At a glance
| Booth | N0491 |
| Website | awesometeamtw.wixsite.com/homepage |
Company profile
Awesome-Team Co., Ltd is a Taiwan optical measurement technology company. The company was founded in 2015 and focuses on measurement technologies for semiconductor and advanced-packaging processes. Its technical direction centers on advanced optical non-contact measurement and optical transmission measurement. For non-destructive measurement, Awesome-Team works with optical hardware, measurement algorithms, and software platforms as parts of the overall measurement system. The company states that it develops and provides semiconductor measurement technology for customer applications and requirements. That customer-oriented work includes customized optical modules rather than only fixed optical configurations. It also offers customized software matched to the customer's measurement application and requirements. Awesome-Team Co., Ltd lists advanced optical non-contact and transmission measurement technologies for non-destructive measurement in semiconductor and advanced-packaging processes. The company's customization capability covers both the optical module and the software layer, allowing the measurement configuration to be matched to the customer's stated application and requirements.
Exhibits
Awesome-Team's measurement systems include measurement of wafer-thinning thickness, surface roughness, and thin films. The AT-S300 is identified as an optical wafer measurement system within the company's offering. AT-S300 measures wafer layer thickness, while the broader measurement-system scope also lists wafer-thinning thickness. The same system measures thin films as one of its named optical measurement functions. Surface-roughness measurement is another function listed for AT-S300 and is also part of the company's broader measurement-system scope. AT-S300 is also specified for wafer-warpage measurement alongside its layer-thickness, thin-film, and surface-roughness functions. Profile maps are listed among the AT-S300 measurement functions alongside wafer layer thickness, thin films, surface roughness, and wafer warpage. The system additionally measures PLP molding layer thickness, connecting the optical measurement portfolio with packaging-related structures. These AT-S300 functions sit within the company's broader approach of combining optics, algorithms, and software for non-destructive measurement in advanced packaging and semiconductor processes. The listed wafer-thinning thickness function and the separately listed AT-S300 wafer-layer-thickness function cover two named thickness-measurement targets in the portfolio. Surface roughness, thin-film measurement, wafer warpage, and profile maps give the same optical platform multiple distinct measurement targets beyond thickness alone. The PLP molding layer capability places a specifically packaging-related layer measurement alongside the wafer-oriented functions of AT-S300. Taken together, the system's thickness, surface, warpage, mapping, and molding-layer measurements form the named application range for its optical wafer measurement platform.
Capabilities and products
- custom optical modules and software
- wafer-thinning thickness measurement systems
- surface roughness measurement systems
- thin-film measurement systems