At a glance
| Booth | J3138 |
| Country | TW |
| Product categories | Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment · Consumables · CMP; Grind; Lap; Polish; Abrasive materials |
| Website | www.bestac.com |
Company profile
Bestac Advanced Material Co., Ltd is a Taiwan polishing materials manufacturer, established in 2006 and the first local polishing pad maker in Taiwan. It makes polishing pads for semiconductor wafer, hard disk and glass applications, with pads, tapes, wipers and films used in semiconductor, optoelectronic and hard disk storage processes for polishing, texturing, cleaning and buffing. Using proprietary technology, it carries out in house research, design, testing and manufacturing of high precision polishing pads for microelectronics, displays, optics, crystal substrates and hard disk substrates.
Exhibits
貝達先進材料公司成立於2006年，應用特有之專利技術，專注研發、設計、測試與加工製造高精密度研磨拋光墊片(Polishing Pad)，產品應用於微電子、顯示器、光學、晶體襯底材料與硬碟基版等各種需要精密化學機械研磨拋光(Chemical Mechanical Polishing, CMP) 的產業。 貝達整合了精密技術及品管流程管理，提供客戶期待的品質，有效提升不同產業需要之移除率、高平坦度、低缺陷之需求。 貝達公司之技術團隊專精於化學材料研究、製程技術與管理已逾40年，累積深厚化學材料之製造與研發根基，貝達公司除了既有完整的產品線外，也願意配合客戶的需要，客製化不同產業所需特性的產品，提供最優質的產品與服務。
Capabilities and products
- CMP, grind, lap, polish and abrasive materials
- high precision polishing pads for microelectronics
- polishing pads for semiconductor wafers
- polishing tapes, wipers and films for semiconductor processes
- polishing, texturing, cleaning and buffing consumables