At a glance
| Booth | X0025 |
| Country | TW |
| Website | www.chung-i.com |
Company profile
CHUNG I SILVER SOLDER CO., LTD. was established in 1978 and has more than 40 years of experience in precision soldering technology and the development of technical solutions. The company has focused on developing technology and maintaining stable quality with support from the industrial sector. Its manufacturing range extends from silver brazing alloys and high-tech soldering materials to fuse conductivity wires, advanced glass soldering wires and tri-foil alloys. In 1986, CHUNG I SILVER SOLDER CO., LTD. invested in an abrasive factory in Taiwan to expand its capabilities. The company established a branch factory in Dongguang, China, which began production in 2003 as part of its effort to expand global reach. Most of its products are manufactured in Taiwan. Customization support includes a wide range of product sizes and shapes together with accommodations for specific labeling and packaging requirements. The company also provides consulting services focused on manufacturing best practices, production-process optimization and efficiency improvement. Its stated operating principles emphasize integrity, innovation and continuous improvement while continuing product development, quality enhancement and customer-service improvement. Its precision-soldering technology is trusted by global manufacturers.
Exhibits
The product portfolio includes silver brazing alloys and high-tech soldering materials. It also includes fuse conductivity wires, advanced glass soldering wires and tri-foil alloys. The HG10 series is a single-component, thermally curable, epoxy-based conductive silver adhesive designed for LED and IC die-attach applications. HG10 supports high-speed dispensing and dipping processes and is formulated for smooth application without tailing, stringing or splashing. The adhesive is intended to provide strong and stable bonding on Ag-plated frames, copper frames, PPF frames, ceramic lead frames and FR-4 PCB substrates. Its listed features include high electrical conductivity, high thermal conductivity for heat dissipation, bonding strength, long-term reliability and compatibility with automated dispensing and die-attach processes. The bonding performance on the listed lead-frame and PCB materials is intended to enhance semiconductor-device reliability. A stable residual adhesive pattern is also identified as a feature intended to improve device performance. HG10 application areas include integrated circuits, consumer-electronics assemblies, MEMS sensors, camera modules and LED packaging. Touch Screen Silver Pastes are designed for capacitive and resistive touch-screen applications. These pastes are intended to improve conductivity, anti-interference performance and touch-response speed while forming a finer and more uniform conductive layer with lower surface resistance and capacitance. They are optimized for laser engraving and laser etching and support micron-level circuit definition for fine patterns and complex structures. Compatible substrates include PET, glass and ITO film. The touch-screen silver-paste features include stable lap resistance with ITO, laser processing at ≥ 30/30 μm line width / spacing, chemical stability, corrosion resistance, heat-press resistance, enhanced sensitivity and fast response performance. Primary applications include smartphones, tablet PCs, smart-home control panels, self-service kiosks and interactive educational and display devices.
Capabilities and products
- silver brazing alloys and soldering materials manufacturing
- fuse conductivity wire manufacturing
- glass soldering wire manufacturing
- tri-foil alloys manufacturing
- conductive silver adhesive for LED and IC die-attach
- touch screen silver paste
- laser-processable touch silver paste at ≥30/30 μm line/space
- custom product sizes, shapes, labeling and packaging