At a glance
| Booth | I2226 |
| Country | TW |
| Website | www.asnaglobal.com |
Company profile
Applied Seals Co., Ltd. (Taiwan) and Applied Seals North America provide elastomeric sealing solutions for semiconductor, solar, biotechnology, and pharmaceutical industries, with semiconductor applications forming a major engineering focus. The group manufactures semiconductor-grade PERFREZ® perfluoroelastomer compounds and a broader rubber-seal range that includes Hydraulic Seals, Pneumatic Seals, Aerospace Seals, Medical Seals, FFKM Seals, Perfluoroelastomer O-Rings, and Explosive Decompression Seals. Manufacturing and packaging of fluoroelastomer seals for highly demanding semiconductor applications are performed in Class 100 cleanroom environments, with production processes described as tightly controlled. The sealing business lists ISO3601-1 O-ring standards, ISO 9001, and ISO 13485 within its quality framework. Applied Seals North America has worked with semiconductor equipment manufacturers, semiconductor manufacturers, and critical subsystem suppliers since 2009, focusing on equipment reliability, process performance, and total-cost-of-ownership improvements through sealing technology. Its customer base spans semiconductor equipment OEMs, IDMs, foundries, subsystem manufacturers, vacuum-system manufacturers, gas-delivery-system suppliers, plasma-equipment manufacturers, and wet-process-equipment manufacturers. Engineering capabilities include application engineering, material selection, custom seal design, Finite Element Analysis (FEA), failure analysis, root-cause investigation, and seal standardization, with customer work extending from understanding the application through validation and lifecycle problem solving. The engineering innovation set includes PERFREZ® Semiconductor-Grade FFKM Materials, SmartSeal® PRISM OneKit®, QuikVU® Inspection Windows, Bonded Gate Technology, ACE® (ASNA Calculated Engineering), Smart Set®, and the BKM® Semiconductor Sealing Guide. Customer support extends from early design through high-volume manufacturing and is intended to reduce equipment downtime, extend seal service life, accelerate qualification, increase manufacturing reliability, and lower maintenance costs. ASNA is headquartered in California and supported by a global manufacturing and distribution network serving customers in North America, Europe, and Asia with engineering support, supply, and technical expertise from initial design through production. Quality activities include traceability, process consistency, manufacturing consistency, semiconductor-grade materials, continuous improvement, and global quality standards, while industry contribution includes technical education, collaboration, engineering best practices, standards participation, and data-driven manufacturing initiatives. Across the organization, sealing components are treated as engineered elements of equipment reliability and process performance, combining materials, application knowledge, design analysis, manufacturing control, and technical support for semiconductor production environments.
Exhibits
For wet cleaning, ASNA perfluoroelastomer compounds are engineered for static, dynamic, and bonded applications that require minimal metallic-ion contamination, addressing sealing positions where material cleanliness is important to the semiconductor process. The compounds are designed for thermal stability and integrity at elevated temperatures found in Oxidation, Diffusion, Annealing, and RTP, providing high-temperature sealing options for these semiconductor process conditions. For Thin Film processes including HDPCVD, PECVD, SACVD, PVD, and ALD, as well as Dry Etch and Ashing, ASNA positions next-generation perfluoroelastomer compounds for harsh plasma, gas, chemical, and elevated-temperature environments. The company manufactures semiconductor-grade O-rings in AS-568A, JIS series, and Metric sizes and uses in-house tool makers to fabricate high-precision standard and custom molds for demanding semiconductor applications. Integrated design and manufacturing also supports standard or custom made-to-order FFKM O-rings and seal components, allowing dimensions and seal configurations to be adapted to application requirements. The ASNA product line includes AS568 standard O-rings and custom seals, PERFREZ® semiconductor-grade FFKM materials, Bonded Gate Technology, SmartSeal® PRISM OneKit® with QuikVU® windows, ACE®, Smart Set®, and the BKM® Semiconductor Sealing Guide. Named product families include PERFREZ® PXC Series for broad process coverage, MX Series™ for high-temperature semiconductor environments, PERFREZ® Series for plasma, wet, and dry applications, and XL Series® semiconductor-grade FFKM O-rings and seals. PRISM oneKit® and QuikVU® Clamp are presented for high-integrity sealing in semiconductor subfab systems, while KF & NW fittings and BKM® guidance address sealing practices around subfab fittings and clamps. PERFREZ® semiconductor-grade FFKM seals are intended for chemical-process and general industrial applications involving high temperatures and aggressive chemicals, including plasma, wet, and dry semiconductor conditions. The PERFREZ® product list includes MX Series, PXC-Ultra, PXC, XL15, XL12, XL11, XS12, 6022, and 5033, giving customers a set of named material and seal families for semiconductor applications. ASNA provides standard and custom FFKM elastomer compounds and customizes semiconductor-grade FFKM O-rings and seals to client requirements in different thicknesses, lengths, and sizes, with design customization and optimization also offered. Application support is intended to optimize performance rather than end with product delivery, and the company links semiconductor-grade O-rings and seals with long and stable process operation before maintenance. Service support runs from design and prototyping through installation, test, and production, including material recommendation, product design, installation technique, and performance analysis for sealing applications. Performance and failure analysis examines used-seal traces, marks, profiles, and residue to investigate possible failure modes such as thermal degradation, mechanical degradation, plasma chemical attack, and inherent design flaws. Material and design recommendation considers thermal, chemical, and hardware conditions, while platform and groove evaluation is used as a foundation for selecting perfluoroelastomer material and seal design for the actual process limitations. Prototyping and installation support addresses overstretching, twisting, and seating of seal components in grooves, with installation videos and tools provided to guide correct handling of perfluoroelastomer seals. Sealing Technology Training and seminars serve tool owners, maintenance technicians, component engineers, and facility managers, while the BKM™ guidebook provides practical guidance for NW / ISO fittings and clamps in semiconductor SubFab applications. By combining semiconductor-grade FFKM materials, standard and custom O-rings, precision molds, bonded-gate and subfab products, engineering analysis, installation support, training, and failure investigation, Applied Seals Co., Ltd. (Taiwan) covers both the seal component and the application engineering around it.
Capabilities and products
- semiconductor-grade FFKM perfluoroelastomer materials
- Class 100 cleanroom fluoroelastomer seal manufacturing
- hydraulic seals
- pneumatic seals
- FFKM seals
- perfluoroelastomer O-rings
- custom seal design
- seal finite-element analysis (FEA)
- seal failure analysis