At a glance
| Booth | L0716 |
| Country | SG |
| Website | www.asmpt.com |
Company profile
ASMPT is a global supplier of hardware and software solutions for semiconductor and electronics manufacturing, with its headquarters in Singapore. Its business spans semiconductor assembly and packaging and SMT (surface mount technology), from wafer deposition through solutions that organize, assemble, and package electronic components. The technologies ultimately support end-user devices and systems in electronics, mobile communications, computing, automotive, industrial, and LED display applications. ASMPT states that it works closely with customers and continuously invests in R&D to improve productivity, reliability, and quality while controlling solution cost. The company is a founding member of the Semiconductor Climate Consortium. ASMPT is listed on the Stock Exchange of Hong Kong under stock code 0522. It is included in the Hang Seng TECH Index, Hang Seng Composite MidCap Index, Hang Seng Composite Information Technology Industry Index, Hang Seng Corporate Sustainability Benchmark Index, and Hang Seng HK 35 Index. The group presents a 50-year history and a portfolio that includes Semiconductor Solutions, SMT Solutions, and Critical Manufacturing activities. ASMPT SEMI states that it supplies systems and solutions to the majority of the world’s leading IDMs, OSATs, Tier 1 companies, and other key semiconductor supply-chain participants. Its semiconductor business serves both advanced-packaging and mainstream applications, pairing a global footprint with strong R&D and process-technology capability. The company says customers adopt its solutions from technology-roadmap development through high-volume mass production, with collaboration continuing across development and market deployment. ASMPT’s history includes the acquisition of the Siemens Electronics Assembly System business, the acquisition of screen-printer specialist DEK, the acquisition of Amicra to enter photonics, and the acquisition of Automation Engineering Inc (AEi) for automated sensor assembly and test equipment. Its advanced-packaging expansion has also included the NEXX purchase and investment in smart-factory software solutions. The company opened an R&D center in Taiwan and also lists an Advanced Packaging Centre in Singapore as part of its development infrastructure. Technology collaborations include work with IBM Research on AI chip technology, deeper collaboration with IBM on bonding methods for chiplet packages for AI, and work with EV Group on ultra-precision die-to-wafer hybrid bonding for 3D-IC heterogeneous integration. A production milestone was reached when the company shipped its 250th thermo-compression bonding tool to customers. Recognition listed by the company includes the 2018 Thomson Reuters Top 100 Global Technology Leaders designation, the 2019 Singapore Quality Award for Business Excellence, and the Grand Award of the 2019 HKMA Quality Award. Its supplier-recognition record includes a 2015 Supplier Excellence Award, an exclusive Texas Instruments Supplier Excellence Award for a second consecutive year, and a 2026 Intel EPIC Supplier Award. ASMPT also states a Net-Zero 2035 direction within its sustainability program, alongside themes of minimizing environmental impact, creating value through innovation, employee development, community support, and governance.
Exhibits
ASMPT’s innovation portfolio includes high-performance SMT placement and high-precision SMT printing for electronics assembly lines. Laser dicing and multisize placement extend the portfolio into wafer and component handling where different die or component dimensions must be processed. Co-Packaged Optics is listed as a dedicated innovation area, linking photonic integration with the company’s broader semiconductor assembly and advanced-packaging capabilities. Chip Assembly & SMT Placement combines semiconductor assembly functions with surface-mount placement in a shared manufacturing portfolio. An IoT Data Platform, Material Management 4.0, and Data-Driven Quality form the digital and factory-management portion of the offering. Bonding technologies include multi-chip bonding, hybrid bonding, and thermo-compression bonding for advanced semiconductor packaging. The semiconductor assembly and packaging range covers components such as GPUs, memory chips, integrated circuits, sensors, LEDs, and laser diodes. Those components support computing, servers, automotive, industrial, communications, and consumer applications, giving the same equipment portfolio relevance across multiple end markets. Mainstream assembly processes include die bonding, flip-chip bonding, wire ball bonding, molding, and sintering. For advanced packaging, ASMPT provides chiplet-integration solutions intended to improve efficiency and performance for AI-era semiconductor architectures. The company also provides software for system-to-system and system-to-factory integration, with a focus on line-integration automation. This software layer connects equipment operation with factory-level data exchange so assembly, placement, material management, and quality functions can participate in an integrated production environment. ASMPT identifies ALSI LASER1206 as a fully automatic laser dicing and grooving system, adding a named laser-processing platform to its semiconductor equipment range. The company also presents the SIPLACE V platform as a new placement-system generation within its SMT Solutions portfolio. A central platform for data exchange in electronics manufacturing is part of the company’s digital-manufacturing direction, complementing equipment-level data and factory integration. ASMPT has introduced new analytics functions in SMT Analytics to extend data analysis within SMT production environments. Its SMT development topics also include Active Stencil Storage and closed-loop nozzle management for manufacturing-line control. The company highlights transparency and accuracy in SMT production, along with process optimization across the entire line, as part of its intelligent-factory work. Thermo-compression bonding is a major advanced-packaging area in the portfolio, with the company reporting more than 50 chip-to-substrate TCB tool wins and additional orders for fifteen and nineteen chip-to-substrate TCB tools. The company has also reported a chip-to-wafer TCB area-of-record milestone, showing development across more than one thermo-compression bonding architecture. Hybrid-bonding development includes collaboration on ultra-precision die-to-wafer solutions for 3D-IC heterogeneous integration, connecting bonding equipment with emerging stacked-chip assembly methods. The semiconductor solutions portfolio covers both advanced packaging and mainstream applications, so die bonding, flip-chip bonding, wire bonding, molding, sintering, multi-chip bonding, hybrid bonding, and TCB can be considered within one equipment and process framework. A strong global R&D footprint is used to support process expertise, quality, performance, reliability, and innovation as products move from technology roadmaps to high-volume manufacturing. ASMPT works with customers as development partners, combining equipment, software, process expertise, and line automation for deployment into production environments. Together, SMT placement and printing, laser dicing, multisize placement, co-packaged optics, chip assembly, IoT data, Material Management 4.0, data-driven quality, and multiple bonding technologies form a cross-domain portfolio from electronics assembly through advanced semiconductor packaging.
Capabilities and products
- high-performance SMT placement
- high-precision SMT printing
- laser dicing
- multisize placement
- co-packaged optics
- multi-chip bonding
- hybrid bonding
- thermo-compression bonding (TCB)
- die bonding
- flip-chip bonding
- wire ball bonding
- semiconductor package molding
- semiconductor package sintering
- chiplet-integration advanced packaging
- line-integration automation software
- IoT Data Platform
- Material Management 4.0
- Data-Driven Quality