At a glance
| Booth | T9220 |
| Country | TW |
| Website | www.chinkong.com.tw |
Company profile
CHIN KONG GRAPHIC CORP. is described as founded in 1999 and as having developed from an earlier business history that included a 1998 transformation using Japanese printing technology into an optoelectronic-component manufacturer. The company has long worked in BLU-related manufacturing, light-guide-plate processing, and electronic assembly, with integrated capabilities spanning material integration, precision manufacturing processes, and module integration. Its listed international quality and environmental certifications include ISO 9001, ISO 14001, and IATF 16949, and the stated markets include industrial control, automotive, medical, and consumer applications. The company has more than twenty years of optoelectronics-manufacturing experience and has expanded its material technology toward higher-value product areas, including silicone-free thermal pads as a recent development focus. The silicone-free thermal-material work responds to efficiency and material-reliability needs associated with high-power electronics, AI servers, and automotive electronics. CHIN KONG GRAPHIC CORP. identifies volatile siloxane D4, D5, and D6 bleed-out from conventional silicone thermal materials as a potential cause of higher thermal resistance and contamination of optical components and electronic contacts during long-term use. It also states that EU REACH restrictions on related substances in 2026 are accelerating movement toward silicone-free materials. The company’s silicone-free thermal solution is described as addressing volatile emission, oil bleed, and contamination risk and as supporting reliability in applications including AI-related equipment, automotive electronic control modules, and precision sensing systems. Its silicone-free thermal-pad platform includes thermal-conductivity levels of approximately 2W, 3W, 5W, and up to 7W/mK and thickness choices from 0.5mm to 5mm. The platform combines softness with structural stability, and material formulation and internal-structure adjustment are used to balance thermal performance and mechanical properties for different application requirements. Manufacturing processes include vacuum kneading, vacuum hot pressing, and precision cutting, with standardized mass-production processes used to control thickness tolerance and product consistency. The thermal-material products are stated to comply with RoHS and REACH environmental requirements, while the company integrates material design with manufacturing processes. CHIN KONG GRAPHIC CORP. also continues to strengthen module and optoelectronic-product manufacturing through flexible production-line configuration and supply-chain integration, with production strategies adjusted for small-volume diversified demand and rapid market feedback. Its quality-management process covers raw-material inspection, process control, and final shipment, together with data analysis and process optimization intended to improve yield and product stability. The company states that future work will continue to center on silicone-free thermal materials, material R&D, manufacturing-process innovation, and expansion into high-power thermal-management and advanced-electronics applications. CHIN KONG GRAPHIC CORP. is located in Yuanlin City, Changhua County, has more than 100 employees, and operates a factory area of 2,500 ping, including a 150-ping printing department and a 300-ping assembly area. Its professional services include backlight-module assembly and electronic-product assembly, and the company states that small TFT modules plus 15-inch MONITOR and TV manufacturing were added in 2003. The company implements ISO 14001 environmental-management policy from material selection through production and shipment, with attention to carbon-footprint and waste reduction and a sustainable supply chain.
Exhibits
CHIN KONG GRAPHIC CORP. supplies silicone-free thermal pads in multiple thermal-conductivity grades, including approximately 2W, 3W, 5W, and up to 7W/mK. Available silicone-free thermal-pad thicknesses range from 0.5mm to 5mm, and formulation and internal-structure tuning are used to adapt thermal and mechanical properties to different application requirements. The manufacturing flow for these materials includes vacuum kneading, vacuum hot pressing, and precision cutting, with attention to thickness tolerance and consistency in standardized mass production. The company also manufactures and assembles BLU-related products, processes light-guide plates, and provides electronic and module assembly as part of its broader optoelectronics capabilities. A thermal interface pad described by the company is a high-performance, highly flexible material that fills gaps between heat-generating components and heat sinks to improve thermal-transfer efficiency. That thermal interface material is described as having compressibility, electrical insulation, and long-term stability for use across electronic products and heat-dissipation modules. The combined supply scope therefore covers backlight module (BLU) manufacturing, light-guide-plate processing, electronic assembly, silicone-free thermal pads, configurable thermal-material properties, and the associated vacuum-kneading, hot-pressing, and precision-cutting processes.
Capabilities and products
- backlight module (BLU) assembly
- light-guide-plate processing
- electronic product assembly
- silicone-free thermal pad manufacturing
- 2W-7W/mK, 0.5-5mm silicone-free thermal pads
- thermal interface pads
- vacuum kneading for thermal materials
- vacuum hot pressing for thermal materials
- precision cutting of thermal materials