At a glance
| Booth | N1066 |
| Country | TW |
| Website | www.amctape.com |
Company profile
Alliance Material Co., Ltd. is an innovator in adhesive materials that provides customized solutions for advanced processes in fields including semiconductors, and its macromolecule material formula modulation expertise is used to meet varied process conditions; its core semiconductor process materials include Probe Card Clean Sheet, FT Clean Pad, Molding Release Film, BGBM Tape, warpage control and carrier film, thermal, UV, laser and cool de-bonding materials, acid-, chemical- and high-temperature-resistance adhesive application materials, and ultra-high, micro and special adhesion materials. Alliance Material Co., Ltd. mass-produces CoWoS test materials, BGBM materials for wafer grinding, advanced packaging materials for glass substrates, CP/FT test materials and wafer dicing materials, and also produces optical films, LED process films, semiconductor process films, OCA cutting processing, functional materials and adhesive tapes while providing optical and industrial films, customized cutting processing and customization services. The company was established in October 1995 with capital of NT $ 5,000K; AMC Hong Kong was established in November 2001 and a Dongguan, Guangdong factory for small- and medium-sized backlight materials was built in March 2001, followed by a Suzhou factory for LCD optical materials in March 2003, expansion of R & D for optical films and advanced materials in October 2006, large-size BEF mass production in Suzhou and 32 "TV BEF in Taiwan in October 2006, a 13th SME Innovation Research Award for fingerprint recognition film in October 2006, and relocation to a new plant in Jhu-bei City with expanded clean-room production and LCD display material production in December 2007. In 2008 the company launched Vimost optical-grade touch-screen glue technology and shading reflective tape; in 2009 it built 1.5th-generation Vimost optical-grade touch-panel gluing equipment at the Dongguan plant and developed second-generation equipment, won the 16th SME Innovation Research Award for an optical-grade touch-panel bonding process, and applied for 18 patents including TP equipment and laminating processes; in 2010 it launched a high-refractive-index RI = 1.58 UV release adhesive for brightening film and flexible adhesive tape for flexible-display manufacturing; in 2011 it launched heat-curing UV release tape, UV glue for brightening film and optical-grade low-adhesion acrylic protective film for TP applications; in 2012 it launched OCA and explosion-proof film cutting technology and mass production, TP PU protective film with optical grade, fast exhaust and low adhesion, and applied UV release protective film to OGS chemical-resistant protection; and in 2013 it trial-ran a new protective-film coating foundry and developed antistatic UV release protective film and PU protective film. In 2014 the company mass-produced PU protective film and developed thermal Release Tape; in 2015 it mass-produced thermal Release Tape and LED manufacturing-process materials and developed a carrier film for automated continuous production; in 2016 it disposed of its investment in mainland China Suzhou Shanji Optoelectronics Technology Co., Ltd.; in 2017 it developed semiconductor packaging-process materials; in 2018 it mass-produced adhesive film for OLED sensor processes; and in 2019 it developed low-pigment transparent PI liquid and mass-produced semiconductor packaging-process materials. The company mass-produced wafer dicing materials in 2021, CP/FT test materials in 2022, BGBM wafer-grinding materials and advanced packaging materials for glass substrates in 2023, AI FT test materials and FT materials for AI applications in 2024 while completing and commencing a self-built semiconductor materials factory in Zhubei, and CP materials for AI applications and WLP (Wafer Level Packaging) warpage-control materials in 2025; it also participated in the Taiwan Semiconductor Exhibition in September 2024 and presented a FOPLP warpage-control solution at Touch Taiwan in April 2025.
Exhibits
Alliance Material Co., Ltd. supplies optical films, LED process films, semiconductor process films, functional materials and adhesive tapes, provides OCA cutting processing and customized cutting and processing for optical and industrial film used in fields including semiconductor advanced processes such as Chip on Glass (COG), and offers CNC, wafer cutting, FT special-shape cutting, precision die cutting, lamination, slitting, cut-and-roll and multilayer film composite processing, with material consulting intended to help customers select suitable materials and shorten product development time. Its processing capabilities include precision coating for Optical Clear Adhesive (OCA), optical film and semiconductor advanced-process tape and materials at 1300mm width and 5um ~500um thickness; cut-and-roll processing for industrial tape, black and white tape, co-extrusion protective film, release paper and release film at Min:2mm Max:1200mm øMax400mm with 0.2mm accuracy; slitting and rewinding for industrial tape, black and white tape, optical adhesive, protective film, gloss film, diffusion sheet and reflective sheet at Min:15mm Max:1500mm øMax740mm with 0.1mm accuracy; coil processing for industrial tape, black and white tape, optical film, protective film, gloss enhancement film, diffusion sheet and reflective sheet at Min:15mm Max:1200mm øMax500mm with 0.1mm accuracy; and die cutting for industrial tape, black and white tape, protective film, gloss enhancement film, diffusion film and reflective film at 310mm * 310mm with 0.1mm / 0.2mm accuracy, including roll-shaped finished products for shipment when used with a backlight automatic film machine. Backside Grinding & Backside Metallization Tape products include BGT-001 at 120um PET with 200 gf/25mm before UV, Excellent TTV (≤3 um) and easy residue-free peeling; BGT-002 at 170um PO with 240 gf/25mm before UV; BGT-003 at 130um PET, UV type, 1800 gf/25mm before UV and < 30 gf/25mm after UV with Excellent TTV (≤3 um) and residue-free UV release; BGT-004 at 180um PO, UV type, 1800 gf/25mm before UV and < 30 gf/25mm after UV; BGT-005 at 330um PET, UV type, ≧800 gf/25mm before UV and ≦100 gf/25mm after UV with BGBM Process, anti-warpage, Excellent TTV (≤3 um), heat resistance and chemical resistance; BGT-006 at 380um PO, UV type, ≧600 gf/25mm before UV and ≦150 gf/25mm after UV; and BGT-007 at 320um PET with JC-730, ≧1600 and ≦100 listed in its product data. Additional grinding tape products include BGT-008 at 210um composites, UV type, ≧1000 gf/25mm before UV and ≦30 gf/25mm after UV for Micro (<40um) and Low Bump (<75um) Wafer Thinning, with filling property, bonding at low Temp. (60°C), anti-warpage, Excellent TTV (≤3 um) and residue-free UV release; BGT-009 at 450um composites with 40 gf/25mm before UV for Middle Bump (75~150um) Wafer Thinning, filling property, bonding at low Temp. (60~70°C), anti-warpage, Excellent TTV (≤3 um) and easy residue-free peeling; BGT-010 at 300um composites with 150 gf/25mm before UV for Middle Bump (75~150um) Wafer Thinning, filling property, bonding at low Temp. (40~60°C), anti-warpage, Excellent TTV (≤3 um) and easy residue-free peeling (40~60℃); and BGT-013 at 115um PO, UV type, > 800 gf/25mm before UV and < 30 gf/25mm after UV for Thin Wafer Grinding, with anti-warpage, Excellent TTV (≤3 um), and UV release without residue and damage. The Clean Pad range includes CP Series with >98% yield, 100,000 life time, <5um wear out and <0.5% O/S rate, with Effective Cleaning, Improve Test Yield and Needle Shape Protection features, and FT Series with >98% yield, >300 life time, <5um wear out and <0.5% O/S rate. Release Layer for Laser debond products include colorless Thor-100 with 5±2% solid content, 100℃ curing condition and <100 cps viscosity, black Thor-200A with 8±2% solid content, 240℃ curing condition and <100 cps viscosity, and black Thor-200B with 15±2% solid content, 240℃ curing condition and <100 cps viscosity, all listed for Laser debonding; the Colorless Polyamic acid product JC-730 lists 12±2% solid content, 300 cps viscosity, light yellow color, high clarity, heat resistance, chemical resistance, flexibility and a low yellow index. Balanced Film products include BF Series at 150um thickness, 470mm width, 100M length and 700 gf/25mm adhesion with Warpage Control, Thermal Stability, Chemical Resistance and Wide Applicability, and CR Series at 145um thickness, 470mm width, 100M length and 1000 gf/25mm adhesion. Molding Release Film products include MRF-001 at 48um thickness, 16 kgf/mm2 tensile strength, 90% elongation and <1011 Ω/□ impedance with wrinkleless and antistatic performance, burr prevention, residue-free release, heat resistance at 150~180℃ and no oozing when molding, plus MRF-002 at 63um thickness.
Capabilities and products
- probe card clean sheets
- FT test clean pads
- semiconductor molding release film
- BGBM tape for wafer grinding
- warpage-control and carrier films
- thermal/UV/laser/cool de-bonding materials
- acid-, chemical-, and high-temperature-resistant adhesive materials
- custom cutting of optical and industrial films
- film slitting and rewinding
- film lamination and die cutting
- mass production of CoWoS test materials
- mass production of wafer dicing materials