At a glance
| Booth | N0483 |
| Country | DE |
| Website | www.att-systems.com |
Company profile
ATT Systems has over 20 years of thermal-management expertise and develops advanced thermal solutions and temperature-test systems for the semiconductor industry, while also providing thermal solutions for the solar industry. Its temperature chuck systems cover a range from -65°C to +600°C, and its modular concept and universal hybrid chuck design support air-cooled and liquid-cooled operation, operational flexibility, cost-effective upgrade paths, and customization. ATT Systems combines advanced thermal technology with a focus on low cost of ownership and overall equipment efficiency, while continually improving quality, reliability, service, support, and the customer experience. The company emphasizes active collaboration with partners as it develops next-generation products for current and future requirements.
Exhibits
ATT Systems offers high-performance, reliable semiconductor temperature-control systems built with a modular concept for convenient, cost-effective upgrades, investment protection, and easy customization. The A-Series is air-cooled for high-temperature use, with low-temperature starting points of -10°C, +20°C, or ambient and high-temperature options of +200°C, +300°C, or +350°C; the C-Series is air-cooled for low-temperature use from -65°C or -40°C to +200°C or +300°C; and the L-Series is liquid-cooled from -65°C, -40°C, or -20°C to +200°C or +300°C. The C-Series and L-Series use hybrid chucks suitable for air and liquid cooling, and the core design also includes a universal chuck for both cooling methods and hybrid operation with or without a cooling unit. Across the A-Series, C-Series, and L-Series, the listed temperature resolution is 0.01°C, accuracy and stability are +/-0.1°C, uniformity is +/-0.5°C or +/-0.5%, and planarity up to +200°C is +/-8 µm for A-Series and +/-5 µm for C-Series and L-Series. ATT Systems describes its temperature-test products as using best available components and advanced manufacturing technology, with designs focused on thermal and mechanical stability and precision. Modular AddOn stacks support applications including eWLB, HV/HC, LN, Plain, and Caro, while Low Thermal Resistance technology and MultiSense with multiple temperature sensors address high-accuracy, low-power, sensor-device, high-power, and high-parallelism applications. IntelligentDry Air Control provides active CDA purge control to reduce dry-air consumption, two-media purge control, bonding-pad protection, and adaptive dew-point control. For thin or warped substrates, the system includes patented Bernoulli functionality for extremely thin wafers and substrates, chucking solutions for highly warped substrates such as eWLB, and adaptive power vacuum for different chuck zones. All ATT chuck systems use a Triax connection as standard for low electrical noise, with sub-femto options available through AddOn technology, and multiple high-voltage and high-current solutions are also available. Service offerings include on-site cold upgrades for main prober platforms with liquid- and air-cooled -40°C and -55°C solutions completed in 5 to 7 working days including prober sealing, on-site chuck temperature calibration using certified calibration wafers, preventive maintenance, and service or support contracts.
Capabilities and products
- -65C to +600C temperature chuck systems
- air-/liquid-cooled hybrid chucks
- Low Thermal Resistance technology
- MultiSense multi-temperature-sensor technology
- IntelligentDry Air Control
- Bernoulli handling/chucking for ultra-thin wafers
- chucking solutions for highly warped substrates
- on-site cold upgrades for prober platforms
- on-site chuck temperature calibration