At a glance
| Booth | L0810 |
| Country | TW |
| Website | www.amtc.tw |
Company profile
Ag Materials Technology Co., Ltd. was established in September 2018 as an investment by a team with semiconductor expertise and extensive experience. It focuses mainly on the development of semiconductor equipment and metal materials, and its principal products are semiconductor equipment, wafer backside grinding and metallization (BGBM), and related agency and trading services. Basic information is as follows: 1. Established: September 2018 2. Address: 4F, No. 9, Lixing 5th Road, Hsinchu Science Park, Taiwan 3. Plants: a. Hsinchu Science Park plant - 2,550 m² b. Taichung Tanzih Science Park plant - 8,500 m² 4. Capital: NTD 280 million 5. Number of employees: approximately 70 6. Capacity: a: semiconductor equipment 10-20 units/month b: backside grinding and metallization (BGBM) 20K wafers/month (8-inch equivalent) c: indium metal thermal interface material (Metal TIM)
Capabilities and products
- wafer backside grinding and metallization (BGBM)
- indium metal thermal interface materials