At a glance
| Booth | J3138 |
| Country | TW |
| Website | www.bestac.com |
Company profile
Bestac Advanced Material Co., Ltd is a Taiwan manufacturer focused on polishing materials and polishing-pad technology. The company was established in 2006 and is described as the first local polishing-pad manufacturer in Taiwan. Bestac Advanced Material Co., Ltd applies proprietary technology and performs research, design, testing, processing and manufacturing of high-precision polishing pads in house. Its application fields for those precision pads include microelectronics, displays, optics, crystal substrate materials and hard-disk substrates, all of which can require precision Chemical Mechanical Polishing, or CMP. The technical team is described as having more than 40 years of experience in chemical-material research, process technology and management, providing a manufacturing and development base in chemical materials. The company combines precision technology with quality-control process management to address requirements for material removal rate, high flatness and low defect levels in different industries. Alongside its existing product lines, Bestac Advanced Material Co., Ltd states that it can customize product characteristics to match requirements from different industries.
Exhibits
Bestac Advanced Material Co., Ltd manufactures polishing pads and also supplies tapes, wipers and films for surface-processing applications. These pads, tapes, wipers and films are supplied to semiconductor, optoelectronic and hard-disk-storage industries. The stated process uses for the product range include polishing, texturing, cleaning and buffing. The broader polishing-pad application scope includes semiconductor wafers, hard disks and glass. For precision CMP requirements, the company develops and manufactures high-precision polishing pads for microelectronics and display applications. The same high-precision polishing-pad capability also covers optics, crystal substrate materials and hard-disk substrates. Its polishing-pad development is tied to process outcomes that include removal-rate performance, high flatness and low-defect requirements. Because the company performs research, design, testing and manufacturing internally, its polishing-pad supply covers the development cycle as well as physical production. Customer-specific requirements can be addressed by customizing the characteristics of polishing products for different industrial applications. One named product is SU1300, which uses a micro porous polyurethane structure. SU1300 is designed to create a flawless surface during the Chemical Mechanical Polishing process used for wafer planarization. The SU1300 description therefore places microporous polyurethane polishing-pad structure directly in a wafer-planarization CMP application. Taken together, the supply scope covers semiconductor-wafer polishing pads, polishing and cleaning consumables such as tapes, wipers and films, and microporous polyurethane CMP pads for wafer planarization.
Capabilities and products
- high-precision CMP polishing-pad R&D, design, testing and manufacturing
- custom CMP polishing pads
- pads, tapes, wipers and films for semiconductor and optoelectronics
- CMP polishing pads for wafer planarization