At a glance
| Booth | I2516 |
| Country | US |
| Website | www.btu.com/pt-br/news-events/btu-introduces-high-yield-reflow-technologies-for-advanced-packaging-at-semicon-taiwan |
Company profile
BTU International, Inc. supplies thermal-process equipment used in the production of electronics and electronic components, where high productivity and process control are important operating requirements. Its Pyramax family of convection reflow ovens is used for printed-circuit-board assembly, semiconductor packaging, LED assembly, and other applications. In semiconductor packaging, BTU International, Inc. applies mass-reflow ovens to advanced packages including BGA ball mount, wafer bumping, Flip-Chip, FC-BGA, and FOPLP. PYRAMAX™ convection reflow ovens have a maximum temperature of 400°C and a broad menu of options, and BTU's closed-loop convection technology supports lead-free processing. TrueFlat is available as a PYRAMAX™ option for substrates from 0.15 mm to 0.30 mm thick and flattens the substrate during reflow to address soldering problems caused by die tilt. The Aurora platform is BTU International, Inc.'s latest mass-reflow platform, with a long heating zone and flexibility for applications ranging from high productivity to low ramp-up and cooling-rate requirements.
Exhibits
BTU International, Inc.'s advanced-packaging reflow platforms include Aurora, Aurora Vacuum™, and Pyramax for flip chip, 2.5D, CoWoS, panel-level packaging, and co-packaged optics. These applications are addressed around yield-sensitive factors including voids, oxidation, and warpage. The Aurora Vacuum Reflow Oven provides low-void soldering with production-oriented throughput by combining a vacuum soft-start that minimizes component movement with integrated in-chamber heating for profile control. Its heated vacuum chamber measures 24.4 x 28.0 inches (620 x 711 mm), and three independent conveyors with optional dual-lane operation support large-format substrates, panels, and volume production. The vacuum process drives voids out of solder joints while in-chamber heating maintains the thermal profile. BTU International, Inc. also provides a fluxless Formic Acid Reflow capability for targeted oxide reduction, and that capability is available across multiple BTU reflow platforms. Its high-performance reflow ovens are used in SMT printed-circuit-board assembly production and semiconductor packaging processes. For sensitive advanced-packaging processes, BTU reflow ovens can be configured to minimize oxygen in the reflow zone to single-digit ppm levels, helping limit oxidation of solder joints and exposed metal surfaces. Low-oxygen processing supports cleaner solder joints, improved wetting, and mechanical and electrical integrity in applications such as flip-chip, wafer-level packaging, and heterogeneous integration. Thermal uniformity is controlled through high convection rates and optimized airflow so delta T across the substrate remains tight, reducing incomplete reflow, bridging, tombstoning, and cold-joint risks. This thermal-uniformity control is particularly relevant to 2.5D and 3D IC assemblies where complex geometries, material stacks, and different thermal masses can create larger temperature gradients. BTU's optimized convection technology is used to provide uniform heating and cooling with tightly controlled Cpk values and high process yields. Pyramax and Aurora reflow ovens offer slow-cooling configurations to reduce thermal stress associated with coefficient-of-thermal-expansion mismatch among silicon dies, organic substrates, underfill compounds, and other package materials. Controlled cooling is used to reduce warpage, delamination, and microcracking while preserving solder-joint quality and mechanical performance across temperature cycles. Aurora can support very slow cooling at high volume through longer oven configurations with adjustable heating and cooling zones. Pyramax with TrueFlat technology is designed for advanced-packaging lines using ultra-thin substrates and applies uniform suction during heating to eliminate substrate warpage. BTU identifies ultra-low-oxygen reflow, thermal uniformity, programmable cooling, configurable zone architecture, and TrueFlat warpage control as key advanced-packaging process features. The TrueFlat vacuum hold-down option keeps thin substrates flat through reflow, addressing die tilt and supporting yield where substrate planarity is critical. The product portfolio also includes Aurora Reflow Oven, Aurora Vacuum™ Reflow Oven, Pyramax™, Pyramax TrueFlat, Pyramax Vacuum, Pyramax ZeroTurn Dual Chamber Reflow Oven, Aqua Scrub Flux Management, and Fluxless Formic Acid Reflow. Beyond reflow, BTU International, Inc. lists Custom Continuous and Belt Furnaces, Atmosphere Furnace, Fast Fire, Dryers, and a Diffusion Furnace by Bruce Technologies. Its listed thermal-process applications include Advanced Packaging Reflow, Panel-Level Packaging Reflow, Complex SMT Reflow, Furnace Brazing, Direct Bond Copper, Thick Film, and Sintered Metals. Control and smart-factory tools in the portfolio include Wincon™ Control System, Connected Smart Factory, Energy Pilot, RecipePro, Profile Guardian, and Profile Tracer. BTU supports installed and new systems with parts, upgrades, application laboratories, training classes, customer support, sales support, service support, and parts support. For ongoing equipment needs, the company provides 24/7 global support, system upgrades, reflow ovens, and custom thermal-processing solutions. Available upgrade items include Intellimax & Wincon, Aqua Scrub Upgrade, Profile Guardian Upgrade, Flux Trap Lip Vent, Nitrogen Fast Purge, Cooler Flux Filter, Blower Fail Detection, Closed Loop Convection, and Edge Rail Chain Oiler.
Capabilities and products
- reflow ovens for SMT and semiconductor packaging
- reflow ovens up to 400°C
- low-void vacuum reflow
- fluxless Formic Acid Reflow
- advanced-package reflow for Flip Chip, 2.5D and CoWoS
- single-digit ppm low-oxygen reflow
- programmable slow-cooling reflow
- TrueFlat flattening for 0.15–0.30 mm thin substrates
- custom continuous and belt furnaces
- atmosphere furnaces
- industrial dryers
- reflow-oven parts and system upgrades