/FC-CSP IC substrates
- double-sided direct-write lithography systems
- customized direct-imaging automation lines for IC substrates
- MLB/HDI solder-mask process automation
- MLB/HDI pattern LDI automation
- single-machine automation with internal flipper
- one-stop lithography metrology, exposure, and inspection solutions