At a glance
| Booth | L0810 |
| Country | TW |
| Website | www.amtc.tw |
Company profile
AG MATERIALS TECHNOLOGY CO., LTD. was founded in September 2018 by a team of semiconductor professionals with extensive experience and focuses on semiconductor equipment, metal-material development, and backside grinding and backside metallization (BGBM) for semiconductor manufacturing processes. Its principal offerings include semiconductor equipment, wafer BGBM services, indium-sheet metal thermal interface material (Metal TIM), and related agency and trading services. The company identifies a 2,550-square-meter Hsinchu Science Park plant and an 8,500-square-meter Taichung plant, while listing monthly capacity of 10 to 20 semiconductor-equipment units and 20K BGBM wafers on an approximately 8-inch-equivalent basis. Its stated vision is to be a navigator in electronic metal materials and thermal solution systems, and it describes continuous R&D investment since its founding, establishment of an Innovation Center, and collaboration with NTU, NTHU, and NCTU on advanced technologies. For quality and production management, the company says it tightly controls steps from materials through production and has used ERP and real-time SFT systems from the beginning so clients can track product status. Its client-first mission emphasizes innovation, process improvement, reliable delivery, and quality outcomes driven by customer needs.
Exhibits
AG MATERIALS TECHNOLOGY CO., LTD. provides BGBM processing that optimizes grain size and stress at multi-metal interfaces and offers conventional coatings of titanium (Ti), nickel (Ni), silver (Ag), aluminum (Al), copper (Cu), and tin (Sn). The company states that it holds exclusive patents for nano-twinned metal deposition and provides nano-twinned silver (Ag), copper (Cu), and copper-silver (Cu-Ag) alloy coating services. For standard 6-inch and 8-inch silicon wafers, its grinding technology reaches a minimum thickness of 3 mil, while silicon carbide (SiC) wafers can be thinned to between 3 and 6 mil depending on requirements. Its BGBM metal options include Ti, Ni, Al, Sn, Cu, and Ag, and the process portfolio includes thinning, multi-layer metal coating, backside tin (Sn) coating, and nano-twin backside coating technology. The semiconductor automated optical inspection (AOI) equipment uses machine-vision technology with high-precision illumination, highly automated robotic handling, high-resolution cameras, high-speed computing chips, and AI algorithms to detect dimensional errors, foreign matter, and poor soldering. The AOI products are applied mainly to IC-packaging wafer and die inspection and provide both macro and micro inspection capabilities, with the company describing high inspection accuracy and efficiency as a way to reduce manual labor and increase production efficiency. Its indium-sheet thermal interface material is described as a fluxless indium TIM, with the fluxless approach intended to avoid bubble problems during TIM material bonding. The company's listed product scope therefore spans wafer backside grinding and metallization, SiC wafer thinning, indium-sheet Metal TIM, and semiconductor AOI equipment for semiconductor manufacturing and packaging-related applications. Across its BGBM capability, backside thinning is paired with metal deposition options for both standard silicon and SiC wafer requirements, linking thickness reduction with the listed Ti, Ni, Al, Sn, Cu, and Ag metallization choices.
Capabilities and products
- wafer backside grinding and metallization (BGBM)
- 6/8-inch silicon-wafer thinning to 3 mil
- SiC wafer thinning to 3–6 mil
- Ti/Ni/Ag/Al/Cu/Sn backside metallization
- nano-twinned Ag/Cu/Cu-Ag coating
- semiconductor AOI equipment
- indium-sheet Metal TIM