At a glance
| Booth | N1066 |
| Country | TW |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Molding; Encapsulation; Potting; Resin Materials · Tape Automated Bonding (TAB) Accessories · Thermal Interface Materials; Heat Sinks · Thick Film Pastes; Materials · Thin Film; Dielectric Film Materials · Alignment Film Materials · Polarizer Materials · Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards) |
| Website | www.amctape.com |
Company profile
Alliance Material Co. Ltd is the innovator in adhesive materials used to provide customized solutions for advanced processes in diverse fields including semiconductors. Our expertise in formula modulation at macromolecule materials enables customers to meet any process conditions. At AMC Materials, you would find a unique solution from a different perspective. Core Technology Semiconductor Process Material Probe Card Clean Sheet FT Clean Pad Molding Release Film BGBM Tape Functional Material Warpage Control and Carrier Film Thermal, UV, Laser, and Cool De-bonding Acid, Chemical, High-Temperature Resistance Adhesive Application Material Ultra-high Adhesion Micro Adhesion Special Adhesion
Capabilities and products
- BGBM Tape
- FT Clean Pad
- Molding Release Film
- Probe Card Clean Sheet
- Warpage Control and Carrier Film
- acid, chemical and high-temperature resistant adhesive application materials
- adhesive materials for advanced semiconductor processes
- macromolecule material formula modulation
- thermal, UV, laser and cool de-bonding materials
- ultra-high, micro and special adhesion materials