At a glance
| Booth | I2125 |
| Country | CN |
| Website | www.chipshine.com |
Company profile
Chip Shine Electronics Technology Co.,Ltd was founded in 2002 and integrates the research and development, design, production, and sales of probes and test sockets. The company has worked in electronic-circuit testing for more than two decades and describes precision elastic-contact technology as a core technical foundation for its interconnection and test solutions. Its research organization includes an R&D and testing center, and nearly 30 percent of the workforce is described as professional R&D personnel; the company also collaborates with domestic universities. The manufacturing base covers 8,000 square meters and is equipped with nearly 100 precision-machining devices. In-house manufacturing capabilities include precision turning and mirror turning, spring forming, fully automated assembly, vacuum heat treatment, and electroplating. The equipment can process workpieces from 0.05 to 20 mm with listed precision of 0.001 to 0.005 mm. Applicable materials include copper, steel, aluminum alloy, PTFE, and other materials within the stated machining range. Annual component output is stated at more than 100 million pieces, providing production capacity for probes, connectors, springs, and other precision parts. The company reports 58 patent certificates and operates regional offices as well as branches in the United States and Malaysia, forming a sales network beyond its China manufacturing base. Its development history includes establishment of an R&D center in 2002, a 2010 joint venture with B.T. Automatica that created a domestic probe-production base, and international expansion through United States and Malaysia branches in 2014. The company entered semiconductor testing with semiconductor POGO PIN products in 2017, introduced Socket test solutions in 2019, and expanded to PCBA plus Socket full-chain test solutions in 2022. Its core business covers test probes, test modules, electrical continuity connectors, aerospace test cables and connectors, and ultra-miniature precision springs.
Exhibits
The probe portfolio includes ICT test probes, semiconductor test probes, photovoltaic test probes, WLP and FT semiconductor-package test probes, and burn-in test probes with matching modules and solutions. The 011 series is a semiconductor test-probe line with a minimum probe diameter of 0.11 mm and is intended for testing various packaged chips. B.T.TECH is identified as a self-developed brand built around three manufacturing technologies: nano electroplating, mirror turning, and in-house spring production. The company describes a 1+X development plan that starts with probes and extends into Socket test seats, test modules, complete PCBA test solutions, and automated equipment. For semiconductor chip testing, the offering covers high-precision wafer-level and final-product testing across logic chips, memory chips, and power devices. Custom test fixtures and test modules are developed for different semiconductor packaging and test scenarios, with the stated objective of adapting the contact interface and test configuration to the application. The consumer-electronics test scope covers mobile phones, tablets, and wearable devices across multiple stages of product testing. Photovoltaic test solutions cover solar cells and modules, including IV-curve evaluation, EL inspection, and environmental-reliability testing. RF connector work addresses high-frequency signal transmission and connector-reliability testing for applications that include 5G, 6G, and satellite navigation. Automated-equipment development includes intelligent test robots and automated production-line integration for higher-throughput and more consistent manufacturing. The exhibit scope therefore links precision probes and elastic contacts with sockets, modules, PCBA-level testing, RF connection, photovoltaic testing, and automated test equipment. The same in-house processes used to manufacture probe components, including mirror turning, spring forming, heat treatment, and electroplating, provide manufacturing support for the precision-contact products shown in the test portfolio.
Capabilities and products
- ICT test probes
- Semiconductor package test probes with a minimum diameter of 0.11 mm
- Photovoltaic test probes
- Burn-in test probes
- Custom test fixture and module development
- Test socket design and manufacturing
- Electrical continuity connector development and manufacturing
- Aerospace test cables
- Aerospace connectors
- Ultra-miniature precision spring manufacturing
- Precision mirror turning
- Nano electroplating
- Vacuum heat treatment
- Fully automated precision component assembly
- Micromachining of 0.05–20 mm components with 0.001–0.005 mm precision
- Semiconductor wafer-level test solutions
- Finished semiconductor device test solutions
- End-to-end PCBA and Socket test solutions
- Testing of phones, tablets and wearable devices
- IV curve testing of solar cells and modules
- EL inspection of solar cells and modules
- Environmental reliability testing of solar cells and modules
- RF connectors
- High-frequency signal transmission and connector reliability testing
- Intelligent test robot and automated production line integration