At a glance
| Booth | I2316 |
| Country | US |
| Product categories | Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Wafer Level Bonders · Coat; Develop; Resist Processing; Track Equipment · SOI Bonders; Temporary Bonders; De-Bonders · Other Specialty Chemicals · Materials, Nanotechnology · Chucks for Wafer and other Substrates · Sensors · Process Monitoring systems · Clean Rooms · Simulation; Characterization; Verification Software |
| Website | www.brewerscience.com |
Company profile
Join Brewer Science at the largest microelectronic event in Taiwan. Brewer Science is proud to be a part of the largest microelectronic event in Taiwan. We encourage you to stop by our booth to see how our products enrich the lives of others. Brewer Science is a global technology leader in developing and manufacturing innovative materials, and processes for the fabrication of semiconductors and microelectronic devices. Products Lithography Our line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry. Our portfolio includes materials from ARC® and multilayer systems, to advanced materials for DSA and EUV processes. http://www.brewerscience.com/product-categories/lithography/ Packaging Solutions Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer material for low-volume R&D environments, and for fully automated solutions for higher-volume needs. http://www.brewerscience.com/product-categories/wafer-level-packaging/ Smart Devices At Brewer Science, we are focused on delivering critical, real-time information to our customers to help them achieve their goals, solve their problems, and improve their current systems. In other words, we offer a complete solution, not just a product or a quick-fix—but an integrable solution to fit their needs. http://www.brewerscience.com/product-categories/printed-electronics/
Capabilities and products
- ARC® lithography materials
- DSA process materials
- EUV process materials
- lithography materials across the full wavelength spectrum
- materials and processes for semiconductor fabrication
- multilayer lithography systems materials
- temporary wafer bonding systems