At a glance
| Booth | I2316 |
| Country | US |
| Website | www.brewerscience.com |
Company profile
Brewer Science, Inc. is a global technology leader in developing and manufacturing innovative materials and processes for the fabrication of semiconductors and microelectronic devices. Its lithography product line spans the full spectrum of lithography wavelengths and is described as the most comprehensive product lineup in the industry. The lithography portfolio includes ARC® and multilayer-system materials as well as advanced materials for DSA and EUV processes. Packaging Solutions include proven temporary wafer bonding systems designed to fit a variety of process scenarios with minimal disruption. Brewer Science, Inc. offers material for low-volume R&D environments and fully automated solutions for higher-volume needs. For Smart Devices, Brewer Science, Inc. focuses on delivering critical, real-time information to help customers achieve goals, solve problems and improve current systems through complete, integrable solutions fitted to their needs.
Exhibits
Brewer Science, Inc. uses thin wafer handling (TWH) technologies for packaging with high-performance materials that enable higher throughput, reduced form factor and lower cost, and it works with leading equipment vendors on fully automated solutions for high-volume needs. Wafer-level packaging (WLP) packages the die while it is still on the wafer by adding protective layers and electrical connections to the substrate before dicing, allowing chips to continue reducing in size, streamlining manufacturing and making chip-function testing easier. For new stacked designs, manufacturers can thin device wafers before complex back-end processes and use temporary bonding to attach a wafer to a stable carrier without disrupting back-end processes. Listed benefits of ultrathin wafers include better heat dissipation, form-factor reduction, increased performance and decreased power consumption. The More-than-Moore discussion states that Moore’s Law originally described transistor counts doubling every two years, later changing to 18 months, and that More-than-Moore Technology develops new possibilities beyond conventional methods as physical transistor-scaling limits are reached. Listed More-than-Moore benefits include quicker time to market, lower cost, improved performance, reduced size and space, and more flexibility. Brewer Science, Inc. states that it has applied semiconductor materials expertise to advanced packaging for over 15 years and, through collaboration among research, development and applications groups, has become one of the largest advanced-packaging knowledge centers with the largest product portfolio in the industry. Its product and service range includes wafer-level packaging, protective coatings, lithography and printed electronics, together with WaferBOND® HT-10.11 Material, Selective Surface Modification, Advanced Lithography, Electronics Design, Brewer Science Service Capabilities, Printed Electronics Services, Top Antireflective Coatings vs. Bottom Antireflective Coatings and Temperature Sensors. Brewer Science lithography products have been used in the semiconductor industry since 1981, with product lines, capabilities and specifications developed over time. BrewerBOND® T1100/C1300 Series Materials enable the VersaLayerTM system for high-temperature and high-stress semiconductor applications. Environmental Monitoring explores sensor performance, and the integrated Sensor System Solutions for Industrial Monitoring provide an automated system that enables more predictive analytics. Smart Devices use custom-designed printed-electronics systems to capture, transmit and analyze environmental and process data. BrewerBOND® 530 is a mechanical-debonding release material for stronger adhesions in high-stress and high-temperature temporary-bonding applications, while BrewerBOND® 510 is a temporary wafer-bonding release material for mechanical-debonding applications. OptiStack® multilayer systems are the flagship lithography technology and are used for leading-edge high-volume IC manufacturing. ProTEK® B3 coatings are spin-applied polymeric thin-film coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline or acid etches. ARC® antireflective coatings provide reflection control and light absorption during photolithography. BrewerBOND® 701 is a UV-laser release material for temporary bonding and debonding applications including chip-first, chip-last and RDL-first FOWLP processes. BrewerBOND® 305 is an organic temporary wafer-bonding coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment. The packaging offering also lists Bonding Materials, Debonding Technology and Permanent Bonding Materials. The More-than-Moore discussion also notes that Moore’s Law has been used in the semiconductor industry to guide long-term planning and set research-and-development targets. For EUV lithography, the RLS trade-off is described as the challenge of simultaneously improving resolution, line-width roughness and photosensitivity. The product range extends from lithography materials to equipment. ARC® antireflective coatings are described as the industry benchmark for reflection control and light absorption during photolithography.
Capabilities and products
- full-spectrum semiconductor lithography materials
- ARC® antireflective coatings and multilayer systems
- advanced lithography materials for DSA and EUV
- temporary wafer bonding systems
- thin-wafer handling and WLP materials
- temporary-bonding debonding materials
- printed-electronics environmental and process sensor systems