At a glance
| Booth | M0657 |
| Country | TW |
| Product categories | Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Alignment Film Materials · Contamination Control; HEPA Filtering Systems |
| Website | www.benqmaterials.com |
Company profile
BenQ Materials is a global leader in material science, transforming advanced materials into innovative solutions for semiconductor, electronics, mobility, healthcare, and advanced manufacturing industries. With strong expertise in precision coating, polymer engineering, and material integration, the company continuously expands material technologies into high-value industrial applications. Semiconductor solutions cover wafer processing, advanced packaging, and micro-contamination control. Key technologies include ultra-clean CMP cleaning brushes utilizing proprietary PVA air-foaming technology to support advanced node manufacturing with reduced contamination, lower water consumption, and enhanced process stability. Advanced packaging materials include Dry Film Photoresist (DFR) with exceptional thickness uniformity and defect control for high-density redistribution layer (RDL) applications, as well as UV-curable dicing tape designed for stable processing and high-yield ultra-thin chip handling. Additional technologies include polyolefin porous membranes for wet-process filtration and micro-contamination control, along with UV-curable adhesives engineered for precision optical and 5G/6G component assembly. Through deep integration from material design and formulation to process and application engineering, BenQ Materials enables higher yield, reliability, and next-generation semiconductor manufacturing performance.
Capabilities and products
- Dry Film Photoresist (DFR) for high-density RDL applications
- PVA air-foaming technology for CMP cleaning brushes
- UV-curable adhesives for precision optical and 5G/6G component assembly
- UV-curable dicing tape for ultra-thin chip handling
- polyolefin porous membranes for wet-process filtration
- precision coating and polymer engineering
- ultra-clean CMP cleaning brushes
- wafer processing, advanced packaging and micro-contamination control materials