CHIN KONG GRAPHIC CORP.

At a glance

Company profile

Chin Kong Graphic Opto-electronics Co., Ltd. was established in 1999. Its predecessor originated from a fine-graphic-arts business in 1971, and in 1998 it transformed into an optoelectronic component manufacturer after adopting Japanese printing technology. The company has long focused on backlight modules (BLU), light-guide-plate processing, and electronic assembly, with end-to-end capabilities spanning material integration, precision manufacturing processes, and module integration. Holding international quality and environmental certifications such as ISO 9001, ISO 14001, and IATF 16949, it broadly serves the industrial-control, automotive, medical, and consumer markets. Building on more than two decades of optoelectronic manufacturing, Chin Kong continues to advance material technology and to expand into high-value-added product fields. Among these, the development of silicone-free thermally conductive pads is the company's most representative innovation in recent years and a key core technology for differentiated market competition. With the rapid growth of high-power electronics, AI servers, and automotive electronics, thermal efficiency and material reliability have become critical technology drivers. However, conventional silicone-based thermal materials commonly suffer from the bleeding of volatile siloxanes (D4, D5, D6), which can raise thermal resistance and contaminate optical components and electrical contacts, affecting long-term product stability. At the same time, the EU REACH regulation will impose strict restrictions on related substances in 2026, accelerating the industry's move toward “de-siliconization.” Recognizing this trend, Chin Kong was among the first to invest in silicone-free thermal-material technology, successfully creating a new generation of thermal solutions that are non-volatile, oil-bleed-free, and free of contamination risk. The product series eliminates siloxane content, effectively avoiding performance and contamination problems over long-term use while delivering stable, high reliability, suitable for demanding applications such as AI equipment in harsh environments, automotive electronic control modules, and precision sensing systems. In product design, Chin Kong has built a complete platform of serialized silicone-free thermal pads, offering different thermal grades of approximately 2, 3, 5, and up to 7 W/mK, and supporting a range of thicknesses from 0.5 mm to 5 mm, combining flexibility with structural stability. Through precise tuning of material formulations and substrate structures, the products can achieve an optimal balance between thermal efficiency and mechanical properties according to different application requirements, demonstrating a high degree of customized manufacturing capability. In manufacturing process technology, the company has introduced key processes such as vacuum kneading, vacuum hot pressing, and precision cutting, establishing a standardized, high-efficiency mass-production flow that controls thickness tolerance and product consistency, and complies with international environmental standards such as RoHS and REACH. This integrated capability from material design to manufacturing process gives Chin Kong a strong competitive advantage in the silicone-free materials field. Beyond new-material development, Chin Kong continues to strengthen its manufacturing capabilities for modules and optoelectronic products, leveraging flexible production-line configuration and supply-chain integration to provide customers with high-quality, competitive lead times and cost solutions. Facing market demands for low-volume, high-mix production and rapid feedback, it can promptly adjust its production strategy to maintain stable supply. Quality has always been Chin Kong's core value. The company has established a complete quality-management system that provides layered control from raw-material inspection and process control to final shipment, and continuously improves yield through data analysis and process optimization, ensuring stable, reliable products that meet the high standards of international customers. Looking ahead, Chin Kong will take silicone-free thermal materials as its key core technology, continuing to deepen material R&D and manufacturing-process innovation and to expand into high-power and advanced-electronics applications. Through technology upgrades and market insight, the company is committed to becoming an important supply partner for next-generation solutions, efficiently providing global customers with more reliable product value that aligns with environmental trends.

Capabilities and products

• backlight modules (BLU)
• electronic assembly
• light-guide-plate processing
• silicone-free thermally conductive pads
• thermal pads 2 to 7 W/mK
• vacuum kneading and hot pressing processes

Related product topics

• Thermal Interface Materials

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