At a glance
| Booth | J2934 |
| Country | TW |
| Product categories | Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Environmental Stress Systems - Temperature; Humidity; Pressure; HAST · Optical Test Systems · Thermal Interface Materials; Heat Sinks · Thin Film; Dielectric Film Materials · Dopant Gases · Gases Materials · Silicon Precursor Gas · CMP; Grind; Lap; Polish; Abrasive materials · Ingots · Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Diamond substrates · Epitaxial; Epi; Gettered; Internal Gettered Wafers · Gallium Arsenide (GaAs); Sapphire Substrates · Prime; Polished; Mirrored Wafers · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; · solar cell substrates; crystalline silicon (c-Si); thin film · Strained silicon; Engineered Substrates · Substrate Materials · Test; Monitor Wafers; Reclaim or Virgin · Thin & Thick film substrates for MEMS · Filters, Getters, Purifiers, Catalysts for Gases · Gaskets; Seals; O rings; Elastomers; Resins · Raw Material & Custom components; Plastic · Wafer Handling · Device; Wafer; Display Panel Handling Products |
| Website | www.atecom.com.tw |
Company profile
Atecom Technology Co., Ltd. is a semiconductor materials manufacturer and supplier established in Taipei, Taiwan in 1998. We provide and produce a wide variety of semiconductor and compound material crystals, such as silicon ingots / wafers, epitaxial wafers, sapphire, indium phosphide, silicon carbide, gallium nitride, and thin-film lithium niobate, used in AI, advanced packaging, optical communications, heat dissipation, MEMS, LED, power, and other fields. At the same time, we continuously expand our product line of future advanced materials in order to offer customers more services and choices.
Exhibits
Semiconductor Wafer Material, Gallium Nitride, GaN, SiC, Silicon, SOI, Diamond, Ceramic Power Electronics: Leveraging its superior Wide Bandgap (WBG) characteristics, it is applied in high-voltage and high-power components. (註：寬能隙的專業術語為 Wide Bandgap) Radio Frequency (RF) Communications: Suitable for high-frequency signal transmission and recognized as one of the high-performance materials for future 6G communications. Artificial Intelligence (AI): Serving as a next-generation material to support critical hardware components required for AI computing. Electric Vehicles (EV): Applied in power conversion systems related to electric vehicles (such as on-board chargers and inverters). Optoelectronic Applications: While FS (Free-Standing) Wafers are primarily used for power and RF, GaN-based technology is also widely utilized in the manufacturing of green and blue LEDs. Specifications are customizable. These are commonly found in mobile fast-charging adapters and electric vehicle (EV) charging stations, characterized by their excellent switching loss performance. Green and Blue LED Wafers These are primarily used in display devices, such as smartphone screens and evision displays, as well as in future optical communications. Power AlGaN HEMT structure, the other solution can reach power application. Select a product category to refine your search. © 2024 ATECOM Technology co.,ltd. Designed by WDD online experience, to analyze site usage and to show tailored advertising to you. By continuing Quickly search for the latest news and product information to easily find what you Welcome to the global information website of the ATECOM Technology co.,ltd. our information and service. To ensure your rights, please carefully read the following receive, including information related to your past use of our service.This policy does not For the better of interactive service, we may ask for your personal information, such as:When you access our interactive functions such as writing e-mail to our of use etc.When you browse our site, our server will automatically record the related path, any third party or for other purposes beyond the original intent except for your permission personal information.With strict protection measures, only the authorized staffs are allowed
Capabilities and products
- Free-Standing (FS) wafers for power and RF applications
- GaN materials for RF communications
- SOI, diamond, and ceramic semiconductor wafer materials
- Wide Bandgap (WBG) power electronics materials
- epitaxial wafers
- green and blue LED wafers
- sapphire and indium phosphide crystals
- silicon carbide and gallium nitride compound material crystals
- silicon ingots and silicon wafers
- thin-film lithium niobate crystals