At a glance
| Booth | L0716 |
| Country | SG |
| Product categories | Ball Placement; Attach Systems · Cleaning; Washing Equipment for Assembly & Packaging · Cut & Down Set; Trim; Form Equipment · Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Dispensing Systems · Molding; Encapsulation; Decapsulation Equipment · Printing Equipment; Screen-printing; Alignment ; Film Printing · Wafer Level Bonders · Wire Bonding Equipment · Handlers; Positioner Systems |
| Website | www.asmpt.com |
Company profile
Overview ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality. ASMPT is also a founding member of the Semiconductor Climate Consortium. ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522), and is one of the constituent stocks of the Hang Seng TECH Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under the Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.
Capabilities and products
- assembly and packaging cleaning/washing equipment
- ball placement systems for semiconductor packaging
- die bonding and attach equipment
- electronic component assembly and packaging automation
- semiconductor assembly and packaging solutions
- semiconductor manufacturing hardware and software solutions
- surface mount technology (SMT) manufacturing solutions
- wafer deposition solutions